Display; Memory; Storage; Bios - Clevo N850HP6 User Manual

Specifications

Core Logic

Mobile Intel® HM175 Express Chipset

Display

15.6" (39.62cm), 3.2 mm, FHD (1920 *
1080),16:9 Backlit Panel

Memory

Dual Channel DDR4
Two 260 Pin SO-DIMM Sockets
Supporting DDR4 2400 MHz Memory
Modules (real operational frequency
depends on the FSB of the processor)
Memory Expandable up to 32GB
(maximum), Compatible with 4GB/8GB/
16GB Modules
Supports XMP 2666MHz (XMP is
processor dependent and works in dual
channel)
D
D - 2 Specifications

SO-DIMM Memory Types
All SO-DIMM memory modules installed in the
system should be identical (the same size and
brand) in order to prevent unexpected system
behavior.
Don't mix SO-DIMM memory module sizes
and brands in order to prevent system prob-
lems.

Storage

One Changeable 2.5" 9.5mm / 7mm (h)
Hard Disk Drives (HDD) / Solid State
Drives (SSD) with SATA Interface
One M.2 2280 SSDs with SATA Interface
OR PCIe Gen 3 x4 Interface (Factory
Option), Auto Detection

BIOS

One 64Mb SPI Flash ROM
AMI BIOS

Audio

High Definition Audio
Built-In Array Microphone
2 Built-In Speakers
Sound Blaster™ Cinema 3
Keyboard & Pointing Device
Full Size White LED Illuminated
Keyboard with Numeric Pad (Factory
Option)
Full Size Colored RGB LED Illuminated
Keyboard with Numeric Pad (Factory
Option)
Built-In TouchPad with Microsoft Multi
Gesture & Scrolling Functionality

Indicators

LED Indicators - Power/Suspend,
Battery, Airplane Mode, HDD, Camera

Interface

One USB 2.0 Port
Two USB 3.0 (USB 3.1 Gen 1) Ports (Type-A)
One USB 3.0 (USB 3.1 Gen 1) Port (Type-C)
See over