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Philips Semiconductors
HF amplifier modules
SOLDERING
The indicated temperatures are those at the solder
interfaces.
Advised solder types are types with a liquidus less than or
equal to 210 C.
Solder dots or solder prints must be large enough to wet
the contact areas.
Soldering can be carried out using a conveyor oven, a hot
air oven, an infrared oven or a combination of these ovens.
A double reflow process is permitted.
Hand soldering must be avoided because the soldering
iron tip can exceed the maximum permitted temperature of
250 C and damage the module.
The maximum allowed temperature is 250 C for
5 seconds.
The maximum ramp-up is 10 C per second.
The maximum cool-down is 5 C per second.
Cleaning
The following fluids may be used for cleaning:
Alcohol
Bio-Act (Terpene Hydrocarbon)
Acetone.
Ultrasonic cleaning should not be used since this can
cause serious damage to the product.
1998 May 13
300
handbook, halfpage
T
( C)
200
100
0
0
1
Fig.17 Recommended reflow temperature profile.
8
Product specification
BGY148A; BGY148B
MGM159
2
3
4
t (min)
5
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