Philips CBT3384 Product Data Sheet page 9

NXP Semiconductors
SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm
y
Z
24
pin 1 index
1
DIMENSIONS (mm are the original dimensions)
A
UNIT A
1
max.
0.21
mm
2
0.05
Note
1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.
OUTLINE
VERSION
SOT340-1
Fig 9. Package outline SOT340-1 (SSOP24)
CBT3384_6
Product data sheet
D
e
A A b c
2 3 p
1.80 0.38 0.20
0.25
1.65 0.25 0.09
REFERENCES
IEC JEDEC
MO-150
c
13
A
2
12
w
M
b
p
0 2.5
scale
(1) (1)
D E e H
E
8.4 5.4 7.9
0.65
8.0 5.2 7.6
JEITA
Rev. 06 — 2 November 2009
10-bit bus switch with 5-bit output enables
E
H
E
Q
(A )
A
1
L
p
L
detail X
5 mm
L L Q v
p
1.03 0.9
1.25 0.2
0.63 0.7
EUROPEAN
PROJECTION
CBT3384
SOT340-1
A
X
v
A
M
A
3
(1)
w y Z
o
0.8
8
0.13 0.1
o
0.4
0
ISSUE DATE
99-12-27
03-02-19
© NXP B.V. 2009. All rights reserved.
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