Device Memories; Combo Memory; Audio Concept; Audio Hw Architecture - Nokia RM-333 Service Manual

• Regulators
• Vibra interface
• Digital interface (CBUS)
EMC ASIP (Appcation Specified Integrated Passive) have been integrated inside the ASIC. It includes biasing
passives for microphone , EMC filter for SIM, microphones etc.

Device memories

Combo memory

The memory of the device consists of stacked DDR SDRAM and MuxedMassMemory (M3). Combo memory DDR/
M3 memory has 768Mb DDR + 2Gb M3.

Audio concept

Audio HW architecture

The functional core of the audio hardware is built around three ASICs: RAPIDOYAWE engine ASIC, mixed signal
ASIC Avilma and D/A converter DAC33.
DAC33 converts digital audio signal to analog and is routed to the FM Transmitter and amplifier TPA6130
which provides an interface for the transducers and the accessory connector.
AVilma provides analog signal for earpiece and for D-class audio amplifier TPA2012D2, which drives
integrated stereo handsfree speakers.
There are four audio transducers:
• 8x12 mm dynamic earpiece
• Two 8x12 mm dynamic speakers
• Digital MEMS (microelectromechanical systems) microphone
Avilma provides an output for the dynamic vibra component. All wired audio accessories are connected to
the AV accessory connector. A Bluetooth audio and FM radio module, which is connected to RAPIDOYAWE,
supports Bluetooth audio and FM radio functionality.
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Copyright © 2008 Nokia. All rights reserved.
RM-333; RM-334; RM-335
System Module and User Interface
Issue 2