Toshiba MCY-MHP0404HS(J)-E Service Manual page 176

Exchange ④Current Fuse
Upper stage
fan motor
③ Card spacer
Push this in the direction of the
arrow to unlock and remove the
P.C. board assembly.
Evenly apply the silicon heat sink compound to the heat-sink
surfaces of the IPM and rectifier devices.
Caution: It must be ensured that no dust, etc. adheres to the
heat-sink surfaces of the IPM and rectifier devices.
Standard for silicone heat sink compound:
Manufacturer: Shin-Etsu Chemical Co., Ltd.
Type: G746 or G747
175
Lower stage
fan motor
③ Card spacer
② Screw (M3x20)
Used to secure the
rectifier and IPM devices
Screw tightening
torque:0.55±0.1N/m
Upper stage
fan motor
Lower stage
fan motor