Toshiba MCY-MHP0404HS-E Service Manual page 173

AMP Air Conditioning
Comp-IPDU P.C.board
(43H69013)
① Card spacer
Push this in the direction of the
arrow to unlock and remove the
P.C. board assembly.
P.C.board
⑥ Screw (M3x20)
Used to secure the IGBT and rectifiers
Screw tightening torque: 0.55 ±0.1 N m
Single-touch spacer
②
Screw
③
(M4x14)
First remove the
screws ③, and then
remove the P.C.
board assembly.
Evenly apply the silicon heat sink compound to the heat-sink
surfaces of the IPM , IGBT and rectifier devices.
Caution: It must be ensured that no dust, etc. adheres to the
heat-sink surfaces of the IPM , IGBT and rectifier devices.
Standard for silicone heat sink compound:
Manufacturer: Shin-Etsu Chemical Co., Ltd.
Type: G746 or G747
172
④ Screw (M4x8)
Used to secure the lead wire
Screw tightening torque: 1.2 ±0.1 N m
① Card spacer
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② Single-touch spacer
③ Screw (M4x14)
⑤ Screw (M4x15)
Used to secure the rectifiers
Screw tightening torque: 1.2 ±0.1 N m
④ Screw (M4x8)
Used to secure the lead wire
Screw tightening torque: 1.2 ±0.1 N m
⑤ Screw (M4x15)
Used to secure the rectifiers
Screw tightening torque: 1.2 ±0.1 N m