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SPP-904
SERVICE MANUAL
E Model
SPECIFICATIONS
CORDLESS TELEPHONE
MICROFILM

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Summary of Contents for Sony SPP-904

  • Page 1 SPP-904 SERVICE MANUAL E Model SPECIFICATIONS CORDLESS TELEPHONE MICROFILM...
  • Page 2: Table Of Contents

    .............. 7 AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH ELECTRICAL ADJUSTMENTS SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB- Base Unit ................. 10 LISHED BY SONY.
  • Page 3: General

    SECTION 1 This section is extracted from instruction manual. GENERAL...
  • Page 5: Disassembly

    SECTION 2 DISASSEMBLY Note: Follow the disassembly procedure in the numerical order given. HAND CABINET (REAR) 5 Remove the hand cabinet (rear) to direction of the arrow B . 4 claw 3 two claws 2 two screws (BTP2.6 × 12) 1 Remove the battery case lid to direction of the arrow A .
  • Page 6 BASE CABINET 2 claw 1 four screws (BTP2.6 × 10) 3 cabinet (lower) 2 claw BASE MAIN BOARD 3 cabinet (upper) 6 base main board 4 four screws (BTP2.6 × 8) 5 washer (SP) 7 harness 2 two charge springs (U) 1 two screws (BTP2.6 ×...
  • Page 7: Test Mode

    SECTION 3 TEST MODE BASE UNIT [Setting the Test Mode] [HANDSET LOCATOR] 1. Power on with pressing the key for two seconds. 2. CHARGE and LINE LEDs turn on for 50 msec, and the test mode is set. [TONE] [DIAL MODE] switch If setting the test mode with the status that position is selected at , the unit cold stars next time when the...
  • Page 8 [Test Mode Execution] [HANDSET LOCATOR] Press the key to execute any of the following tests: Test Mode Step Name VCO/TX FREQ. ADJ TX MOD CHECK TX DATA RX SENS SQ SENS DTMF SINGLE TONE DTMF DUAL TONE DATA IN CHECK CHARGE CHECK DUPLEX Initial Channel of each step: 19CH...
  • Page 9 HANDSET [Setting the Test Mode] 1. Power on with press the key and the key simultaneously for one second. 2. It beeps confirm tone, and the test mode is set. [PGM] If the key is pressed, the unit cold starts next time when the power is turned on. [Releasing the Test Mode] To release the test mode, perform as follows: [FLASH, TALK]...
  • Page 10: Base Unit

    SECTION 4 ELECTRICAL ADJUSTMENTS 7. Check that the value of power meter is –5.5 dBm ± 1.5 dBm. 0 dBm = 0.775 V BASE UNIT 4. Modulation Sensitivity Adjustment Setting: • Make the set in test mode. (See page 7.) AF OSC –...
  • Page 11 6. Code Deviation Check Procedure: 1. Change the modulation of SSG to 1 kHz, ± 8 kHz deviation. Setting: 2. Connect a noise meter to the LINE jack (J1) on the BASE MAIN board. deviation meter 3. Adjust RT2 on the BASE MAIN board so that the value of noise meter becomes 265 mV ±...
  • Page 12 5. SQ Sensitivity Adjustment 6. DTMF Level Check Setting: Setting: noise meter 600 Ω TP (ANT) TP (GND) – LINE jack (J1) Carrier frequency: 902.952467 MHz Modulation: 1 kHz, ± 8 kHz deviation Output level: –113 dBm Procedure: 1. Connect a noise meter to the LINE jack (J1) on the BASE Procedure: MAIN board.
  • Page 13: Handset

    4. Modulation Sensitivity Adjustment HANDSET Setting: • Make the set in test mode. (See page 9.) AF OSC – TX Adjustments and Checks – TP (MIC+) 1. TX VCO Check – TP (MIC–) Setting: 1 kHz, 9 mV digital voltmeter deviation meter TP (TX VCO), TP (RX VCO) –...
  • Page 14 [VOL] 6. Code Deviation Check 4. Set the switch (S401) to position. Setting: 5. Adjust RT402 on the HAND MAIN board so that the value of noise meter becomes 115 mV ± 10 mV. deviation meter 3. Distortion and S/N Ratio Check Setting: TP (ANT) –...
  • Page 15 5. SQ Sensitivity Adjustment Setting: TP (ANT) TP (GND) Carrier frequency: 926.997467 MHz Modulation: 1 kHz, ± 8 kHz deviation Output level: –113 dBm Procedure: 1. Change the output level of SSG to –113 dBm. 2. Press the key to change the test mode step to SQ SENS. 3.
  • Page 17: Diagrams

    SPP-904 SECTION 5 DIAGRAMS B+ (+3V) DISCRI 5-1. BLOCK DIAGRAM – BASE UNIT Section – VOLTAGE 2nd MIXER, LIMITER AMP, DET, EXPANDER, COMPRESSOR, LIMITER 1st MIXER, VCO, PLL SYNTHESIZER AF AMP, SQUELCH CONTROL IC302 LINE EXPANDER TRANSFORMER QUAD COIL OUT LEVEL...
  • Page 18: Block Diagram - Handset Section

    SPP-904 L402 B+ (+3V) 5-2. BLOCK DIAGRAM – HANDSET Section – DISCRI EXPANDER, COMPRESSOR, LIMITER VOLTAGE IC403 2nd MIXER, LIMITER AMP, DET, 1st MIXER, VCO, PLL SYNTHESIZER S401 AF AMP, SQUELCH CONTROL IC502 IC401 RT402 EXPANDER H/M/L SP801 SPEAKER QUAD COIL...
  • Page 19: Note For Printed Wiring Boards And Schematic Diagrams

    5-3. NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS Note on Printed Wiring Board: Note on Schematic Diagram: • X : parts extracted from the component side. • All capacitors are in µF unless otherwise noted. pF: µµF • Y : parts extracted from the conductor side. 50 WV or less are not indicated except for electrolytics •...
  • Page 20: Printed Wiring Board - Base Rf Section

    5-4. PRINTED WIRING BOARD – BASE RF Section – BASE RF BOARD (COMPONENT SIDE) L351-357 L310 (PRINTED COIL) C375 C303 FT301 L355 C376 L356 L303 (SHIELD CASE) C315 C371 C368 C301 L301 R354 C372 L302 L354 C304 Q307 R351 R302 BASE MAIN BASE MAIN C307...
  • Page 21: Schematic Diagram - Base Rf Section

    SPP-904 5-5. SCHEMATIC DIAGRAM – BASE RF Section – • See page 28 for IC Block Diagram. (Page 23) (Page 23) (Page 23)
  • Page 22: Printed Wiring Board - Base Main Section

    SPP-904 5-6. PRINTED WIRING BOARD – BASE MAIN Section – • Semiconductor Location Ref. No. Location BASE MAIN BOARD LINE TRANSFORMER G-10 G-11 C-12 LINE B-11 D-11 E-12 E-11 – D-11 DC IN 9V FLASH B C E DIAL MODE...
  • Page 23: Schematic Diagram - Base Main Section

    SPP-904 5-7. SCHEMATIC DIAGRAM – BASE MAIN Section – • • See page 24 for Waveforms. See page 28 for IC Block Diagrams. BASE MAIN BOARD S Q S E N S I T I V I T Y T E L O U T L E V E L 1 .
  • Page 24: Printed Wiring Board - Hand Rf Section

    SPP-904 • Waveforms 5-8. PRINTED WIRING BOARD – HAND RF Section – – HAND MAIN Board – – BASE MAIN Board – 1 IC3 1 (OSC1) 1 IC401 1 (OSC1) HAND RF BOARD (COMPONENT SIDE) Q506 L551-557 C575 C503 (PRINTED COIL)
  • Page 25: Schematic Diagram - Hand Rf Section

    SPP-904 5-9. SCHEMATIC DIAGRAM – HAND RF Section – • See page 28 for IC Block Diagram. (Page 27) (Page 27) (Page 27)
  • Page 26: Printed Wiring Board - Hand Main Section

    SPP-904 5-10. PRINTED WIRING BOARD – HAND MAIN Section – • Semiconductor Location Ref. No. Location D401 D402 D-13 HAND MAIN BOARD (COMPONENT SIDE) D403 C-13 SP801 D404 C-13 D405 C-12 D406 C-12 D407 D-10 D408 D421 D422 Q421 Q401...
  • Page 27: Schematic Diagram - Hand Main Section

    SPP-904 5-11. SCHEMATIC DIAGRAM – HAND MAIN Section – • See page 24 for Waveforms. • See page 28 for IC Block Diagrams. HAND MAIN BOARD 1. 9 0 .7 2 .9 0. 7 0 . 7 0. 6 1 .7 1 2 1 1 10 3 .6...
  • Page 28 SPP-904 • IC Block Diagrams IC1 LA8633VU-TLM (BASE MAIN Board) IC302 M64884FP-C60J (BASE RF Board) IC403 LA8633VU-TLM (HAND MAIN Board) IC502 M64884FP-C60J (HAND RF Board) 16 15 17 16 15 14 VCO (RX) LOCK DETECTOR PHASE PULSE SUM AMP DETECTOR...
  • Page 29: Ic Pin Function Description

    5-12. IC PIN FUNCTION DESCRIPTION • BASE MAIN BOARD IC5 MB89173PF-G-256-BND (SYSTEM CONTROLLER) Pin No. Pin Name Description DTMF DTMF tone signal output terminal System reset signal input from the reset signal generator (Q9) “L”: reset RESET For several hundreds msec. after the power supply rises, “L” is input, then it changes to “H” 3, 4 MOD0, MOD1 Setting terminal for the CPU operational mode Fixed at “L”...
  • Page 30 • HAND MAIN BOARD IC404 MB89174PF-G-257-BND (SYSTEM CONTROLLER) Pin No. Pin Name Description DTMF DTMF tone signal output terminal Not used (open) System reset signal input from the reset signal generator (Q411) “L”: reset RESET For several hundreds msec. after the power supply rises, “L” is input, then it changes to “H” 3, 4 MOD0, MOD1 Setting terminal for the CPU operational mode Fixed at “L”...
  • Page 31: Exploded Views

    SECTION 6 EXPLODED VIEWS NOTE: • -XX and -X mean standardized parts, so they • Items marked “*” are not stocked since they may have some difference from the original are seldom required for routine service. Some one. delay should be anticipated when ordering •...
  • Page 32 (2) BASE UNIT SECTION supplied supplied supplied ANT1 (including z A) Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark 3-036-334-21 CABINET (LOWER) (BASE-U) 3-036-336-01 HOOK (U) * 52 A-3672-783-A BASE RF BOARD, COMPLETE 3-036-338-01 GUIDE (U), LIGHT * 53 A-3672-853-A BASE MAIN BOARD, COMPLETE 3-036-337-01 KEY (U), PAGE...
  • Page 33: Electrical Parts List

    SECTION 7 BASE MAIN ELECTRICAL PARTS LIST NOTE: • Due to standardization, replacements in the • Items marked “*” are not stocked since they The components identified by mark 0 or dotted line with mark are seldom required for routine service. parts list may be different from the parts speci- 0 are critical for safety.
  • Page 34 BASE MAIN Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark < DIODE > 1-216-845-11 METAL CHIP 100K 1/16W 1-216-837-11 METAL CHIP 1/16W 8-719-070-90 DIODE 1N4148 1-216-021-00 METAL CHIP 1/10W 8-719-110-83 DIODE HZ33-2 8-719-070-90 DIODE 1N4148 1-216-818-11 METAL CHIP 1/16W 8-719-980-67 LED MVR3338S (CHARGE) 1-216-821-11 METAL CHIP...
  • Page 35 BASE MAIN BASE RF Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark 1-216-825-11 METAL CHIP 2.2K 1/16W C311 1-162-920-11 CERAMIC CHIP 27PF 1-216-841-11 METAL CHIP 1/16W C312 1-131-712-11 CERAMIC CHIP 0.01uF 1-216-841-11 METAL CHIP 1/16W C314 1-131-712-11 CERAMIC CHIP 0.01uF 1-216-853-11 METAL CHIP...
  • Page 36 BASE RF HAND MAIN Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark C390 1-131-712-11 CERAMIC CHIP 0.01uF R344 1-216-803-11 METAL CHIP 1/16W C397 1-162-927-11 CERAMIC CHIP 100PF R348 1-216-864-11 METAL CHIP 1/16W C398 1-162-927-11 CERAMIC CHIP 100PF R351 1-216-809-11 METAL CHIP...
  • Page 37 HAND MAIN Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark C444 1-135-181-21 TANTALUM CHIP 4.7uF 6.3V < IC > C445 1-164-005-11 CERAMIC CHIP 0.47uF C446 1-131-712-11 CERAMIC CHIP 0.01uF IC401 8-759-375-39 IC MC3361CDR2 C447 1-164-489-11 CERAMIC CHIP 0.22uF IC403 8-759-641-08 IC LA8633VU-TLM...
  • Page 38 HAND MAIN HAND RF Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark R433 1-216-831-11 METAL CHIP 6.8K 1/16W < VARIABLE RESISTOR > R434 1-216-853-11 METAL CHIP 470K 1/16W R435 1-216-836-11 METAL CHIP 1/16W RT401 1-223-590-21 RES, ADJ, CARBON 220K RT402 1-223-589-11 RES, ADJ, CARBON 100K R436...
  • Page 39 HAND RF Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark C549 1-131-709-11 CERAMIC CHIP Q507 8-729-050-35 TRANSISTOR 2SC5065-Y (TE85R) C550 1-164-813-11 CERAMIC CHIP 15PF Q512 8-729-050-35 TRANSISTOR 2SC5065-Y (TE85R) C551 1-162-927-11 CERAMIC CHIP 100PF < RESISTOR > C553 1-131-712-11 CERAMIC CHIP 0.01uF...
  • Page 40 SPP-904 Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark 7-685-536-19 SCREW +BTP 2.6X12 TYPE2 N-S ************************************************************ ACCESSORIES & PACKING MATERIALS ******************************* 1-418-615-11 ADAPTOR, AC (AC-T127) 1-696-453-21 CORD (WITH MODULAR PLUG) (LINE) (22cm) 1-696-454-11 CORD (WITH MODULAR PLUG) (LINE)

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