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EN 98
9.
EM5.3A P/M AA
9. Circuit Descriptions, Abbreviation List, and IC Data Sheets
Index of this chapter:
9.1 Introduction
9.2 Block Diagram
9.3 Feature Box
9.4 PICNIC
9.5 Columbus
9.6 FEM (Falconic Embedded Memory)
9.7 Eagle
9.8 Abbreviation list
9.9 IC Data Sheets
Note:
•
Only new circuits, compared to its predecessor the EM5.1,
are described. For the other circuit descriptions, see the
EM5.1 manual.
•
Figures can deviate slightly from the actual situation, due
to different set executions.
•
For a good understanding of the following circuit
descriptions, please use the diagrams in chapter 6 and 7.
Where necessary, you will find a separate drawing for
clarification.
9.1
Introduction
This chassis contains the following new features/components:
•
FEM (Falconic Embedded Memories): is a new Falconic
with internal Field memories and jagged line removal.
•
Improved 2D/3D Comb filter: The new key components are
Columbus and SDRAM. When SDRAM is used, a 3D comb
filter (or temporal comb filtering) is possible. Without
SDRAM, only 2D comb filtering, (or spatial comb filtering)
is possible. This is improved with respect to the previous
2D comb filter.
•
Improved noise reduction: This is a second function of the
Columbus and SDRAM. Noise reduction is possible
without SDRAM (2D) and with SDRAM (3D).
•
Pixel Plus 2: Eagle 1B is replaced by Eagle 1C.
–
Algorithms for Horizontal LTI and Vertical LTI are
improved.
–
Thin Line Control as part of the sharpness control.
–
Face Depending Peaking should allow less sharpness
in faces different from the rest of the picture. This could
be used to anti age faces versus the rest of the picture.
–
Vivid Colours 1 will result in more saturated colours.
–
The range/amount of Blue Stretch is extended.
–
More steps of Green Enhancement.
–
Improved Colour Dependent Sharpness.
–
Increased range of skin gain and skin tone.
The chassis consists of a full sized LSP/SSP combination and
a smaller double sided four layer SSB, which is mounted on the
SSP using a 80-fold SIMM connector. The main functionalities
are:
•
LSP: supply, deflection, and sound amplification.
•
SSP: tuner input, SIMM interface, I/O, and interface
provisions for extended functions such as PIP.
•
SSB: core TV functionalities, being TXT/control, video and
audio decoding, feature box, video featuring, and sync/
geometry control.
The LSP (single sided) is built up very conventional, with hardly
any surface mounted components on the copper side. Similar
with the EM3 (but different as with the MG-chassis), the EM5
LSP has a very large "hot" part, including both deflection coils.
The SSB is a high tech module (four layer, 2 sides reflow
technology, full SMC) with very high component density and
complete shielding for EMC-reasons. Despite this, it is
designed in such a way, that repair on component level is
possible. To achieve this, attention was paid to:
Circuit Descriptions, Abbreviation List, and IC Data Sheets
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•
The position of service test lands: most of them are at the
Tuner side.
•
Accessibility (Tuner side). If there are still problems with
the accessibility, one can order an extension board (see
parts list).
•
Clearance around surface mounted ICs (for replacing).
•
Detailed diagnostics and fault finding is possible via
ComPair.
The availability of Double Window (DW) or Picture In Picture
(PIP) depends on the model range. There are two different
executions, depending on the number of tuners:
•
One Tuner: The TV has only one tuner (on the LSP), so the
PIP-picture can be either from this tuner or from an external
AV-source.
•
Two Tuners: In this case there are two separate tuners, so
the main picture and the DW picture are independently
selectable. The IF signal from the main tuner is processed
on the SSB, while the IF signal from the second tuner is
processed by a second BOCMA video processor on the
DW-panel. The source selection is done via an I/O
expander.
9.2
Block Diagram
For the block diagram see chapter 6 "Wiring Diagram, Block
Diagrams, and Overviews".
The Tuner (item 1200) is a PLL tuner and delivers the IF-signal,
via audio & video SAW-filters, to the HIP (High-end Input
Processor). The HIP has the following functions:
•
IF modulation.
•
Video source- and record select.
•
Colour decoder.
•
Synchronisation.
Seven video input/output connections (with audio connections)
are available:
1. Front: interfaces CVBS, SVSH.
2. AV1: interfaces CVBS, RGB- and YUV-input (1fH)
3. AV2: interfaces CVBS and Y/C (meant for VCR-
connection.)
4. AV3+AV4: interfaces YPbPr/RGB (HD) inputs (2fH.)
5. Monitor out: interfaces CVBS out.
6. Audio out: interfaces external front and surround speakers.
(Audio out not available on 29PT9221)
After the HIP, we come to the part that is called the Feature box
(diagram B3x):
•
For Digital Scan, the PICNIC is required.
•
For Natural Motion, the FALCONIC (or FEM) is required.
•
For Pixel Plus, the EAGLE is required.
The HIP delivers YUV and sync signals to the PICNIC. This IC
takes care of:
•
Analogue to Digital conversion and vice versa.
•
50 to 100 Hz conversion.
•
Panorama mode.
•
Noise reduction (or via Columbus when present).
•
Dynamic contrast.
Attached to the PICNIC is the Columbus chip. This 2D/3D
Comb filter is used to separate chroma and luminance
components out of a CVBS signal. Second function is noise
reduction. It replaces the Comb filter that was attached to the
HIP in the former chassis.
After the PICNIC, the (now 2fH) YUV-signals are fed to the
FALCONIC (or FEM) for "Natural Motion" followed by the Eagle
for "Pixel Plus" enhancement. The processed YUV signals
(from Eagle or PICNIC) are, together with the sync-signals from
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