LG MG810c Service Manual
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LG MG810c Service Manual

LG MG810c Service Manual

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Service Manual
MG810c/MG810d
Date: May, 2006 / Issue 1.0

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Summary of Contents for LG MG810c

  • Page 1 Service Manual MG810c/MG810d Date: May, 2006 / Issue 1.0...
  • Page 2 REVISED HISTORY DATE ISSUE CONTENTS OF CHANGES S/W VERSION Mar / 2006 ISSUE 1 Initial Release The information in this manual is subject to change without notice and should not be construed as a commitment by LGE Inc. Furthermore, LGE Inc. reserves the right, without notice, to make changes to equipment design as advances in engineering and manufacturing methods warrant.
  • Page 3 - 2 -...

  • Page 4: Table Of Contents

    Table of Contents 1. Introduction ........5 5. DOWNLOAD........77 5.1 H/W Tool Setup ........77 1.1 Purpose ............5 5.2 Install & Directory structure......78 1.2 Regulatory Information ....... 5 5.3 Configuration setting........79 5.4 Download sequence ........82 2. General Performance ......7 2.1 H/W Features..........

  • Page 6: Introduction

    1. Introduction 1. Introduction 1.1 Purpose This manual provides the information necessary to repair, calibration, description and download the features of the CG225 1.2 Regulatory Information A. Security Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges you’re your telecommunications services.
  • Page 7 1. Introduction E. Notice of Radiated Emissions The CG225 complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user. F.

  • Page 8: General Performance

    2. PERFORMANCE 2. PERFORMANCE 2.1 H/W Features Item Feature Comment Standard Battery Li-Ion, 700mAh AVG TCVR Current 240mA Standby Current < 5.2mA Talk time Over 3 hour (@GSM Tx Level 7) Standby time Over 200 hour(@ Paging Period 9, RSSI : -85dBm) Charging time 3 hours RX Sensitivity...

  • Page 9: Technical Specification

    2. PERFORMANCE 2.2 Technical Specification Item Description Specification GSM900 TX: 890 + n x 0.2 MHz (n=1 ~ 124) 890 + (n-1024) x 0.2 MHz (n=975 ~ 1023) RX: TX + 45 MHz DCS1800 Frequency Band TX: 1710 + ( n-511 ) x 0.2 MHz (n = 512 ~ 885) RX: TX + 95 MHz PCS1900 TX: 1850 + ( n-511 ) x 0.2 MHz...
  • Page 10 2. General Performance Item Description Specification GSM900 Offset from Carrier (kHz). Max. dBc +0.5 600~ <1,200 1,200~ <1,800 1,800~ <3,000 3,000~ <6,000 Output RF Spectrum 6,000 (due to modulation) DCS1800/PCS1900 Offset from Carrier (kHz). Max. dBc +0.5 600~ <1,200 1,200~ <1,800 1,800~ <3,000 3,000~ <6,000 6,000...

  • Page 11: H/W Features

    2. General Performance Item Description Specification DCS1800/PCS1900 Offset from Carrier (kHz). Max. (dBm) Output RF Spectrum (due to switching transient) 1,200 1,800 Spurious Emissions Conduction, Emission Status GSM900 BER (Class II) < 2.439% @-102dBm Bit Error Ratio DCS1800/PCS1900 BER (Class II) < 2.439% @-100dBm RX Level Report Accuracy 3 dB 8 3 dB...
  • Page 12 2. General Performance Item Description Specification STMR 13 5 dB Stability Margin > 6 dB dB to ARL (dB) Level Ratio (dB) 17.5 22.5 30.7 Distortion 33.3 33.7 31.7 25.5 Side Tone Distortion Three stage distortion < 10% <Change> System frequency 2.5ppm (13 MHz) tolerance <Change>32.768KHz tolerance...

  • Page 13: S/W Features

    2. General Performance 2.3 S/W Features Item Description Specification Antenna Bar Number Power -85 dBm ~ -90 dBm ~ -86 dBm Antenna Display -95 dBm ~ -91 dBm -100 dBm ~ -96 dBm -105 dBm ~ -101 dBm ~ -105 dBm 3.62V 0.03V 3.70V...

  • Page 14: H/W Circuit Description

    3. H/W Circuit Description 3. H/W Circuit Description 3.1 RF Transceiver General Description The RF parts consist of a transmitter part, a receiver part, a frequency synthesizer part, a voltage supply part, and a VCTCXO part. The SI4210[U401] is a triple band transceiver IC suitable for GSM 900, DCS 1800 and PCS 1900 GPRS class 12 applications.

  • Page 15: Rf Front End

    3. H/W Circuit Description Figure 1. RECEIVER PART Block Diagram 3.2.1. RF Front End RF front end consists of Antenna Switch Module with SAW filter for triple band(FL400), triple band LNAs integrated in transceiver(U401). The Received RF signals (EGSM 925MHz ~ 960MHz, DCS 1805MHz ~ 1880MHz, PCS 1850 ~ 1990MHz) are fed into the antenna or mobile switch.

  • Page 16: Low If

    3. H/W Circuit Description 3.2.2. Low IF A quadrate image-rejection mixer downconverts the RF signal to a 100kHz intermediate frequency (IF) with the RFLO . The RFLO frequency is between 1849.8 and 1918.8 MHz, and is divided by two for EGSM modes.

  • Page 17: Vctcxo

    3. H/W Circuit Description 3.3.1. VCTCXO The VCTCXO module supply 26MHz reference clock and controlled by AFC input to generate a precise system reference clock adjustment. The 26 MHz clock(X500) consists of a TCXO(Temperature Compensated Crystal Oscillator) which oscillates at a frequency of 13 MHz. It is used within the TRF6151C RF Main Chip, BB Analog chip- set(IOTA), Digital chip-set(Calypso Lite).

  • Page 18: If Modulator

    3. H/W Circuit Description 3.4.1. IF Modulator The baseband converter(BBC) within the GSM chipset generates I and Q baseband signals for the Transmit vector modulator. The modulator provides more than 40dBc of carrier and unwanted sideband. Rejection and produces a GMSK modulated signal. The baseband software is able to cancel out differential DC offsets in the I/Q baseband signals caused by imperfections in the D/A converters.

  • Page 19: Power Supplies And Control Signals

    3. H/W Circuit Description Figure 4. POWER AMP 3.4.4. Power Supplies and Control Signals An external regulator(U303) is used to provide DC power to RF part. Every RF component except power amp module uses this external regulator. 14/89 Figure 5 POWER SUPPLIE & CONTROL - 18 -...

  • Page 20: Digital Baseband

    3. H/W Circuit Description 3.5 Digital Baseband Figure 7. Top level block diagram of the Calypso-Plus A. General Description • Calypso-Plus device is an evolution of Calypso(C035) device integrating hardware enhancements targeting the implementation of a new range of user’s applications. •...
  • Page 21 3. H/W Circuit Description The enhanced computing performances mainly rely on : [ MCU Sub-system] - 5.5Mbit Internal SRAM (with 0.5Mb shared with DSP) - DMA to internal SRAM - Page Mode Memory Interface - Sizable 6 Chip-Select - 2 Generic Purpose external interrupts - Patch Unit [ DSP Sub-system] - 0.5Mb Program/Data Memory Extension shared with MCU...
  • Page 22 The interface implements a 8-bit parallel data bus in addition to the control signals for selecting chip, writing/Reading, command and address latching, ready/busy status. (MG810c does not use NAND I/F Ports of Calypso-Plus. NAND Memory is interfaced to MAP) MG810C uses stacked memory MCP(pSRAM + NOR-Flash) as shown in (Figure 7.) MEMORY 256Mb NOR &...
  • Page 23 3. H/W Circuit Description C. RF Interface (TPU, TSP block) Calypso-Plus uses this interface to control ABB Processor and RF Processor with GSM Time Base. TSP (Time Serial Port) Resource Interconnection Description TSPDO ABB & RF main Chip Control Data TSPEN0 ABB Control Data Enable Signal TSPEN1...
  • Page 24 3. H/W Circuit Description E. Serial Interface Calypso-Plus has UART-IRDA and two UART Modem Drivers. UART-IrDA (For Debugging Trace) Resource Name Description TX_IRDA Transmit Data RX_IRDA Receive Data UART MODEM1 (For PC-Sync & Download) Resource Name Description TX_MODEM1 Transmit Data RX_MODEM1 Receive Data DSR_MODEM1...
  • Page 25 3. H/W Circuit Description F. USB Interface The USB_W2FC module supports the implementation of a "Full-Speed" device fully compliant to USB 1.1 standard. It provides an interface between the MCU and the USB device and handles USB transactions with minimal MCU intervention. The USB_W2FC module supports one control endpoint (EP0), up-to fifteen (15) IN endpoints and up- to fifteen (15) OUT endpoints.
  • Page 26 CL8237S4 is a multimedia processor. It includes Camera Interface, NAND Interface, LCD Interface, ARM9 Processor, etc. In MG810c, CL8237S4 uses 27MHz X-tal(X201) for system clock. For Audio function of MG810c, CL8237S4 performs storing, decoding MP3/AAC data. MP3/AAC data is stored in NAND-Memory, which is connected to CL8237S4 via NAND Interface(NAND_D(0~7)).
  • Page 27 3. H/W Circuit Description V_IO 2V8_CAM 1V5_MAP V_IO V_USB 2V8_MAP 1V5_MAP R203 R204 C201 C202 C203 C204 C205 C206 C207 C208 C209 C210 TP201 C_SCK C_SDA C_MCLK C_PCLK C_RST C_VS C_HS C_DATA(7) C_DATA(6) C_DATA(5) C_DATA(4) C_DATA(3) C_DATA(2) C_DATA(1) C_DATA(0) A(1) M_SA0 A(2) M_SA1...
  • Page 28 3. H/W Circuit Description MIDI_SPKPHN_HS_CKTs C103 C104 C105 C106 C107 C108 C109 C110 C101 0.1u 0.1u 0.1u 0.1u 0.1u 0.1u L101 HPOUTR HSO_R 100nH VIBRATOR LED0 L102 HPOUTL_MONO HSO_L 100nH LED1_GPIO4 LED2_GPIO5 GPIO3 C114 C115 C116 C117 GPIO2 EXTOUT 0.1u 0.1u 100p 100p...
  • Page 29 3. H/W Circuit Description 3) Acoustic Function SPKP1 SPKP2 SPKN1 SPKN2 MICBIAS MICBIAS MICIP MICP MICIN MICN EARP C111 C112 EARN HSMICBIAS HSBIAS HSMIC HSMIC L104 100nH HSOVMID R129 HSOL HSOL HSOR HSOR R130 L105 100nH AUXI C116 C117 C118 AUXO 4.7u 100p...
  • Page 30 3. H/W Circuit Description ii. Down-link path A voice signal from ABB(HSOR, HSOL) goes to RX_IN, EXT_IN of YMU783. which ports are analog voice input of analog mixer block. In case of using head-set, the analog mixer of YMU783 is set to head-phone out path.
  • Page 31 3. H/W Circuit Description SIDE_CAMERA KB301 KEYPAD VA302 VA301 EVLC14S02050 EVLC14S02050 PWON SHUT CLEAR SIDE_VOLUME KBR(1) KB302 R304 KBR(2) VA303 EVLC14S02050 KB303 R305 KBR(3) VA304 EVLC14S02050 R306 VA305 STAR SHAP SEND EVLC14S02050 KBR(4) LEFT RIGHT DOWN KBR(0) KBC(0) KBC(1) KBC(2) KBC(3) KBC(4) KBC(5)

  • Page 32: El Driver Ic

    3. H/W Circuit Description J. Keypad back-light Illumination The EL backlight is controlled by KEY_BACKLIGHT signal from GPIO_0 of DBB. The EL backlight will be turned on when the port 3 of EL driver ‘D381B’ goes to HIGH and the ‘D381B’ drives over 200 Volt to the EL_EN signal.
  • Page 33 VIBRATOR_CKTs Figure 19. Vibrator control ckts G. GPIO Map In total 16 allowable resources, KG810 is using 16 full resources. MG810c GPIO(General Purpose Input/Output) Map, describing application, I/O state, and enable level, is shown in below table 8. I/O #...

  • Page 34: Analog Baseband

    3. H/W Circuit Description 3.6 Analog Baseband A. General Description Syren is Analog Baseband (ABB)Chip supports GSM900, DCS1800, PCS1900, GPRS Class 10 with Digital Basband Chip. Syren processes GSM modulation/demodulation and power management operations. Block Description - Audio Signal Processing & Interface - Baseband in-phase(I), quadrature(Q) Signal Processing - Auxiliary RF converters - Five-channel analog-to-digital converters(ADC)
  • Page 35 3. H/W Circuit Description Figure 21. Voice Downlink path Block Diagram C. Baseband Codec(BBC) Baseband codec is composed of baseband uplink path(BUL) and baseband downlink path(BDL). BUL makes GMSK(Gaussian Minimum Shift Keying) modulated signal which has In-phase(I) com- ponent and quadrature(Q) component with burst data from DBB. This modulated signal is transmitted through RF section via air.
  • Page 36 3. H/W Circuit Description D. Voltage Regulation(VREG) There are 7 LDO(Low Drop Output) regulators in ABB chip. The output of these 7 LDOs are as following table. O utput Voltage Usage VRDBB 1.5V Digital Core of DBB VRIO 2.8V Peripheral devices VRMEM 2.8V External memory...
  • Page 37 3. H/W Circuit Description E. ADC Channels ABB ADC block is composed of 4 internal ADC(Analog to Digital Converter) channels and 4 external ADC channel. This block operates charging process and other related process by reading battery voltage and other analog values. Table 9.

  • Page 38: Lcd & Camera Interface

    In case that the camera-back-end chip ( Hera ) is bypass-mode, LCD is operated by DBB and memory. MG810c can display 26200 color according to 18-bit data line. The size of Module is 39*53.8*3.5. The module driver IC is HD66784. The LCD interface has 18-bit data line, CS, reset, Write strobe from DBB and Memory.
  • Page 39 3. H/W Circuit Description V_IO 2V8_CAM R203 R204 C_SCK C_SDA C_MCLK C_PCLK C_RST C_VS C_HS C_DATA(7) C_DATA(6) C_DATA(5) C_DATA(4) C_DATA(3) C_DATA(2) C_DATA(1) C_DATA(0) Figure 25. Camera I/F - 38 -...

  • Page 40: Bluetooth Interface

    3. H/W Circuit Description 3.8 Bluetooth Interface V_IO 2V8_VBT C304 C305 C306 C303 0.1u 0.1u C307 C308 C309 C310 FL301 DEA202484HT-8002A1 ANT301 R303 R301 DBB_BT_INT GPIO_0 FEEDING BT_DBB_INT GPIO_1 R305 GPIO_2 2.7nH R306 GPIO_3 2V8_VBT GPIO_4 TP301 BT_MAIN_CLK_EN GPIO_5 GPIO_6 GPIO_7 VREG_CTL UART_RTS_BT...

  • Page 41: Bluetooth Circuit Description

    3. H/W Circuit Description 3.8.1. Bluetooth circuit Description One chip Bluetooth Module U301(EWSMNBUXX) supports the following feature. -Bluetooth® 2.0+EDR conformity Adaptive Frequency Hopping (AFH) Fast connection Scatter Mode ESCO LMP Improvements Synchronization -UART Interface Baud Rate: 115.2kbps (default) Maximum 3Mbps -EDR -USB Interface v.2.0 -PCM Interface...

  • Page 42: Trouble Shooting

    4. TROUBLE SHOOTING 4. TROUBLE SHOOTING 4.1 Baseband Part Troubleshooting A. Power-On Trouble Troubleshooting • Power-On Sequence - Connecting Battery - Power-On Key Detection - PWON signal goes to ABB and then ABB resets DBB by ONNOFF signal - ONNOFF turns low(0V) to High(2.8V) and it resets DBB(Calypso plus) - All LDOs(internal LDOs of ABB and external LDOs) are turned on •...
  • Page 43 4. TROUBLE SHOOTING B. Charging Trouble Shooting • Charging method : CC-CV • Charger Detection Voltage : over 4.0V • Charging Time : About 2Hours • Charging Current : 550mA • Cut-off Current : 80mA • Low Battery Alarm - Talk mode : 3.62V - Standby mode : 3.50V •...
  • Page 44 4. TROUBLE SHOOTING • Trouble Shooting Setup - Connect Battery & TA to the handset • Trouble Shooting Procedure START Resolder the CN202 I/O Connector (CN202) (Pin 12,13) Is well ñ soldered ? Voltage at pin 1 of U201 The TA is out of order. =4.8 V ? Change the TA Change the TA.
  • Page 45 4. TROUBLE SHOOTING C. LCD Display Trouble • LCD Control signals from Main Board - LCD_RST, LCD_CS, LCD_ADS, MLED, LCD_D(0)~LCD_D(15) • Check Points - The Assembly status of the LCD Module - The Soldering of connector - The FPCB which connects the LCD Module •...
  • Page 46 4. TROUBLE SHOOTING SSSS SSSS - 45 -...
  • Page 47 4. TROUBLE SHOOTING D. Camera Trouble Shooting • Check Points - Check the power supply. - Check the soldering of Components - Check the CAMERA signals • Trouble Shooting Setup - Enter the engineering mode. - Go to menu ‘Baseband → Camera’ - 46 -...
  • Page 48 4. TROUBLE SHOOTING START Does the LCD itself has Go to the LCD no trouble? Set the camera button ON Check Power Source Check 2.8V_CAM Check PMIC 2.8V_CAM Change Q401 Check the Soldering Resoldering CN100 The CN100 Check the MAP_HOLD IN LOW Check DBB( Syren) C h e c k Change U202...
  • Page 49 4. TROUBLE SHOOTING E. SIM Detect Trouble Shooting SIM interface scheme is shown below. SIM_IO, SIM_CLK, SIM_RST ports are used to communicate DBB with ABB and the Charge Pump in ABB enables 1.8V/3V SIM operation. SIM I/O CKTs V_SIM V_SIM CN203 SIM_RST SIM_IO...
  • Page 50 4. TROUBLE SHOOTING • Trouble Shooting Procedure - Check the power supply - Check the soldering of SIM socket - Check the SIM START Insert the SIM Card Resolder the The soldering of SIM connector CN203. is OK? The all paths connected Resolder the to CN203 are OK? R226, C225, C226, C227, C223...
  • Page 51 4. TROUBLE SHOOTING F. Folder On/Off and Trouble Shooting • Folder Operation(ON/OFF) - There is a magnet to detect the folder status, opened or closed. - If a magnet is close to the hall-effect switch(U101) the voltage at pin 1 of U101 goes to 0V. Otherwise, 2.8V - This Folder signal is delivered to DBB, and the status of folder is reported.
  • Page 52 4. TROUBLE SHOOTING G.1 Speaker/Receiver Trouble Shooting (Common Path) - 51 -...
  • Page 53 4. TROUBLE SHOOTING G.2. Speaker/Receiver Trouble Shooting(Acoustic Path) - 52 -...
  • Page 54 4. TROUBLE SHOOTING G.3. Speaker/Receiver Trouble Shooting(MP3/AAC Path) - 53 -...
  • Page 55 4. TROUBLE SHOOTING G.4. Speaker/Receiver Trouble Shooting(FM Radio Path) - 54 -...
  • Page 56 4. TROUBLE SHOOTING G.5. Main-Mic. Path Trouble Shooting - 55 -...
  • Page 57 4. TROUBLE SHOOTING G.6. Ear-Mic. Receiver Path Trouble Shooting - 56 -...
  • Page 58 4. TROUBLE SHOOTING G.7. Ear-Mic. Mic. Path Trouble Shooting - 57 -...
  • Page 59 4. TROUBLE SHOOTING G.8. Vibrator Trouble Shooting - 58 -...

  • Page 60: Rf Part Troubleshooting

    4. TROUBLE SHOOTING 4.2 RF Part Troubleshooting A. RF Receiving Path Trouble Shooting - 59 -...
  • Page 61 4. TROUBLE SHOOTING B. RF Receiving Path Trouble Shooting (Regulator Circuits) VBAT RF2.85V U304 MIC5219-2.85YM5 RF_LDO_EN C318 C319 C320 C321 1000p 4.7u 390p - 60 -...
  • Page 62 4. TROUBLE SHOOTING C. RF Receiving Path Trouble Shooting (VCTCXOCircuits) RF2.85V RF2.85V R550 100K C428 C999 X401 26MHz 1000p 1000p R425 BT_26MHZ VCONT TCXO_OUT C431 C430 C429 1000p 1000p - 61 -...
  • Page 63 4. TROUBLE SHOOTING D. RF Receiving Path Trouble Shooting (PLL Circuits) C413 C414 C415 0603 0603 0603 R414 0603 R415 0603 R416 0603 - 62 -...
  • Page 64 4. TROUBLE SHOOTING E. RF Receiving Path Trouble Shooting (FEM-1) - 63 -...
  • Page 65 4. TROUBLE SHOOTING F. RF Receiving Path Trouble Shooting (FEM-2) - 64 -...
  • Page 66 4. TROUBLE SHOOTING G. RF Receiving Path Trouble Shooting (RX I&Q) RXQN RXQP RXIN RXIP R417 TXQN C419 390p R418 TXQP R419 TXIN C423 390p R420 TXIP R421 - 65 -...
  • Page 67 4. TROUBLE SHOOTING H. RF Transmitter Path Trouble Shooting - 66 -...
  • Page 68 4. TROUBLE SHOOTING I. RF Transmitter Path Trouble Shooting (Regulator Circuits) VBAT RF2.85V U304 MIC5219-2.85YM5 RF_LDO_EN C318 C319 C320 C321 1000p 4.7u 390p - 67 -...
  • Page 69 4. TROUBLE SHOOTING J. RF Transmitter Path Trouble Shooting (VCTCXO Circuits) RF2.85V RF2.85V R550 100K C428 C999 X401 26MHz 1000p 1000p R425 BT_26MHZ VCONT TCXO_OUT C431 C430 C429 1000p 1000p - 68 -...
  • Page 70 4. TROUBLE SHOOTING K. RF Transmitter Path Trouble Shooting (PLL Circuits) C413 C414 C415 0603 0603 0603 R414 0603 R415 0603 R416 0603 - 69 -...
  • Page 71 4. TROUBLE SHOOTING L. RF Transmitter Path Trouble Shooting (I&Q Circuit) RXQN RXQP RXIN RXIP R417 TXQN C419 390p R418 TXQP R419 TXIN C423 390p R420 TXIP R421 - 70 -...
  • Page 72 4. TROUBLE SHOOTING M. RF Transmitter Path Trouble Shooting (PAM Control Signal) VBAT 4dB Atten RFOL R401 R402 R403 GSM_OUT GSM_IN R405 0603 VRAMP GND23 GND22 C405 GND21 RF3166 GND20 U401 VBATT 0603 GND19 R407 0603 GND18 TX_ENABLE PA_ON GND17 R408 0603 BAND_SELECT...
  • Page 73 4. TROUBLE SHOOTING N. RF Transmitter Path Trouble Shooting (FEM -1) - 72 -...
  • Page 74 4. TROUBLE SHOOTING O. RF Transmitter Path Trouble Shooting (FEM -2) - 73 -...

  • Page 75: Bluetooth Trouble

    4. TROUBLE SHOOTING 4.3 Bluetooth Trouble START Set BT Test mode ON in the Engineering mode Check Check Check BT Module FL301,R305,R303,R301,ANT301 Re-download SW and Replace BT module Check DBB(U102) - 74 -...

  • Page 76: Checking Regulator Circuit

    4. TROUBLE SHOOTING 4.3.1 Checking Regulator Circuit Check Pin B1 2V8_VBT VBAT Regulator circuit is OK U305 TK63128BCB-G See next page to check 2 8V? VOUT VCTCXO circuit BT_LDO_EN VCONT C322 C323 Replace U305 Pin A2 High? Check U102 PIN B1 PIN A2 - 75 -...

  • Page 77: Checking Vctcxo Circuit

    4. TROUBLE SHOOTING 4.3.2 Checking VCTCXO Circuit Check Pin 3 of X401 VCTCXO circuit is OK 26MHz ? See next page to Replace X401 Pin 4 2 85V ? Check U101 RF2.85V RF2.85V R550 100K C428 C999 X401 26MHz 1000p 1000p R425 BT_26MHZ...

  • Page 78: Download

    5. DOWNLOAD 5. DOWNLOAD 5.1 H/W Tool Setup 1) Type 1 No Battery RS232 Connect Cable 4.2V Power Supply Zender + EDGE or TI Cable 2) Type 2 D/L Cable Zender + D/L Cable - 77 -...

  • Page 79: Install & Directory Structure

    5. DOWNLOAD 5.2 Install & Directory structure 1) Copy. GSMULTI D/L Program in local Disk(C:) only. - Folder name : Only “GSMULTI” ✻ Service Bulletin No : DTAD20063088 -This program and Dll file and SW is on GCSC Website 2) Registry of GSMULTI Program - Execute by double click : 3) After Install Directory structure •...

  • Page 80: Configuration Setting

    5. DOWNLOAD 5.3 Configuration setting 1) Choose DLL Copy! KG810 DLL File in DLL folder -Path of Dll folder : Local(C:) → GSMULTI Folder→ Dll Folder -Dll file is on GCSC Website Click Click • Path of Configuration Screen Local(c:) → GSMULTI → - 79 -...
  • Page 81 5. DOWNLOAD 2) Choose SW Copy! KG810 SW in SW folder -Path of SW folder : Local(C:) → GSMULTI Folder → SW Folder -SW is on GCSC Website - 80 -...
  • Page 82 5. DOWNLOAD 3) Choose Loader & Baud -Loader file is in GSMULTI Folder (Path:Local(C:) → GSMULTI Folder) Loader name is cmdp_cert_KG810.mO' Only baud rate is 115,200 Don't use Don't use 4) Others Setting Capability to change necessary condition Common After setting completed "OK"...

  • Page 83: Download Sequence

    5. DOWNLOAD 5.4 Download sequence After connect the phone then click "START" (Power should be off ) Wait. Loading files.. Power supply to phone Running Time = 1090~1100sec (Baud is 115,200bps) After passing program and confirming phone power on. and then disconnect cable from phone. When you follow up this procedure, If you have some problem, Pls.

  • Page 84: Block Diagram

    6. Block Diagram 6. Block Diagram - 83 -...
  • Page 85 - 84 -...

  • Page 86: Circuit Diagram

    Section Date Sign & Name TOUCH_ACK MG810c Sheet/Sheets R141 MODEL _MIDI_RST Designer Main 1/5 R142 FM_INTX _CHG_STAT Checked DBB & ABB DRAWING CHG_EN NAME USB_EN Approved KEY_BACKLIGHT DRAWING Rev 1.0 LG Electronics Inc. LG Electronics Inc. LGIC(42)-A-5505-10:01 - 85 -...
  • Page 87 USB_DP COM1 R233 Section Date Sign & Name USB_DM COM2 Sheet/Sheets MG810c MODEL Designer Main 2/5 Checked DRAWING I/O CONNECTOR NAME Approved DRAWING Rev 1.0 Date Name Iss. Notice No. LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 86 -...
  • Page 88 0.1u EL_EN Section Date Sign & Name MG810c Sheet/Sheets MODEL Designer Main 3/5 Checked DRAWING Bluetooth & Conn. & LDOs NAME Approved DRAWING Rev 1.0 Iss. Notice No. Date Name LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 87 -...
  • Page 89 Sign & Name Sheet/ MG810c R427 MODEL Sheets 270K Designer S.J.Kwon 22K Thermistor R428 Checked C.B.Hong DRAWING TEMPSENSE NAME Approved R429 4.7K DRAWING Rev 1.0 Iss. Notice No. Date Name LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 88 -...
  • Page 90 V_SRAM R532 TC7SH04FS CLK32K_OUT U503 Section Date Sign & Name Sheet/ MG810 MODEL Sheets Designer Checked DRAWING FM Radio ckts NAME Approved DRAWING Rev 1.0 Iss. Notice No. Date Name LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 89 -...
  • Page 91 HSOL A(0) _MIDI_CS HSOR Section Date Sign & Name MG810c Sheet/Sheets MODEL Designer wormhol2@lge.com Checked DRAWING MIDI & MIC & Vib. NAME Approved DRAWING Rev.1.0 Iss. Notice No. Date Name LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 90 -...
  • Page 92 Section Date Sign & Name Sheet/ MG810c L_CS MODEL Sheets L_WR L_RD Designer L_ADS Checked DRAWING MAP & MEM & PMIC NAME Approved DRAWING Rev.1.0 Iss. Notice No. Date Name LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 91 -...
  • Page 93 INOUT_B2 INOUT_A3 INOUT_B3 INOUT_A4 INOUT_B4 Section Date Sign & Name Sheet/ MG810c Sheets MODEL Designer Checked DRAWING KEY & CONN.& LDO NAME Approved DRAWING Rev.1.0 Iss. Notice No. Date Name LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 92 -...
  • Page 94 KBC(1) KBC(2) KBC(3) KBC(4) KBC(5) Section Date Sign & Name Sheet/ MG810c Sheets MODEL Designer Checked DRAWING KEY & CONN.& LDO NAME Approved DRAWING Rev.1.0 Iss. Notice No. Date Name LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 93 -...
  • Page 95 OUT103 SPK_RCV_P SPKL_P C106 VA103 Section Date Sign & Name Sheet/ Sheets 09/23 SON 80 FOLDER MODEL S.W.PARK Designer 2005 Checked DRAWING FPCB NAME Approved DRAWING LG Electronics Inc. Iss. Notice No. Date Name LG Electronics Inc. - 94 -...

  • Page 96: Pcb Layout

    8. PCB LAYOUT - 95 -...
  • Page 97 8. PCB LAYOUT - 96 -...
  • Page 98 8. PCB LAYOUT - 97 -...
  • Page 99 8. PCB LAYOUT - 98 -...
  • Page 100 8. PCB LAYOUT - 99 -...
  • Page 101 8. PCB LAYOUT - 100 -...

  • Page 102: Calibration

    9. Calibration 9. Calibration 9.1 H/W Tool Setup GPIB Cable com1 port RF Cable RS232 Cable Zender + EDGE Cable Connect cable H/W Tool Setup (RF test test : 8960) Reference Tool List Option RF test set 8960/ Agilent Address 1 Power Supply 66311B/Agilent Address 2...

  • Page 103: Test Jig Operation

    9. Calibration JTAG2 JTAG1 Status - REMOTE REMOTE POWER VBAT UART Status POWER Figure 11-1 The top view of Test JIG 1. Test Jig Operation Table 11-2 Jig Power Power Source Description Power Supply usually 4.0V Travel Adaptor Use TA, name is TA-20G(24pin) Table 11-3 Jig DIP Switch Switch Number Name...
  • Page 104 9. Calibration Table 11-4 LED Description LED Number Name Description LED 1 Power Power is provided for Test Jig LED 2 Indicate charging state of the phone battery LED 3 UART Indicate data transfer state through the UART port LED 4 Indicate data transfer state through the MON port 1.

  • Page 105: Install & Directory Structure

    9. Calibration 9.2 Install & Directory structure 1) Copy a Cal. Program in local Disk(C:). This program name is “Hotkimchi” -Folder name : Only “CM_GSM” -This Cal.Program is on GCSC Website 2) Registry of Calibration Program -Execute by double click : 3) Directory structure - 104 -...

  • Page 106: Others Directory Structure Of Cm_Gsm

    9. Calibration 9.3 Others Directory structure of CM_GSM 1)Hot_Kimchi_V13 Execution File 2)Cal_Model & KG810_KG818_MG810C Folder 3)Info_Db.txt - 105 -...

  • Page 107: Cal. Procedure

    9. Calibration 9.4 Cal. Procedure 1) Execute. -Path : Local(C:) → CM_GSM Folder → Hot_Kimchi_V13 → ➀ Click. And choose “KG810_MC810C_KG818” ➁ Click. ➂ Click. - 106 -...

  • Page 108: Cal. Sequence

    9. Calibration 9.5 Cal. sequence When the left window pop-up, first of all turn on the phone. And then click "Start" button after finishing turn on The left window is just progress screen. Phone is being auto re-start after finishing cal. - 107 -...

  • Page 109: Engineering Mode

    [2-*] TOUCH[PSOC] [2-4] FONT [2-*-1] TOUCH KEY PROGRAM [2-5] ALERT [2-*-2] TOUCH LED [2-5-1] VIBRATOR [2-5-2] RING [3] MG810c VERS [2-5-3] EFFECT SOUND [4] ENG MODE [2-5-4] IMELODY SOUND [2-5-5] EMS SOUND [4-1] CELL ENVIRON [2-6] SERIAL PORT [4-2] LOCATION INFO...

  • Page 110: Standalone Test

    11. STANDALONE TEST 11. STANDALONE TEST 11.1 Setting Method 11.1.1 COM Port In the “Dialog Menu”, select the values as explained below. • Port : select a correct COM port • Baudrate : 115200 • Leave the rest as default values 11.1.2 Tx Test 1.
  • Page 111 - 110 -...

  • Page 112: Exploded View & Replacement Part List

    12. EXPLODED VIEW & REPLACEMENT PART LIST 12.1 EXPLODED VIEW - 111 -...
  • Page 113 - 112 -...

  • Page 114: Replacement Parts

    12 x 1.25 x 1.6 (Nd-Fe-B Magnet) MTAZ01 TAPE MTAZ0105201 MG810c CAMERA FPCB TAPE FOR FIX MTAZ02 TAPE MTAZ0109801 MG810c FOLDER LOWER TAPE FOR CAMERA FIX MTAZ03 TAPE MTAZ0109901 MG810c FOLDER LOWER VIBRATOR TAPE MTAZ04 TAPE MTAZ0117501 MG810c FOLDER LOWER TAPE FOR FPCB FIX...
  • Page 115 ACGK0066501 MG810c MAIN FRONT ASSY Black MBHY00 BUMPER MBHY0017801 MG810c FRONT BUMPER Black MBJL00 BUTTON,SIDE MBJL0028901 MG810c FRONTSIDE BUTTON < CAMERA > Black MBJN00 BUTTON,VOLUME MBJN0007601 MG810c FRONT VOLUME BUTTON Black MCCC00 CAP,EARPHONE JACK MCCC0032501 MG810c FRONT EARPHONE JACK CAP...
  • Page 116 TAPE MTAZ0117701 MG810c FOLDER LGP TAPE (LOWER) MPBZ01 MPBZ0126501 MG810c FPCB PAD Black MTAB01 TAPE,PROTECTION MTAB0104201 MG810c FOLDER PROTECTION TAPE < TOUCH PAD> Black MTAB02 TAPE,PROTECTION MTAB0109001 MG810c FPCB PROTECTION ADCA00 DOME ASSY,METAL ADCA0046701 MG800 MAIN DOME ASSY (EL) ADCA01...

  • Page 117: Main Component

    12. EXPLODED VIEW & REPLACEMENT PART LIST <Main component> Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC Location Level Description Part Number Specification Color Remark SACY00 PCB ASSY,FLEXIBLE SACY0043001 PCB ASSY, SACB00 SACB0028001 FLEXIBLE,INSERT SACE00...
  • Page 118 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark VA103 VARISTOR SEVY0003901 5.5 V, ,SMD ,480pF, 1005 SPCY00 PCB,FLEXIBLE SPCY0067801 6Layer, SBL, FPCB SAEY00 PCB ASSY,KEYPAD SAEY0048301 Black PCB ASSY, SAEB00 SAEB0014301 Black KEYPAD,INSERT SAEE00 PCB ASSY,KEYPAD,SMT SAEE0015601...
  • Page 119 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C201 CAP,CERAMIC,CHIP ECCH0009508 47 pF,25V ,J ,NP0 ,TC ,0603 ,R/TP C202 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C203 CAP,CERAMIC,CHIP ECCH0009508 47 pF,25V ,J ,NP0 ,TC ,0603 ,R/TP C204 CAP,CERAMIC,CHIP ECCH0004904...
  • Page 120 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C324 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP C325 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C326 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C327 CAP,CERAMIC,CHIP ECCH0004904...
  • Page 121 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R106 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP R107 RES,CHIP ERHY0009522 3.3 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP R108 RES,CHIP ERHY0009501 0 ohm,1/20W(0.05W) ,J ,0603 ,R/TP R109 RES,CHIP ERHY0009558 68 Kohm,1/20W(0.05W) ,F ,0603 ,R/TP R110 RES,CHIP ERHY0009560...
  • Page 122 SVLM0018501 ,HD66784 , SAFY01 PCB ASSY,MAIN SAFY0154601 Black SAFB00 PCB ASSY,MAIN,INSERT SAFB0054301 Black MFEA00 FRAME,SHIELD MFEA0010301 MG810c MAIN PCB METAL SHIIELD SAFF00 PCB ASSY,MAIN,SMT SAFF0076801 Black MLAB00 LABEL,A/S MLAB0000601 HUMIDITY STICKER MLAC00 LABEL,BARCODE MLAC0003301 EZ LOOKS(use for PCB ASSY MAIN(hardware))
  • Page 123 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C105 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C106 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C107 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP C108 CAP,CERAMIC,CHIP ECCH0000167...
  • Page 124 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C214 CAP,CHIP,MAKER ECZH0000901 24 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C215 CAP,CERAMIC,CHIP ECCH0009103 100 pF,50V ,J ,X7R ,TC ,0603 ,R/TP C216 VARISTOR SEVY0008101 5.5 V, ,SMD ,0603 C217 CAP,CERAMIC,CHIP ECCH0004904...
  • Page 125 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R111 RES,CHIP ERHY0009505 10 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP R112 RES,CHIP ERHY0009506 100 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP R113 RES,CHIP ERHY0009506 100 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP R114 RES,CHIP ERHY0009506 100 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP...
  • Page 126 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R215 RES,CHIP ERHY0009303 10 Kohm,1/20W(0.05W) ,F ,0603 ,R/TP R216 RES,CHIP ERHY0009501 0 ohm,1/20W(0.05W) ,J ,0603 ,R/TP R217 RES,CHIP ERHY0009501 0 ohm,1/20W(0.05W) ,J ,0603 ,R/TP R223 RES,CHIP ERHY0009560 33 Kohm,1/20W(0.05W) ,F ,0603 ,R/TP...
  • Page 127 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C208 CAP,TANTAL,CHIP ECTH0005201 33 uF,6.3V ,M ,STD ,2012 ,R/TP C211 CAP,CERAMIC,CHIP ECCH0009103 100 pF,50V ,J ,X7R ,TC ,0603 ,R/TP C212 CAP,CERAMIC,CHIP ECCH0009103 100 pF,50V ,J ,X7R ,TC ,0603 ,R/TP C223 CAP,CERAMIC,CHIP ECCH0009505...
  • Page 128 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C411 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C412 CAP,CERAMIC,CHIP ECCH0000173 1.2 pF,16V ,B ,NP0 ,TC ,1005 ,R/TP C413 CAP,CERAMIC,CHIP ECCH0009506 27 pF,25V ,J ,NP0 ,TC ,0603 ,R/TP C414 CAP,CERAMIC,CHIP ECCH0009506...
  • Page 129 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark CN203 CONN,SOCKET ENSY0009401 6 PIN,STRAIGHT , ,2.54 mm, D201 DIODE,TVS EDTY0006701 CSP ,15 KV,200 mW,R/TP ,4 CHANNEL ESD ARRAY FL301 RES,CHIP ERHY0000401 0 ohm,1/16W,J,1608,R/TP 850.900 ,1800.1900 ,3.8 dB,4.1 dB, dB, dB,ETC ,5.4*4.0 FL401 FILTER,SEPERATOR SFAY0006902...
  • Page 130 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R409 INDUCTOR,CHIP ELCH0004723 1.8 nH,S ,1005 ,R/TP , R410 RES,CHIP ERHY0000229 300 ohm,1/16W,J,1005,R/TP R411 RES,CHIP ERHY0000206 18 ohm,1/16W,J,1005,R/TP R412 RES,CHIP ERHY0000229 300 ohm,1/16W,J,1005,R/TP R413 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R414...
  • Page 131 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R545 RES,CHIP ERHY0009505 10 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP R550 RES,CHIP ERHY0009506 100 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP SW401 CONN,RF SWITCH ENWY0002304 STRAIGHT ,SMD ,0.8 dB,MUSE MODEL U301 MODULE,ETC SMZY0010201...

  • Page 132: Accessory

    SBPP00 SBPP0014901 3.7 V,700 mAh,1 CELL,PRISMATIC ,SON80 Batt. Pb-Free Pearl White LI-POLYMER SGDY00 DATA CABLE SGDY0010901 LG-US03K ,18pin USB DataCable SGEY00 EAR PHONE/EAR MIKE SET SGEY0005516 GSM FORDER ,KG320(C2EAR PHONE) SSAD00 ADAPTOR,AC-DC SSAD0020902 100-240V ,5060 Hz,4.8 V,0.9 A,CB & UL & CSA ,18pin plug...
  • Page 133 Note...
  • Page 134 Note...

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