JVC DR-MV2SEU Service Manual page 6

1.2.4.1.3 With Soldering Iron:
(1) Using desoldering braid, remove the solder from all pins of
the flat pack-IC. When you use solder flux which is applied
to all pins of the flat pack-IC, you can remove it easily. (Fig.
3)
Flat Pack-IC
(2) Lift each lead of the flat pack-IC upward one by one, using
a sharp pin or wire to which solder will not adhere (iron
wire). When heating the pins, use a fine tip soldering iron
or a hot air desoldering machine. (Fig. 4)
Fine Tip
Soldering Iron
(3) Bottom of the flat pack-IC is fixed with glue to the CBA;
when removing entire flat pack-IC, first apply soldering iron
to center of the flat pack-IC and heat up. Then remove
(glue will be melted). (Fig. 6)
(4) Release the flat pack-IC from the CBA using tweezers.
(Fig. 6)
1-6 (No.YD087)
Desoldering Braid
Soldering Iron
Fig.3
Sharp
Pin
Fig.4
1.2.4.1.4 With Iron Wire:
(1) Using desoldering braid, remove the solder from all pins of
the flat pack-IC. When you use solder flux which is applied
to all pins of the flat pack-IC, you can remove it easily. (Fig.
3)
(2) Affix the wire to a workbench or solid mounting point, as
shown in Fig. 5
(3) While heating the pins using a fine tip soldering iron or hot
air blower, pull up the wire as the solder melts so as to lift
the IC leads from the CBA contact pads as shown in Fig. 5
(4) Bottom of the flat pack-IC is fixed with glue to the
when removing entire flat pack-IC, first apply soldering iron
to center of the flat pack-IC and heat up. Then remove
(glue will be melted). (Fig. 6)
(5) Release the flat pack-IC from the CBA using tweezers.
(Fig. 6)
Note:
When using a soldering iron, care must be taken to en-
sure that the flat pack-IC is not being held by glue. When
the flat pack-IC is removed from the CBA, handle it gen-
tly because it may be damaged if force is applied.
To Solid
Mounting Point
CBA
Tweezers
Hot Air Blower
or
Iron Wire
Soldering Iron
Fig.5
Fine Tip
Soldering Iron
Flat Pack-IC
Fig.6
CBA;