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CAT24C01, CAT24C02, CAT24C04, CAT24C08, CAT24C16
PIN A1
È È
REFERENCE
È È
2X
0.10 C
2X
0.10 C
TOP VIEW
DETAIL A
0.10 C
0.05 C
NOTE 4
SIDE VIEW
b
4X
0.10
M
C
A
B
B
NOTE 5
A
BOTTOM VIEW
PACKAGE DIMENSIONS
WLCSP4, 0.84x0.86
CASE 567DC
ISSUE D
A B
E
D
* Die Coat
(Optional)
A2
DETAIL A
A
SEATING
C
A1
PLANE
NOTE 3
e
e
1
2
http://onsemi.com
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DATUM C, THE SEATING PLANE, IS DEFINED BY
THE SPHERICAL CROWNS OF THE CONTACT
BALLS.
4. COPLANARITY APPLIES TO SPHERICAL CROWNS
OF THE CONTACT BALLS.
5. DIMENSION b IS MEASURED AT THE MAXIMUM
A2
CONTACT BALL DIAMETER PARALLEL TO DATUM C.
A3*
A
MILLIMETERS
DIM
MIN
A
0.28
A1
0.08
A2
A3*
b
0.16
D
E
e
* Die Coat (Optional)
RECOMMENDED
SOLDERING FOOTPRINT*
A1
0.40
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
17
MAX
0.38
0.12
0.23 REF
0.025 REF
0.20
0.84 BSC
0.86 BSC
0.40 BSC
PACKAGE
OUTLINE
4X
0.18
0.40
PITCH
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