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CAT24C01, CAT24C02, CAT24C04, CAT24C08, CAT24C16
PIN A1
REFERENCE
È È
2X
0.10 C
2X
0.10 C
TOP VIEW
0.10 C
5X
0.05 C
NOTE 3
SIDE VIEW
b
5X
0.10
C
A
B
M
C
NOTE 4
B
A
PIN A1
REFERENCE
BOTTOM VIEW
PACKAGE DIMENSIONS
WLCSP5, 0.86x0.84
CASE 567DD
ISSUE C
A B
E
D
A
A2
SEATING
C
A1
PLANE
e
e1
1
2
3
http://onsemi.com
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DATUM C, THE SEATING PLANE, IS DEFINED BY THE
SPHERICAL CROWNS OF THE CONTACT BALLS.
4. COPLANARITY APPLIES TO SPHERICAL CROWNS
OF THE CONTACT BALLS.
5. DIMENSION b IS MEASURED AT THE MAXIMUM CON-
TACT BALL DIAMETER PARALLEL TO DATUM C.
MILLIMETERS
DIM
MIN
A
0.29
A1
0.10
A2
0.23 REF
b
0.14
D
0.86 BSC
E
0.84 BSC
e
0.30 BSC
e1
0.52 BSC
RECOMMENDED
SOLDERING FOOTPRINT*
A1
0.52
PITCH
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
18
MAX
0.39
0.14
0.18
PACKAGE
OUTLINE
5X
0.16
0.30
PITCH
DIMENSIONS: MILLIMETERS
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