Table Of Contents - Sony CDP-XE800 Service Manual

Table of Contents

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CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
CAUTION
: INVISIBLE LASER RADIATION WHEN OPEN AND
INTERLOCKS DEFEATED. AVOID EXPOSURE TO BEAM.
ADVARSEL
: USYNLIG LASERSTRÅLING VED ÅBNING NÅR
SIKKERHEDSAFBRYDERE ER UDE AF FUNKTION. UNDGÅ UDSAETTELSE
FOR STRÅLING.
VORSICHT
: UNSICHTBARE LASERSTRAHLUNG, WENN
ABDECKUNG GEÖFFNET UND SICHEREITSVERRIEGELUNG
ÜBERBRÜCKT. NICHT DEM STRAHL AUSSETZEN.
VARO!
: AVATTAESSA JA SUOJALUKITUS OHITETTAESSA OLET ALT-
TIINA NÄKYMÄTTÖMÄLLE LASERSÄTEILYLLE. ÄLÄ KATSO SÄTEESEEN.
VARNING
: OSYNLIG LASERSTRÅLING NÄR DENNA DEL ÄR ÖPP-
NAD OCH SPÄRREN ÄR URKOPPLAD. BETRAKTA EJ STRÅLEN.
ADVARSEL
: USYNLIG LASERSTRÅLING NÅR DEKSEL ÅPNES OG
SIKKERHEDSLÅS BRYTES. UNNGÅ EKSPONERING FOR STRÅLEN.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY-RELATED COMPONENT WARNING !!
COMPONENTS IDENTIFIED BY MARK ! OR DOTTED
LINE WITH MARK ! ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERA-
TION. REPLACE THESE COMPONENTS WITH SONY
PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN
THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY
SONY.
http://getMANUAL.com
This appliance is classified as a
CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
This caution
label is located
inside the unit.
- 2 -

TABLE OF CONTENTS

Section
Title
SECTION 2. GENERAL ................................................
3-1. Front Panel Assembly ......................................................... 5
SECTION 4. TEST MODE ..............................................
6-1. Circuit Boards Location ................................................... 10
6-3. Printed Wiring Board - BD Section - .......................... 13
6-4. Schematic Diagram - BD Section - ............................. 15
6-5. Printed Wiring Board - Main Section - ....................... 20
6-6. Schematic Diagram - Main Section - .......................... 23
SECTION 7. EXPLODED VIEWS
7-1. Front Panel Section .......................................................... 27
7-2. Chassis Section ................................................................. 28
7-3. CD Mechanism Section (CDM36-14) .............................. 29
7-4. Base Unit Section (BU-14) ............................................... 30
Page
...................................... 3
4
6
8
31

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