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CAT24C01, CAT24C02, CAT24C04, CAT24C08, CAT24C16
NOTE 5
2X
0.10
T
5
4
2X
0.20
T
1
2
3
L
G
A
C
0.05
H
PACKAGE DIMENSIONS
TSOP−5
CASE 483−02
ISSUE H
D
5X
0.20
C A B
B
S
K
J
SEATING
PLANE
T
SOLDERING FOOTPRINT*
0.95
0.037
1.0
0.039
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
M
OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
5. OPTIONAL CONSTRUCTION: AN
ADDITIONAL TRIMMED LEAD IS ALLOWED
DETAIL Z
IN THIS LOCATION. TRIMMED LEAD NOT TO
EXTEND MORE THAN 0.2 FROM BODY.
DIM
DETAIL Z
A
B
C
D
G
H
J
K
L
M
S
1.9
0.074
2.4
0.094
0.7
0.028
SCALE 10:1
inches
15
MILLIMETERS
MIN
MAX
3.00 BSC
1.50 BSC
0.90
1.10
0.25
0.50
0.95 BSC
0.01
0.10
0.10
0.26
0.20
0.60
1.25
1.55
_
_
0
10
2.50
3.00
mm
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