Sony HBD-E780W Service Manual page 41

THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
For Printed Wiring Boards.
Note:
• X : Parts extracted from the component side.
• Y : Parts extracted from the conductor side.
• : Internal component.
f
• : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen
(Conductor Side) from the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Component Side) the parts face are indicated.
Caution:
Pattern face side: Parts on the pattern face side seen
(SIDE B) from the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(SIDE A) the parts face are indicated.
• MB-141 board is multi-layer printed board. However, the
patterns of intermediate-layers have not been included in
this diagrams.
• Abbreviation
AUS : Australian model
CND : Canadian model
EA : Saudi Arabia model
IT : Italian model
SP : Singapore model
TH : Thai model
TW : Taiwan model
• Indication of transistor.
C
Q
These are omitted.
B E
Q
B C E
These are omitted.
• Lead layouts
Lead layout of conventional IC CSP (Chip Size Package)
* Replacement of IC106, IC107, IC206, IC207 on the MB-141 board
used in this unit requires a special tool.
Note: When the AMP board is replaced, spread the compound referring
to "NOTE OF REPLACING THE IC3100 AND IC3200 ON
THE AMP BOARD AND THE COMPLETE AMP BOARD"
on servicing notes (page 9).
HBD-E780W/E980W/E985W
For Schematic Diagrams.
Note:
• All capacitors are in μF unless otherwise noted. (p: pF) 50
WV or less are not indicated except for electrolytics and
tantalums.
• All resistors are in Ω and 1/4 W or less unless otherwise
specifi ed.
• : internal component.
f
• C : panel designation.
Note: Note:
The components identi- Les composants identifi és
fi ed by mark 0 or dotted par une marque 0 sont
line with mark 0 are criti- critiques pour la sécurité.
cal for safety. Ne les remplacer que par
Replace only with part une pièce portant le nu-
number specifi ed. méro spécifi é.
• A : B+ Line.
• B : B– Line.
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : TUNER
* : Impossible to measure
• Voltages are taken with VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal production
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F : AUDIO
: VIDEO
E
: DISC PLAY
J
L : USB
: LAN
d
: WIRELESS LAN
G
f : TUNER
• Abbreviation
AUS : Australian model
CND : Canadian model
EA : Saudi Arabia model
IT : Italian model
SP : Singapore model
TH : Thai model
surface TW : Taiwan model
• The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
from that of conventional IC.
* Replacement of IC106, IC107, IC206, IC207 on the MB-141 board
used in this unit requires a special tool.
Note: When the AMP board is replaced, spread the compound referring
to "NOTE OF REPLACING THE IC3100 AND IC3200 ON
THE AMP BOARD AND THE COMPLETE AMP BOARD"
on servicing notes (page 9).
• Circuit Boards Location
NISECON board
FL board
POWER_SIRCS board
TOUCH board
37 37
HBD-E780W/E980W/E985W
WS board
TUNER board
MB-141 board
COMPONENT board
(US, CND, AUS, SP, TW, TH)
SPEAKER 4P board
wireless LAN card
AMP board
(WLC1) (E780W/E980W)
USB board
switching regulator
(SWR1)
• Abbreviation
AUS : Australian model
CND : Canadian model
SP : Singapore model
TH : Thai model
TW : Taiwan model
Ver. 1.2