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6-11. PRINTED WIRING BOARD - LOW AMP Board -
1
LOW AMP BOARD
A
CN105
G
B
MAIN
BOARD
CN653
(Page 30)
6-12. SCHEMATIC DIAGRAM - LOW AMP Board -
1
2
LOW AMP BOARD
A
B
MA2J1110GLS0
D102
C
D
CN105
9P
-VH
9
TP106
OUT-SW
8
OUT-SW
7
G
+VH
6
TP105
OUT-L
5
MAIN
TP104
BOARD
-VH
4
E
(1/3)
TP103
+VH
3
CN653
TP102
(Page 31)
OUT-R
2
TP101
PA-GND
1
HCD-EC98P
• See page 27 for Circuit Boards Location.
2
JW109
R136
JW108
D101
R113
R135
C120
C119
B E
Q102
R133
JW107
Q101
R132
B E
C126
C123
C125
JW103
JW102
R131
JW101
R129
R125
JW104
R127
R130
JW110
C124
R143
R126
R128
IC101
1
3
4
5
LO+
LO-
RO+
RO-
1
2
3
4
5
6
7
R140
R139
22k
1.5k
Q103
R141
R138
2SA2026
2.2k
0.47
2W
0
0
R142
C127
1.5k
0.1
0
Q101
R135
R133
R131
2SA2026
2.2k
22k
1.2k
0
0
C125
0.1
0
Q102
R136
R134
R132
2SA2026
2.2k
22k
1.2k
0
0
C126
0.1
0
Q101-103
R125
220
OVER LOAD DETECT
R127
220
D103
MA2J1110GLS0
C123
0.1
∗
C119,120
C120
100 50V (AUS)
∗
100 63V (US,CND)
•
: Uses unleaded solder.
3
4
D103
CN103
C109
R114
C110
R101
R111
R102
R112
C107
C108
R117
R109
R110
JR102
JR101
R116
R120
JW105
R105
R119
R104
C101
R115
R103
C114
C102
R121
R122
C115
C116
R106
C104
R138
C111
R118
R107 R108
JW111
R137
C112
C128
R123
C103
R146
R144
R139
JW106
R141
R145
R140
C113
Q103
C127
C105
C106
19
B E
R142
JW112
1-875-524-
6
7
8
IC101
STK433-330-E
IC101
POWER AMP
+PRE SUB GND
8
9
10
11
12
13
14
15
16
17
18
19
C106
100p
R144
R146
0
R121
C115
470
47k
3p
C103
C104
C112
470p
470p
470p
R107
R108
R118
47k
47k
47k
C101
C102
C111
1
1
1
50V
50V
50V
R105
R106
R117
22k
22k
22k
R111
R112
R103
R104
R116
470
470
220
220
220
R101
R102
R115
0
0
0
C107
C108
47
47
25V
25V
C119
C116
C128
∗
R122
4700p
0.1
100
35
35
• Semiconductor
Location
Ref. No. Location
D101
A-2
D102
B-4
D103
A-4
IC101
B-3
Q101
A-2
Q102
B-2
Q103
B-4
H
MAIN
BOARD
CN643
(Page 30)
D102
11, 12
(11, 12)
9
10
CN103
7P
TP113
7
SW-IN
TP112
6
SW-A-GND
TP111
H
5
IN-R
TP110
4
A-GND
MAIN
TP109
BOARD
3
IN-L
TP108
(1/3)
2
AMP-ON
CN643
R123
1k
TP107
(Page 31)
1
PROTECT
HCD-EC98P
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