Table Of Contents; Servicing Notes - Sony HCD-EC98P Service Manual

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TABLE OF CONTENTS

1.
2.
..................................................................
3.
3-1. Disassembly Flow ........................................................... 10
3-2. Side Panel (L)/(R) ........................................................... 11
3-3. Panel (Top) ...................................................................... 11
3-4. MAIN Board ................................................................... 12
3-5. Front Panel Block (Australian model) ............................ 12
3-7. Back Panel Block ............................................................ 13
3-9. Base Unit (Australian model) ......................................... 14
3-11. Base Unit (US and Canadian models) ............................ 15
3-12. Belt (US and Canadian models) ...................................... 16
3-13. Belt (Australian model) .................................................. 16
3-14. OP Base Assy (KSM-213D) ........................................... 17
4.
............................................................ 18
5.
6.
6-2. Block Diagram - MAIN Section - ................................... 26
6-3. Printed Wiring Board - CD Board - ................................ 28
6-4. Schematic Diagram - CD Board - ................................... 29
6-5. Printed Wiring Boards - MAIN Section - ....................... 30
6-9. Printed Wiring Board - HI AMP Board - ........................ 34
6-10. Schematic Diagram - HI AMP Board - ........................... 34
6-12. Schematic Diagram - LOW AMP Board - ...................... 35
6-13. Printed Wiring Board - PANEL Board - ......................... 36
6-14. Schematic Diagram - PANEL Board - ............................ 37
6-15. Printed Wiring Boards - KEY Section - .......................... 38
6-16. Schematic Diagram - KEY Section - .............................. 38
6-17. Printed Wiring Board - PT Board - ................................. 39
6-18. Schematic Diagram - PT Board - .................................... 39
6-20. Schematic Diagram
7.
7-1. Panel Section ................................................................... 47
7-2. Front Panel Section ......................................................... 48
7-3. Chassis Section ............................................................... 49
7-4. Main Section ................................................................... 50
(CDM88A-K6BD90-WOD) ........................................... 51
(CDM77B-K6BD90-WOD) ........................................... 52
8.
.............................................
........................ 22
.............................. 53

SERVICING NOTES

NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
3
The laser diode in the optical pick-up block may suffer electrostat-
ic break-down because of the potential difference generated by the
6
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
RELEASING THE DISC TRAY LOCK
The disc tray lock function for the antitheft of an demonstration
disc in the store is equipped.
Releasing Procedure:
1. Press [
] button to turn the power on.
?/1
2. Press the [FUNCTION] button to select CD function.
3. While pressing the [
seconds).
4. The message "UNLOCKED" is displayed and the disc tray is
unlocked.
"
Note: When
LOCKED
turning power on/off with the
HCD-EC98P
SECTION 1
] button, press the [
] button for more 5
x
Z
"
is displayed, the slot lock is not released by
[
]
button.
?/1
3

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