Package Related Soldering Information - Philips Universal Serial Bus ISP1122 Specification Sheet

Philips Semiconductors

18.4 Package related soldering information

9397 750 07002
Product specification
Table 35: Suitability of IC packages for wave, reflow and dipping soldering methods
Mounting Package
Through-hole DBS, DIP, HDIP, SDIP, SIL suitable
mount
Surface mount BGA, LFBGA, SQFP,
TFBGA
HBCC, HLQFP, HSQFP,
HSOP, HTQFP, HTSSOP,
SMS
PLCC
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
[1] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal
or external package cracks may occur due to vaporization of the moisture in them (the so called
popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated
Circuit Packages; Section: Packing Methods .
[2] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the
printed-circuit board.
[3] These packages are not suitable for wave soldering as a solder joint between the printed-circuit board
and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top
version).
[4] If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[5] Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger
than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[6] Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Rev. 03 — 29 March 2000
Soldering method
Wave
not suitable
not suitable
[4]
, SO, SOJ suitable
not recommended
not recommended
ISP1122
USB stand-alone hub
[1]
Reflow
[2]
suitable
[3]
suitable
suitable
[4] [5]
suitable
[6]
suitable
© Philips Electronics N.V. 2000. All rights reserved.
Dipping
suitable
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