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A
B
1
I PRINTED CIRCUIT BOARD (Foil side)
OPERATION (2) P. C. B.
(Lead Type Device)
8
2
/HPI
HPL
HPE
1
HPE
HPR
OPERATION (8)
3
BASS
OPERATION (2) P. C. B.
(Surface Mount Device)
4
5
6
Circuit No.
U, A
R, T, K
B, G, J
C751~753
O
O
X
CB704, 751
O
O
X
D751~755, 904
O
O
X
JK751~754
O
O
X
Q751~754
O
O
X
R751~757, 911
O
O
X
R972, 974, 976, 978
O
X
X
ST751, 752
O
O
X
7
SW974~976, 980
O
X
X
W701
O
O
X
X: NOT USED
O: USED / APPLICABLE
C
D
9
8
1
1
TREBLE
REC OUT
• Semiconductor Location
Ref. No. Location
Ref. No. Location
D801
F2
IC804
B2
D802
F2
Q801
F3
D803
B2
Q802
F3
D804
B2
Q803
B2
D941
H6
Q804
B2
D942
I6
Q941
G5
IC801
E2
Q942
G5
IC802
D2
IC803
C2
E
F
G
OPERATION (3) P. C. B.
FUNCTION
HPMT
/HPI
E
HPL
HPR
E
TOL
TIL
E
1
7
TIR
TOR
+12
-12
/BEC
MG
+5M
REC
14
8
OPTICAL
OPERATION (3) P. C. B.
H
I
(Lead Type Device)
DSP
NC
AXL
FUNCTION
AXE
AXR
S. VIDEO
R
AUDIO
L
VIDEO
VIDEO AUX
(Surface Mount Device)
J
RX-V3300/DSP-AZ2
VIDEO (1)
AVE
AVE
AXY
AVE
AXC
AVE
AXV
61
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