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NXP Semiconductors
13. Package outline
SO24: plastic small outline package; 24 leads; body width 7.5 mm
y
Z
24
pin 1 index
1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
UNIT
A
1
max.
0.3
2.65
mm
0.1
0.012
0.1
inches
0.004
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
OUTLINE
VERSION
SOT137-1
Fig 8. Package outline SOT137-1 (SO24)
CBT3384_6
Product data sheet
D
e
0
A
A
b
c
2
3
p
2.45
0.49
0.32
0.25
2.25
0.36
0.23
0.096
0.019
0.013
0.01
0.089
0.014
0.009
IEC
JEDEC
075E05
MS-013
c
13
12
w
M
b
p
5
scale
(1)
(1)
D
E
e
H
E
15.6
7.6
10.65
1.27
15.2
7.4
10.00
0.61
0.30
0.419
0.05
0.60
0.29
0.394
REFERENCES
JEITA
Rev. 06 — 2 November 2009
10-bit bus switch with 5-bit output enables
E
H
E
Q
A
2
A
1
L
p
L
detail X
10 mm
L
L
Q
v
p
1.1
1.1
1.4
0.25
0.4
1.0
0.043
0.043
0.055
0.01
0.016
0.039
EUROPEAN
PROJECTION
CBT3384
SOT137-1
A
X
v
A
M
A
(A )
3
(1)
w
y
Z
0.9
0.25
0.1
o
0.4
8
o
0
0.035
0.01
0.004
0.016
ISSUE DATE
99-12-27
03-02-19
© NXP B.V. 2009. All rights reserved.
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