Electrical Parts List - Sony HCD-FX80 Service Manual

HCD-FX80
Ver. 1.1
QQ
DMB10
3 7 63 1515 0
NOTE:
• Due to standardization, replacements in the
parts list may be different from the parts
specified in the diagrams or the components
used on the set.
• -XX and -X mean standardized parts, so they
may have some difference from the original
one.
• Items marked "*" are not stocked since they
are seldom required for routine service.
Some delay should be anticipated when
ordering these items.
• CAPACITORS
uF: µF
• COILS
uH: µH
Ref. No. Part No. Description
A-1110-958-A DMB10 BOARD, COMPLETE
**********************
< CAPACITOR >
C101 1-162-970-11 CERAMIC CHIP
C102 1-162-970-11 CERAMIC CHIP
C105 1-126-205-11 ELECT CHIP
C106 1-162-970-11 CERAMIC CHIP
C108 1-162-964-11 CERAMIC CHIP
C109 1-162-964-11 CERAMIC CHIP
C112 1-126-205-11 ELECT CHIP
C113 1-162-970-11 CERAMIC CHIP
C114 1-107-826-11 CERAMIC CHIP
C115 1-107-826-11 CERAMIC CHIP
TE
L 13942296513
C116 1-107-826-11 CERAMIC CHIP
C117 1-124-779-00 ELECT CHIP
C118 1-124-779-00 ELECT CHIP
C119 1-124-779-00 ELECT CHIP
C120 1-165-908-11 CERAMIC CHIP
C121 1-165-908-11 CERAMIC CHIP
C122 1-165-908-11 CERAMIC CHIP
C123 1-165-908-11 CERAMIC CHIP
C124 1-165-908-11 CERAMIC CHIP
C125 1-107-826-11 CERAMIC CHIP
C126 1-107-826-11 CERAMIC CHIP
C127 1-162-970-11 CERAMIC CHIP
C128 1-162-965-11 CERAMIC CHIP
C129 1-124-779-00 ELECT CHIP
C130 1-107-826-11 CERAMIC CHIP
C131 1-125-838-11 CERAMIC CHIP
C132 1-107-826-11 CERAMIC CHIP
C133 1-107-826-11 CERAMIC CHIP
C135 1-164-677-11 CERAMIC CHIP
C136 1-162-970-11 CERAMIC CHIP
C137 1-107-826-11 CERAMIC CHIP
C138 1-162-964-11 CERAMIC CHIP
C139 1-162-919-11 CERAMIC CHIP
C140 1-107-826-11 CERAMIC CHIP
C141 1-107-826-11 CERAMIC CHIP
www
C142 1-107-826-11 CERAMIC CHIP
C143 1-107-826-11 CERAMIC CHIP
C144 1-162-970-11 CERAMIC CHIP
C145 1-165-908-11 CERAMIC CHIP
.
C146 1-107-826-11 CERAMIC CHIP
96
http://www.xiaoyu163.com
SECTION 9

ELECTRICAL PARTS LIST

• RESISTORS
All resistors are in ohms.
METAL: Metal-film resistor.
METAL OXIDE: Metal oxide-film resistor.
F: nonflammable
• SEMICONDUCTORS
In each case, u: µ, for example:
uA. . : µA. .,
uPB. . : µPB. .,
uPD. . : µPD. .
• Abbreviation
CND: Canadian model.
Remark
0.01uF 10% 25V
0.01uF 10% 25V
47uF 20% 6.3V
0.01uF 10% 25V
0.001uF 10% 50V
0.001uF 10% 50V
47uF 20% 6.3V
0.01uF 10% 25V
0.1uF 10% 16V
0.1uF 10% 16V
0.1uF 10% 16V
10uF 20% 16V
10uF 20% 16V
10uF 20% 16V
1uF 10% 10V
1uF 10% 10V
1uF 10% 10V
1uF 10% 10V
1uF 10% 10V
0.1uF 10% 16V
0.1uF 10% 16V
0.01uF 10% 25V
0.0015uF 10% 50V
10uF 20% 16V
0.1uF 10% 16V
2.2uF 10% 6.3V
0.1uF 10% 16V
0.1uF 10% 16V
0.033uF 10% 16V
0.01uF 10% 25V
0.1uF 10% 16V
0.001uF 10% 50V
22PF 5% 50V
0.1uF 10% 16V
0.1uF 10% 16V
0.1uF 10% 16V
0.1uF 10% 16V
x ao u163
y
0.01uF 10% 25V
1uF 10% 10V
i
0.1uF 10% 16V
http://www.xiaoyu163.com
2 9
8
When indicating parts by reference number,
please include the board name.
The components identified by mark 0 or
dotted line with mark 0 are critical for safety.
Replace only with part number specified.
uPA. . : µPA. .,
Les composants identifiés par une marque 0
uPC. . : µPC. .,
sont critiques pour la sécurité.
Ne les remplacer que par une pièce portant le
numéro spécifié.
Ref. No. Part No. Description
C147 1-165-176-11 CERAMIC CHIP
C148 1-165-176-11 CERAMIC CHIP
C149 1-107-826-11 CERAMIC CHIP
C150 1-124-779-00 ELECT CHIP
C151 1-115-416-11 CERAMIC CHIP
C152 1-162-916-11 CERAMIC CHIP
C153 1-162-916-11 CERAMIC CHIP
C154 1-107-826-11 CERAMIC CHIP
C155 1-162-970-11 CERAMIC CHIP
C156 1-162-970-11 CERAMIC CHIP
C158 1-162-970-11 CERAMIC CHIP
C159 1-162-970-11 CERAMIC CHIP
C160 1-162-970-11 CERAMIC CHIP
C161 1-162-970-11 CERAMIC CHIP
Q Q
3 6 7 1 3 1 5
C162 1-162-970-11 CERAMIC CHIP
C163 1-162-970-11 CERAMIC CHIP
C164 1-162-970-11 CERAMIC CHIP
C167 1-162-970-11 CERAMIC CHIP
C170 1-162-970-11 CERAMIC CHIP
C171 1-162-970-11 CERAMIC CHIP
C172 1-162-970-11 CERAMIC CHIP
C173 1-162-970-11 CERAMIC CHIP
C174 1-162-970-11 CERAMIC CHIP
C175 1-162-970-11 CERAMIC CHIP
C176 1-162-970-11 CERAMIC CHIP
C177 1-126-205-11 ELECT CHIP
C178 1-126-208-21 ELECT CHIP
C179 1-107-826-11 CERAMIC CHIP
C180 1-107-826-11 CERAMIC CHIP
C181 1-107-826-11 CERAMIC CHIP
C182 1-127-715-91 CERAMIC CHIP
C184 1-162-970-11 CERAMIC CHIP
C187 1-126-208-21 ELECT CHIP
C188 1-127-715-91 CERAMIC CHIP
C189 1-128-934-91 CERAMIC CHIP
C190 1-126-205-11 ELECT CHIP
C191 1-107-826-11 CERAMIC CHIP
C192 1-162-970-11 CERAMIC CHIP
C193 1-127-715-91 CERAMIC CHIP
C195 1-127-715-91 CERAMIC CHIP
C196 1-162-968-11 CERAMIC CHIP
co
C203 1-162-970-11 CERAMIC CHIP
C205 1-164-230-11 CERAMIC CHIP
.
C206 1-164-230-11 CERAMIC CHIP
C208 1-162-970-11 CERAMIC CHIP
New part of EEP ROM (IC103) on the DMB10 board cannot be used. Therefore,
if the mounted DMB10 board (A-1110-958-A) is replaced, exchange new EEP
ROM (IC103) with that used before the replacement.
9 4 2 8
Remark
0.047uF 10% 16V
0.047uF 10% 16V
0.1uF 10% 16V
10uF 20% 16V
0.001uF 5% 25V
12PF 5% 50V
12PF 5% 50V
0.1uF 10% 16V
0.01uF 10% 25V
0.01uF 10% 25V
0.01uF 10% 25V
0.01uF 10% 25V
0.01uF 10% 25V
0.01uF 10% 25V
0 5 8 2 9 9 4 2 8
0.01uF 10% 25V
0.01uF 10% 25V
0.01uF 10% 25V
0.01uF 10% 25V
0.01uF 10% 25V
0.01uF 10% 25V
0.01uF 10% 25V
0.01uF 10% 25V
0.01uF 10% 25V
0.01uF 10% 25V
0.01uF 10% 25V
47uF 20% 6.3V
47uF 20% 4V
0.1uF 10% 16V
0.1uF 10% 16V
0.1uF 10% 16V
0.22uF 10% 16V
0.01uF 10% 25V
47uF 20% 4V
0.22uF 10% 16V
0.33uF 20% 10V
47uF 20% 6.3V
0.1uF 10% 16V
0.01uF 10% 25V
0.22uF 10% 16V
0.22uF 10% 16V
m
0.0047uF 10% 50V
0.01uF 10% 25V
220PF 5% 50V
220PF 5% 50V
0.01uF 10% 25V
9 9
9 9