Sony HCD-GZR9D Service Manual page 48

HCD-GZR7D/GZR8D/GZR9D
Ver. 1.1
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
For Printed Wiring Boards.
Note:
• X : Parts extracted from the component side.
• Y : parts extracted from the conductor side.
• : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from
(Conductor Side) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Component Side) the parts face are indicated.
• Abbreviation
E2 : 120V AC area in E model
E3 : 240V AC area in E model
E12 : 220 – 240V AC area in E model
E15 : Iran model
PH : Philippines model
SP : Singapore model
TH : Thai model
AUS : Australian model
RU : Russian model
EA : Saudi Arabia model
AR : Argentina model
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
HCD-GZR7D/GZR8D/GZR9D
For Schematic Diagrams.
Note:
• All capacitors are in μF unless otherwise noted. (p: pF) 50
WV or less are not indicated except for electrolytics and
tantalums.
• All resistors are in Ω and 1/4 W or less unless otherwise
specifi ed.
• 2 : nonfl ammable resistor.
• C : panel designation.
Note: The components identifi ed by mark 0 or dotted
line with mark 0 are critical for safety.
Replace only with part number specifi ed.
• A : B+ Line.
• B : B– Line.
• Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
no mark : FM
* : Impossible to measure
• Voltages are taken with VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal production
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F
: AUDIO
f
: TUNER
L
: VIDEO
g : COMPONENT VIDEO
E
: TAPE PLAY (DECK A)
d
: TAPE PLAY (DECK B)
G
: TAPE REC (DECK B)
J
: DVD (AUDIO)
c
: DVD (RF)
I : DVD (DIGITAL)
• Abbreviation
E2 : 120V AC area in E model
E3 : 240V AC area in E model
E12 : 220 – 240V AC area in E model
E15 : Iran model
PH : Philippines model
SP : Singapore model
TH : Thai model
AUS : Australian model
RU : Russian model
EA : Saudi Arabia model
AR : Argentina model
• Waveforms
– DMB18 Board –
IC102 (DVDRFIP)
700 mVp-p
200 mV/DIV, 100 nsec/DIV
IC102 (FEO)
0.2 Vp-p
100 mV/DIV, 1 msec/DIV
IC102 (TEO)
0.4 Vp-p
500 mV/DIV, 1 msec/DIV
– MAIN Board –
IC401 (XT1)
1.4 Vp-p
32.768 kHz
0.5 V/DIV, 20 μsec/DIV
IC401 (X1)
0.8 Vp-p
20 MHz
0.5 V/DIV, 20 nsec/DIV
48 48
IC102 (CVBS) IC102
0.8 Vp-p
H
27 MHz
500 mV/DIV, 20 μsec/DIV 500 mV/DIV, 20 nsec/DIV
IC102 (C)
0.6 Vp-p
H
500 mV/DIV, 20 μsec/DIV
IC102 (Y)
0.8 Vp-p
H
500 mV/DIV, 20 μsec/DIV
(XTALI)
0.7 Vp-p