Toshiba TECRA M9 Maintenance Manual page 310

4 Replacement Procedures
Assembly of outside Tape and Cover shield
1. Assembly of Cover shield (S).
CAUTION: Pressure or stress should not be given on Source PCB.
Usage of gloves with anti-electric discharge coating is recommended.
To eliminate possible damage on circuits occurred by ESC.
2. Assembly of Cover shield (G).
CAUTION: Pressure or stress should not be given on Gate COF.
3. Assembly of Tape Adhesive used for Top case fixing.
CAUTION: Pressure or stress should not be given on Top case during this process.
Figure 4-59 Replacing LG.Philips fluorescent lamp (WXGA) (8)
4-76 [CONFIDENTIAL]
4.28 Fluorescent Lamp
TECRA M9 Maintenance Manual (960-631)