SUSS MA6 User Manual page 18

O
1
PERATION OF THE
201 POWER SWITCH ELECTRONIC
Start the MA6 by turning the switch shortly clockwise
to ON and release. Stop the MA6 also by turning the
switch shortly clockwise to OFF and release.
202 COMPRESSED AIR gauge
The machine operates properly when the pressure is
set to 5 bar. The air pressure is controlled by a regu-
lator adjusted by a service engineer.
203 NITROGEN gauge
N gas is used to cool the exposure lamp, establish
2
a nitrogen "pillow" under the wafer (hard contact ex-
posure), purge the wafer exposure area, and to break
residual vacuum after vacuum contact and other sec-
ondary functions. At 1 bar N
engineer) the machine operates properly.
204 VACUUM gauge
The vacuum supplied to the machine should be
-0.8 bar related to normal air pressure what means
0.2 bar absolute pressure.
205 VACUUM CHAMBER gauge
(with regulator)
The gauge indicates the vacuum level in the vacuum
chamber during exposure. The vacuum level is ad-
justed opening a N
strictor LOW VACUUM ADJUSTMENT below the
gauge counter clockwise. Close it by turning the
knob clockwise.
206 VACUUM SEAL (with regulator)
The required pressure to inflate the rubber lip (neces-
sary to create the vacuum chamber) should be set to
a value p = 0.1 to 0.2 bar for standard thickness wa-
fer according SEMI specification. Thicker wafer might
need a slightly higher pressure. A improper high pres-
sure could create an overcurrent error.
207 WEC - PRESSURE gauge (with regulator)
To perform the wedge error compensation the wafer
must be pressed with a defined force against the
mask. The WEC-pressure is used to compensate the
higher gravitation force of a bigger chuck. The WEC-
pressure also must be changed proportional to a
change of the wafer area. The air pressure for the
WEC-head can be set in accordance with your pro-
cess requirements (range 0.2 and 1.0 bar). This is
done with the corresponding regulator below the
gauge.
10
M
ACHINE
(adjusted by a service
2
leak valve. Open the vacuum re-
2
208 LCD-display
This user interface displays instructions, confirma-
tions and other messages.
209 CONTACT indicator
That lamp lights whenever mask and wafer or two
wafers for bond alignment are in contact. If you move
the wafer manually further up, this indicator starts
flashing.
210 ILLUMINATION switch
The illumination is supplied either to the TSA or BSA
microscope by way of fiber optic light cables from a
light source. BSA illumination is selected in the BSA/
IR position.
211 BSA/IR microscope illumination
The potentiometers labeled LEFT and RIGHT realize
the fine illumination adjustment for the two objectives
of the BSA microscope (BSA/IR is selected).
212 TSA microscope illumination
The fine illumination adjustment is performed with the
TSA adjustment knob. For the coarse adjustment use
control 501 (see chapter 3.2.5 Lamp house controls).
213 MAGNIFICATION BSA switch
Select between low and high magnification.
214 SPLITFIELD switch
With the rotary switch in middle position, the left/right
objective image is shown on the left/right half side of
the video monitor simultaneously. With the switch in
right or left position, the right/left objective image is
displayed on the whole video monitor. Only for the
microscope type M3xx this switch must be in left po-
sition and the splitfield must be selected at the micro-
scope itself.
215 TOP SUBSTRATE LEFT/RIGHT
In order to improve the image of the mask structures
displayed on the video monitor only minor focus ad-
justments are necessary. The two potentiometers in-
dividually control the fine focus of the BSA and TSA
microscope objectives at the upper focus plane.
216 BOTTOM SUBSTRATE LEFT/RIGHT
In order to improve the image of the wafer structures
displayed on the video monitor only minor focus ad-
justments are necessary. The two potentiometers in-
dividually control the fine focus of the BSA and TSA
microscope objectives at the lower focus plane.
MA6 / MA8 - 1. Operation of the Machine - Rev.05 07-06