Table of Contents
i.MX Core Modules..................................................................................................................................................................................... 6
Core Module naming information ...................................................................................................................................................... 7
i.MX Development Boards ...................................................................................................................................................................... 8
1
Introduction ....................................................................................................................................................................................... 9
1.1
Overview .................................................................................................................................................................................. 10
1.2
Key Features ........................................................................................................................................................................... 10
1.3
Applications ............................................................................................................................................................................ 11
2
General Description ...................................................................................................................................................................... 12
2.1
Functional Description ....................................................................................................................................................... 12
2.1.1
Powering ........................................................................................................................................................................ 12
2.2
PCB Placement ...................................................................................................................................................................... 12
2.3
Mechanical Outline .............................................................................................................................................................. 13
3
Specifications ................................................................................................................................................................................... 14
3.1
Electrical Specifications ...................................................................................................................................................... 14
3.1.1
Digital I/O Characteristics ........................................................................................................................................ 14
3.1.2
Analog Inputs ............................................................................................................................................................... 14
3.1.3
Maximum Ratings....................................................................................................................................................... 14
3.1.4
ESD Sensitivity ............................................................................................................................................................. 15
4
Connector Description ................................................................................................................................................................. 16
4.1
4.2
4.3
4.4
4.5
4.6
4.7
4.8
SIM Connector X9 ................................................................................................................................................................. 18
4.9
5
Support .............................................................................................................................................................................................. 20
5.1
General Support .................................................................................................................................................................... 20
5.2
Board Support Packages ................................................................................................................................................... 20
5.3
i.MX Software Support ....................................................................................................................................................... 20
5.3.1
Linux ................................................................................................................................................................................ 20
5.3.2
Win CE ............................................................................................................................................................................. 20
5.4
®
Design Services .......................................................................................................................................................... 20
5.4.1
EXT-SBC-i.MX51-COMM_HUM_V1.2.docx
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