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NXP Semiconductors
14. Package outline
SO8: plastic small outline package; 8 leads; body width 3.9 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
UNIT
A
1
max.
0.25
mm
1.75
0.10
0.010
inches
0.069
0.004
Notes
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
OUTLINE
VERSION
SOT96-1
Fig 14. Package outline SOT96-1 (SO8)
CBTD3306
Product data sheet
D
y
Z
8
pin 1 index
1
e
b
A
A
b
c
2
3
p
1.45
0.49
0.25
0.25
1.25
0.36
0.19
0.057
0.019
0.0100
0.01
0.049
0.014
0.0075
IEC
JEDEC
076E03
MS-012
All information provided in this document is subject to legal disclaimers.
c
5
A
2
A
1
4
w
M
p
0
2.5
scale
(1)
(2)
D
E
e
H
E
5.0
4.0
6.2
1.27
4.8
3.8
5.8
0.20
0.16
0.244
0.05
0.19
0.15
0.228
REFERENCES
JEITA
Rev. 8 — 1 May 2012
Dual bus switch with level shifting
E
A
H
E
Q
(A )
3
θ
L
p
L
detail X
5 mm
L
L
Q
v
p
1.0
0.7
1.05
0.25
0.4
0.6
0.039
0.028
0.041
0.01
0.016
0.024
EUROPEAN
PROJECTION
CBTD3306
SOT96-1
X
v
M
A
A
(1)
θ
w
y
Z
0.7
0.25
0.1
o
0.3
8
o
0
0.028
0.01
0.004
0.012
ISSUE DATE
99-12-27
03-02-18
© NXP B.V. 2012. All rights reserved.
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