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Philips Semiconductors
14. Package outline
QFP100: plastic quad flat package; 100 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm
y
80
81
100
1
e
DIMENSIONS (mm are the original dimensions)
A
UNIT
A
A
1
2
max.
0.25
2.90
mm
3.20
0.05
2.65
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT317-2
Fig 14. SOT317-2 package outline.
9397 750 07338
Product specification
pin 1 index
w
M
b
p
D
H
D
0
(1)
(1)
A
b
c
D
E
3
p
0.40
0.25
20.1
14.1
0.25
0.25
0.14
19.9
13.9
REFERENCES
IEC
JEDEC
MO-112
Rev. 03 — 21 July 2000
Triple high-speed Analog-to-Digital Converter 110 Msps
X
A
51
50
Z E
e
H
E
w
M
b
p
31
30
Z D
v
A
M
B
v
M
B
5
10 mm
scale
e
H
H
L
L
D
E
p
24.2
18.2
1.0
0.65
1.95
23.6
17.6
0.6
EIAJ
TDA8752B
A
2
A
E
A
1
L
detail X
(1)
(1)
v
w
y
Z
Z
D
E
0.8
1.0
0.2
0.15
0.1
0.4
0.6
EUROPEAN
ISSUE DATE
PROJECTION
© Philips Electronics N.V. 2000. All rights reserved.
SOT317-2
(A )
3
L
p
o
7
o
0
97-08-01
99-12-27
32 of 38
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