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−B−
4
S
1
2
3
−T−
SEATING
PLANE
G
D
3 PL
0.13 (0.005)
VARIABLE
CONFIGURATION
ZONE
L
M
F
VIEW W−W
1
NTB30N20
PACKAGE DIMENSIONS
D
CASE 418B−04
ISSUE J
C
E
A
K
J
H
T
B
M
M
N
R
L
M
F
VIEW W−W
2
SOLDERING FOOTPRINT*
8.38
0.33
10.66
0.42
17.02
0.67
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
2
PAK
NOTES:
1. DIMENSIONING AND TOLERANCING
2. CONTROLLING DIMENSION: INCH.
V
3. 418B−01 THRU 418B−03 OBSOLETE,
W
W
P
U
L
M
F
VIEW W−W
3
1.016
5.08
0.04
0.20
3.05
0.12
mm
SCALE 3:1
inches
7
PER ANSI Y14.5M, 1982.
NEW STANDARD 418B−04.
INCHES
MILLIMETERS
DIM
MIN
MAX
MIN
MAX
A
0.340
0.380
8.64
9.65
B
0.380
0.405
9.65
10.29
C
0.160
0.190
4.06
4.83
D
0.020
0.035
0.51
0.89
E
0.045
0.055
1.14
1.40
F
0.310
0.350
7.87
8.89
G
0.100 BSC
2.54 BSC
H
0.080
0.110
2.03
2.79
J
0.018
0.025
0.46
0.64
K
0.090
0.110
2.29
2.79
L
0.052
0.072
1.32
1.83
M
0.280
0.320
7.11
8.13
N
0.197 REF
5.00 REF
P
0.079 REF
2.00 REF
R
0.039 REF
0.99 REF
S
0.575
0.625
14.60
15.88
V
0.045
0.055
1.14
1.40
STYLE 2:
PIN 1. GATE
2. DRAIN
3. SOURCE
4. DRAIN
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