Amp Board (Component Side) - Sony HCD-X1V Service Manual

HCD-X1V
• Semiconductor
Location
Ref. No. Location
D3551 A-6
D3552 B-6
IC3010 G-3
IC3020 E-3
IC3030 C-3
IC3050 G-2
IC3051 H-2
IC3100 H-5
IC3150 G-5
IC3200 F-5
IC3250 E-5
IC3300 C-5
IC3350 B-5
IC3500 C-2
Q3551 A-7
HCD-X1V
7-26. PRINTED WIRING BOARD – AMP Board (Component Side) –
1 2 3
A
AMP BOARD
(COMPONENT SIDE)
B
24
C3500
IC3500
25
R3075
C
36
37
R3037
D
R3072
J
R3070
MAIN
R3069
BOARD
CN507 R3067
(Page 50)
R3064
R3063
24
25
E
36
37
F
(CHASSIS)
R3051
1 5
3 4
G
24
25
36
37
H FB3051
R3054
L3053
5 4
IC3051
1 3
X3051
I
• See page 37 for Circuit Boards Location.
4 5
(CHASSIS)
R3354
C3034
13
R3351
12
R3352
C3350
R3301
R3302
1
48
C3040
R3307
C3300
C3024
13
R3251
12
R3252
C3250
R3201
1
R3202
48
C3030
C3200
C3014
13
C3150
R3151
12
R3152
R3101
1
R3102
48
C3020
C3100
(CHASSIS)
58 58
: Uses unleaded solder.
6 7 8
Q3551
E
C3801
9 10
C3376
C3377
C3327
C3326
C3324
C3325
C3277
C3276
C3274
C3275
C3225
C3224
C3226
C3227
C3177
C3176
C3174
C3175
L3000
11
1-870-021- (11)