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LG MG200 Service Manual

LG MG200 Service Manual

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Service Manual
MG200
P/N : MMBD0047701 (1.0)
Date : April 2005

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Summary of Contents for LG MG200

  • Page 1 Service Manual MG200 P/N : MMBD0047701 (1.0) Date : April 2005...
  • Page 2 LGE Inc. Furthermore, LGE Inc. reserves the right, without notice, to make changes to equipment design as advances in engineering and manufacturing methods warrant. This manual provides the information necessary to install, program, operate and maintain the MG200.

  • Page 4: Table Of Contents

    9. ENGINEERING MODE ....115 4. TROUBLE SHOOTING ....46 10. STANDALONE TEST ....116 4.1 Main Components Placement (MG200) ..........46 10.1 Setting Method ........116 4.2 FPCB Components Placcement ....47 4.3 Baseband Components ......47 11. EXPLODED VIEW &...

  • Page 5: Introduction

    A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the MG200 or compatibility with the network, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.
  • Page 6 The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different. G. Interference and Attenuation An MG200 may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from unsuppressed engines or electric motors may cause problems. H. Electrostatic Sensitive Devices...

  • Page 7: Abbreviation

    1. INTRODUCTION 1.3 Abbreviations For the purposes of this manual, following abbreviations apply: Automatic Power Control Baseband Bit Error Ratio CC-CV Constant Current – Constant Voltage Digital to Analog Converter Digital Communication System dB relative to 1 milliwatt Digital Signal Processing EEPROM Electrical Erasable Programmable Read-Only Memory Electroluminescence...

  • Page 8: General Performance

    2. GENERAL PERFORMANCE 2. General Performance 2.1 Supporting Standard MG200 : Support GPRS (Class 10) 2.2 Supporting Standard Item Feature Comment Supporting Standard GSM 850/PCS 1900 Dual-Band Item Feature Comment with seamless handover Phase 2+ (include AMR) Supporting Standard GSM 850/PCS 1900 Dual-Band...

  • Page 9: H/W Feature

    2. GENERAL PERFORMANCE 2.4 H/W Features Item Comment Feature Form Factor Dual Folder 1) Capacity Standard : Size : Li-lon, Min 1000mAh (SANYO) Battery 34.15 (W) x 53.55(H) x 5.7(T) [mm] 2) Packing Type : Inner Pack Standard : Size 88.8 x 46 x 24.3mm Weight 96.5g...
  • Page 10 2. GENERAL PERFORMANCE Item Feature Comment Fixed Type System connector 24 Pin Ear Phone Jack 3 Pole (2.5mm) PC synchronization Flash : 128Mbit Memory SRAM : 64Mbit Speech coding FR, EFR, HR, AMR Data & Fax Built in Data & Fax support Vibrator Built in Vibrator IrDA...

  • Page 11: S/W Features

    2. GENERAL PERFORMANCE 2.5 S/W Features Item Feature Comment RSSI 0 ~ 5 Levels Battery Charging 0 ~ 4 Levels Key Volume 0 ~ 5 Level 1 ~ 5 Level Audio Volume NITZ Time / Data Display Multi-Language English / Spanish / France Phone Book / Web Access / Quick Access Sound / Message / IM / Camera /...
  • Page 12 2. GENERAL PERFORMANCE Item Feature Comment Call Reminder Network Selection Automat IC / Manual Mute Call Divert Call Barring Call Charge (AoC) Call Duration SMS (EMS) EMS : Release 4 (Except Text Align) E - Mail Over SMS SMS Over GPRS Game Calendar Memo...
  • Page 13 2. GENERAL PERFORMANCE Item Feature Comment SIM Toolkit Class 1, 2, 3, A - E Open wave MMS Client EONS CPHS V4.2 Camera Internal / 300 KB CLDC V1. 1 / MIDP V 2.0 JAVA Download Over WAP Voice Dial IrDA GPRS Class 10...

  • Page 14: H/W Circuit Description

    3. H/W CIRCUIT DESCRIPTION 3. H/W Circuit Description 3.1 General Description The RF part consists of a transmitter, a receiver, a synthesizer, a voltage supply and a VCTCXO part. And the main RF Chipset TRF6151C [U607] is a single-chip triple-band transceiver for the extended global system for mobile communication [GSM850MHz] /Digital communication system [PCS1900MHz] voice and data transfer applications.
  • Page 15 3. H/W CIRCUIT DESCRIPTION 3.2.1 RF Front End Antenna switch and dual saw filters are integrated in FEM (FL601). The Received RF signals (GSM 869MHz ~ 894MHz, PCS 1930MHz ~ 1990MHz) are fed into the antenna and Mobile switch. An antenna matching circuit is between the antenna and the mobile switch. The Antenna Switch in FEM (FL601) is used to control the Rx and Tx paths.
  • Page 16 3. H/W CIRCUIT DESCRIPTION 3.2.3 Synthesizer The RF main chipset includes a fully integrated VCO with an on-chip LC tank. A fractional-N synthesizer can phase lock the local oscillator used in both transmit and receive path to a precision frequency reference input. The fractional-N operation offers low phase noise and fast setting times, allowing for multiple slot applications such as GPRS.

  • Page 17: Transmiter Part

    3. H/W CIRCUIT DESCRIPTION 3.3 Transmitter Part The Transmitter part contains OPLL parts of RF Main Chipset [TRF6151, U607], Power Amplifier Module [SKY77325, U604] and Front-End Module [ESHS-L080SF, FL601]. The transmit section of RF Main Chipset [TRF6151C, U607] consists of an I/Q base-band up-converter, an offset phase-locked loop [OPLL].
  • Page 18 3. H/W CIRCUIT DESCRIPTION Serial Interface M DIV 26 MHz XTAL Figure 4. Block diagram of if Modulator 3.3.2 OPLL The OPLL consists of a feedback mixer, a phase detector, a loop filter, and a fully integrated TXVCO. The TXVCO is centered between the DCS 1800 and PCS 1900 bands, and its output is divided by 2 for the GSM 850 and E-GSM 900 bands.
  • Page 19 3. H/W CIRCUIT DESCRIPTION 3.3.3 Power Amplifier The Power Amplifier Module [SKY77325, U604] is a dual-band GSM/PCS power amplifier module that incorporates an indirect closed loop method of power control. The indirect closed loop is fully self-contained and it does not require loop optimization. It can be driven directly from the DAC output in the baseband circuit.
  • Page 20 3. H/W CIRCUIT DESCRIPTION 3.3.4 26MHz Clock RF2.85V X601 C654 RF2.85V R617 26MHz 1000p TCXO OUT VCONT X601 C654 R617 26MHz 1000p TCXO OUT VCONT C656 C667 2.2u 1000p C656 C667 2.2u 1000p Figure 8. Schematic of VCTCXO circuit Figure 8. Schematic of VCTCXO circuit 3.3.5 Power Supplies and Control Signals An external LDO [U605] is used to provide DC power to VCTCXO [X601], Buffer [U605] which is used for buffering FEM control signals from DBB and the RF Main Chip [TRF6151C, U607].

  • Page 21: Digital Baseband(Dbb) Processor

    3. H/W CIRCUIT DESCRIPTION 3.4 Digital Baseband(DBB) Processor 32 Khz CRYSTAL 13 MHz or 26 MHz TCXO IT Alarm DIV-2 SLICER 13MHz ENABLE-CK13Mhz CK 32Khz Asywchro mms WAKE_UP DPLL & CLKM INTH WTDOG ULPD MCU top-cdll Boot Rom GSM time External MEMIF ARM7...
  • Page 22 3. H/W CIRCUIT DESCRIPTION 3.4.2 Block Description CALYPSO architecture is based on two processor cores ARM7 and DSP using the generic RHEA bus standard as interface with their associated application peripherals. CALYPSO is composed from the following blocks: • ARM7TDMIE : ARM7TDMI CPU core •...
  • Page 23 3. H/W CIRCUIT DESCRIPTION 3.4.3 RF Interface (TPU, TSP Block) Calypso uses this interface to control IOTA_CS(ABB Processor) and AERO(RF Processor) with GSM Time Base. Table 3-2. RF Interface Spec. TSP (Time Serial Port) Resource Interconnection Description TSPDO ABB & RF main Chip Control Data TSPEN0 ABB Control Data Enable Signal...
  • Page 24 SIMRST 100k 150p 0.1u Figure 10. SIM Interface 3.4.5 UART Interface MG200 has two UART Drivers as follow : UART : Hardware Flow Control / Fax & Data Modem Table 3-3. UART Interface spec. UART MoDEM (UART1) Resource Name Description...

  • Page 25: Analog Baseband(Abb) Processor

    3. H/W CIRCUIT DESCRIPTION 3.4.6 GPIO MAP In total 16 allowable resources, MG200 is using 13 resources except 3 resources dedicated to SIM and Memory. MG200 GPIO (General Purpose Input/Output) Map, describing application, I/O state, and enable level, is shown in below table.
  • Page 26 3. H/W CIRCUIT DESCRIPTION VCMEM VCDBB GNDA VRMEM VSDBB VRIO VCABB GNDD VLMEM VRRAM VRDBB VCIO VRSIM VRABB TESTV Double Bounding Voltage Regulation VLRTC pads (VREG) VXRTC VBACKUP BFSR Backup Baseband VRRTC (BREG) Serial Port BFSX (BSP) Clock Gene CK13M (CKG) ADAC Internal...
  • Page 27 3. H/W CIRCUIT DESCRIPTION 3.5.2 Audio Signal Processing & Interface The voice codec circuitry processes analog audio components in the voice uplink (VUL) path and applies this signal to the voice signal interface for eventual baseband modulation. In the voice downlink (VDL) path, the codec circuitry changes voice component data received from the voice serial interface (VSP) into analog audio.
  • Page 28 3. H/W CIRCUIT DESCRIPTION 3.5.3 Audio Uplink processing The VUL path includes two input stages. The first stage is a microphone amplifier, compatible with electret microphones containing a FET buffer with open drain output. The microphone amplifier has a gain of typically 25.6 dB (±1 dB) and provides an external voltage of 2.0 V or 2.5 V to bias the microphone (MICBIAS).
  • Page 29 3. H/W CIRCUIT DESCRIPTION 3.5.4 Audio Downlink processing The VDL path receives speech samples at the rate of 8 kHz from the DSP via the VSP and converts them to analog signals to drive the external speech transducer. The digital speech coming from the DSP is first fed to a speech digital filter that has two functions.
  • Page 30 3. H/W CIRCUIT DESCRIPTION 3.5.5 Baseband Codec (BBC) Baseband codec is composed of baseband uplink path (BUL) and baseband downlink path (BDL). BUL makes GMSK (Gaussian Minimum Shift Keying) modulated signal which has In-phase (I) component and quadrature (Q) component with burst data from DBB. This modulated signal is transmitted through RF section via air.
  • Page 31 3.5.6 Voltage Regulation (VREG) There are 7 LDO (Low Drop Output) regulators in ABB chip. The output of these 7 LDOs are as following table. (Figure14) shows the power supply related blocks of DBB/ABB and their interfaces in MG200. RSIM VBAT VRSIM 1.8/2.9V...
  • Page 32 3. H/W CIRCUIT DESCRIPTION Table 3-5. LDO Output Table Output Voltage Usage Table 3-5. LDO Output Table 1.5V Digital Core of DBB VRDBB Output Voltage Usage 2.8V Peripheral devices VRIO 1.5V Digital Core of DBB VRDBB 2.8V External memory VRMEM 2.8V Peripheral devices VRIO...
  • Page 33 3. H/W CIRCUIT DESCRIPTION 3.5.8 Charging Charging block in ABB processes charging operation by using VBAT, ICHG value through ADC channel. Battery Block Indication and SPEC of MG200 is as follow. 4.2V~3.90V 3.89V~3.76V 3.75V~3.69V 3.68V~3.60V 3.59V~3.35V Figure 17. Battery Block Indication 1.
  • Page 34 ] CHARGER_IC : When a charger voltage is above VBAT+0.4V on VCHG. 3.5.10 Memories MG200 using 128Mbit Flash + 64Mbit SRAM with 16 bit parallel data bus thru ADD01 ~ ADD22. 3.5.11 Display & FPCB Interface LCD module include :...
  • Page 35 3. H/W CIRCUIT DESCRIPTION Table 3-7. Connector Interface Spec. MAIN BOARD LCD FPCB 60PIN CONN. CONNECTOR 60PIN CONN. CAMERA 20PIN CONN. LCM 40PIN CONN. 2V85_CAM L_D(0) L_D(0) C_MCLK L_D(1) LCD_RESET L_D(1) L_D(2) L_D(2) C_PCLK L_SUB-CS L_D(3) C_CD0 L_D(0) L_D(3) L_D(4) C_CD1 L_D(1) L_D(4)
  • Page 36 3. H/W CIRCUIT DESCRIPTION MAIN BOARD LCD FPCB 60PIN CONN. CONNECTOR 60PIN CONN. CAMERA 20PIN CONN. LCM 40PIN CONN. VBACKUP VBACKUP EAR_P EAR_P EAR_M EAR_M MLED MLED L_LED3 L_LED3 L_LED2 L_LED2 L_LED1 L_LED1 L_D(15) L_D(15) L_D(14) L_D(14) L_D(13) L_D(13) L_D(12) L_D(12) L_D(11) L_D(11)
  • Page 37 3. H/W CIRCUIT DESCRIPTION Figure 18. Keypad Scanning Scheme 3.5.13 Keypad back-light Illumination There are 12 Deep Blue LEDs in Main Board for Keypad Backlight. Keypad Back-light is driven by ‘LEDB’ line from IOTA . Figure 19. Keypad Back-light Scheme - 36 -...
  • Page 38 3.5.15 Audio Circuit Figure 21. Microphone system When a call is established, MICBIAS signal goes up to ‘2.5V’ in the MG200. IOTA(ABB) provides both 2.0V and 2.5V for MICBIAS to circuit designer. VA201, VA202 are employed to enhance ESD immunity.
  • Page 39 3. H/W CIRCUIT DESCRIPTION Head set Jack Interface Figure 22. Ear-Jack Interfate When ear-mic set or head set plug is inserted into the receptacle, JACK_DETECT signal which is input of ADIN1 in ABB changes from ‘H’ to ‘L’. If hook button is pushed for a second to make a call, then HOOK_DETECT signal which is input of ADIN4 in ABB goes from ‘H’...
  • Page 40 3. H/W CIRCUIT DESCRIPTION Receiver / Speaker phone Circuits Figure 23. Receiver and Speaker phone mode system switch A single analog switch is employed to support both voice and speaker shone mode with RCV_P. In the speaker phone mode the SPK_EN port sets ‘H’ , then the RCV_P will be connected with MIDI sound path(NO) and operate as loud speaker.
  • Page 41 3. H/W CIRCUIT DESCRIPTION MIDI sound circuit description Figure 24. MIDI sound Circuit The YMU762 has features as described below. • Simultaneous generation of up to 40 tones : • Polyphonic synthesizer specification • Has built-in default tones for FM and Waveform table synthesizers in the ROM, and the tones can be downloaded to RAM.
  • Page 42 3. H/W CIRCUIT DESCRIPTION REC_N REC_L_N REC_P REC_L_P Figure 25. Receiver and Speaker Circuit SPKP_OKI, SPKN_OKI signals from MIDI sound are connected to speaker through SPK+ and SPK-. REC_N, REC_P signals from ABB are connected to receiver through REC_L_N and REC_L_P. - 41 -...

  • Page 43: Camera Circuit

    3. H/W CIRCUIT DESCRIPTION 3.6 Camera Circuit Under camera action mode, MV3018SNK wholly controls LCD by itself to execute camera functions, while, under bypass mode, MV3018SNK lets all LCD driver-related signals bypass it, as if it does not exist at all in the system. C_CD[7:0] C_HS L_D[15:0]...
  • Page 44 3. H/W CIRCUIT DESCRIPTION Figure 27. MV3018SNK, Camera Chip Circuit - 43 -...
  • Page 45 3. H/W CIRCUIT DESCRIPTION c t i Figure 28. LCD Connection Thru MV3018SNK, Camera chip 3.5.2 CMOS Image Sensor General description of CIS Camera Module • VGA resolution • 5.04mm x 5.04mm active square pixel • 1/4.5 inch optical format •...
  • Page 46 3. H/W CIRCUIT DESCRIPTION c t i C_PWR C_PWR CAMERA CONN 0.1u C_MCLK C_MCLK C_RST C_PCLK C_SCK C_CD0 C_SDA C_CD1 C_HS C_CD2 C_VS C_CD3 C_CD7 C_CD4 C_CD5 C_CD6 Figure 29. Camera Module Circuit - 45 -...

  • Page 47: Trouble Shooting

    4. TROUBLE SHOOTING 4. TROUBLE SHOOTING 4.1 Main Components Placement Test Points Q301 U303 CN201 U604 FL601 CN501 SW601 U608 U501 U302 U607 J201 Camera Key Side Key X601 U608 U401 U101 U201 U202 U203 U402 U102 J401 X101 U301 MIC201 LD315 CN302...

  • Page 48: Fpcb Components Placcement

    4. TROUBLE SHOOTING 4.2 FPCB Components Placement Test Points Test Points BAT1 BAT1 4.3 Baseband Components Test Points Test Points - 47 -...

  • Page 49: Main Components

    4. TROUBLE SHOOTING 4.4 Main Components (Description) MAIN Indicator LED U101 Analog Baseband Chipset (IOTA) LD315 IO Connector U102 Digital Baseband Chipset (CALYPSO) CN301 Battery Connector U201 MIDI chipset (YMU762) CN302 Side Key (camera) U202 Audio power source CN303 Charging current control TR Side Key (up, down) U301 CN304...

  • Page 50: Power On Trouble

    4. TROUBLE SHOOTING 4.5 Power On Trouble 4.5.1 Power On Sequence Connecting Battery • Power-On Key Detection • PWON signal goes to ABB and then ABB reset DBB by ON_OFF signal • ON_OFF turn low(1.5V) to HIGH(2.8V) and it resets Calypso 4.5.2 Check Points •...

  • Page 51: Charging Trouble

    4. TROUBLE SHOOTING 4.6 Charging Trouble • Charging method : CC-CV • Charger detect voltage : about 5.2V • Charging time : under 3hours • Charging current : 500mA • Cutoff current : 50mA • Low battery alarm - Idle : 3.60V - Dedicated : 3.50V •...
  • Page 52 4. TROUBLE SHOOTING Charging Procedure • Connecting TA & Charger Detection • Control the charging Current by ABB • Charging Current flows into the Battery Check Points • Connection of TA • Charging Current Path • Battery Trouble Shooting Setup •...

  • Page 53: Lcd Display Trouble

    4. TROUBLE SHOOTING 4.7 LCD Display Trouble Test Points LCD CONNECTOR Check soldering around connector - FPCB CONNECTOR - LCD CONNECTOR - 52 -...
  • Page 54 4. TROUBLE SHOOTING Checking Flow START Refer to Power is supplied to Power On Trouble the board? Connection between Reconnect LCD Module and board is OK? Module Resolder the MAIN CN501, FPCB CN3,CN1 MAIN CN501, FPCB is soldered well? CN3,CN1 Paths of LCD control Resolder signals are OK?

  • Page 55: Receiver Trouble

    4. TROUBLE SHOOTING 4.8 Receiver Trouble Block Diagram SPKP/ Control Calypso YMU762 SPEAKER SPKN (102) (U201) SPK_EN Analog SW (U202) RCV_P/ EAR_SPK IOTA EAR_P/ EAR_N RECEIVER RC filter (U101) RCV_N LCD Control Signals From Main Board • MLED , L_MAIN_CS, L_SUB_CS ,LCD_RESET, L_WR, LCD_ID •...
  • Page 56 4. TROUBLE SHOOTING Test Points CN501 Receiver Speaker Check the states these points! Receiver Trouble Shooting Setup • Initialize GSM MS test equipment. • Connect PIF-UNION and power on. • Make a test call to 112. • Set audio part at test equipment as PRBS or continuous wave, not echo. •...
  • Page 57 4. TROUBLE SHOOTING 4.8.1 Receiver Trouble Checking Flow START Set audio part at test equipment as PRBS or continuous wave, not echo. Set the audi o volume max. ABB is out of order. Does sine wave appear Change the board. at R206, R210? Resolder the U202.
  • Page 58 4. TROUBLE SHOOTING 4.8.2 Speaker Trouble Checking Flow START Enter into Engineering Mode and go to menu “Baseband Alert Ring” No Resolder the U203 SPK_EN signal Does sine wave appear otherwise Change it. at C206, C207? is high? Reconnect FPCB to Connection CN701 between FPCB and...
  • Page 59 4. TROUBLE SHOOTING 4.8.2 Speaker Trouble Checking Flow START Enter into Engineering Mode and go to menu “Baseband Alert Ring” Does sine wave No Resolder the U202 SPK_EN signal appearat C252-C255, otherwise Change it. is high? R239, R240? Resolder the U201 Connection V_SRAM between speaker and...

  • Page 60: Microphone Trouble

    4. TROUBLE SHOOTING 4.9 Microphone Troble - 59 -...
  • Page 61 4. TROUBLE SHOOTING Microphone Signal Flow • MIC is enable by MICBIAS • MICBIAS, MICP, MICN signals to ABB Trouble Shooting Setup • Initialize GSM MS test equipment. • Connect PIF-UNION to the phone, and power on. • Make a test call to 112. •...
  • Page 62 4. TROUBLE SHOOTING START Connect the handset to network equipment and setup call. Resolder the The soldering of The voltage of R204 R202 R202 is OK? is 2.5V? Resolder the MIC ABB is out of order. Change the board. Soldering between MIC and Board is OK? Check the signal level at pin...

  • Page 63: Vibrator Trouble

    4. TROUBLE SHOOTING 4.10 Vibrator Trouble R411 R406 R412 Q402 1.5K R408 VIBRATOR R409 100K C406 EMZ2 4.7u Vibrator Operation • Vibrator is controlled by MIDI chip • When vibrator signal is high, vibrator is enabled Check Check Points Vibrator Signal soldering ! •...
  • Page 64 100K C406 EMZ2 4.7u 4. TROUBLE SHOOTING Check Vibrator Signal soldering ! START Enter into Engineering Mode and select Vibrator Voltage of C201 Change the board Signal of pin3 of Q402 is 2.8V is OK? U201 is out of order Check the soldering of Resolder R408 Pin4 of Q402 is 0V ?

  • Page 65: Keypad Backlight Trouble

    4. TROUBLE SHOOTING 4.11 Keypad Backlight Trouble R316 LEDB R318 VA306 R316 LEDB Backlight Operation R318 • The keypad LED backlight is controlled with LEDB signal. VA306 • LEDB signal from ABB. • The LEDs are forward biased and turned on. Trouble Shooting Setup •...
  • Page 66 4. TROUBLE SHOOTING START Enter into Engineering Mode and select Keypad On The Voltage ABB is out of order. Check the soldering Of LEDB signal Change the Board. of R316, R318 is about 0V? Power off and Measure the Resistor Value of all LEDs. Is there anything that ABB is out of order.

  • Page 67: Folder Open/Close Trouble

    4. TROUBLE SHOOTING 4.12 FOLDER Open/Close Trouble Folder Operation • There is a magnet to detect the Flip status, opened or closed. • If a magnet is close to the hall-effect switch(U302), the voltage at pin 2 of U302 goes to 0V. Otherwise, V_IO.
  • Page 68 4. TROUBLE SHOOTING Caution! If use PIF jig, the rem START ote switch is turned off. Folder open status. ; Not magnetized Resolder the The all paths connected R312, R313 to U302 are OK? ABB is out of order. Pin1 of U302 is 2.8V? Change the Board.

  • Page 69: Sim Detect Trouble

    4. TROUBLE SHOOTING 4.13 SIM Detect Trouble Block Diagram V_IO V_SIM VRSIM DBBSIO SIM_IO DBBSCK SIM_CLK DBBSRST SIM_RST SIMCLK SIM_PWRCTRL S IMIO SIM_CD SIMRST 100k 150p 0.1u J401 - 68 -...
  • Page 70 4. TROUBLE SHOOTING Connection between SIM and DBB • SIM_CLK, SIM_IO, SIM_RST Trouble Shooting Setup • Insert the SIM into socket - Connect PIF to the phone, and power on. Check Points • Contact between SIM and socket - Soldering of SIM socket Trouble Shooting Procedure •...

  • Page 71: Earphone Trouble

    4. TROUBLE SHOOTING 4.14 Earphone Trouble EAR_JACK SPEC Receiver Earphone Detecting Operation • The DBB read JACK_DETECT port periodically and if the voltage of “JACK_DETECT” goes to 0V, it detects ear-jack inserted. • The ABB operates A/D conversion continuously and if the voltage of “HOOK_DETECT” node goes to about 40mV, it detects hook switch is pushed in call state.
  • Page 72 4. TROUBLE SHOOTING “JACK_DETECT” Point The audio Signal from ear-mic The audio Signal to ear-mic (L201, R227) (C240, R224, R225) “HOOK_DETECT” signal(R222, C238) The audio Signal from ear-mic (C241) - 71 -...
  • Page 73 4. TROUBLE SHOOTING cf) PRBS : Pseudo Random Bit Sequence START Insert the earphone into the headset. Does the Audio profile change 1. Earphone detection problem to the earphone mode? Set the audio part of test equipment to PRBS or c ontinuous wave mode Can you Soldering...
  • Page 74 4. TROUBLE SHOOTING 1. Earphone detection problem The Voltage The soldering Resolder the at JACK_DETECT point Of R232, R233, C246 R232, R233, C246. is 0V? is OK? Pin3 and Pin4 of J201 Change the J201. are open? The ABB is out of order. Change the board.
  • Page 75 4. TROUBLE SHOOTING 2. Sending Path problem Set audio part of the test equipment to the echo mode. The voltage at R227 Resolder the R216, R220, R223 is 0.99V ~ 1.03V? A few tens or hundreds Resolder soldering of C241 of mV of signals at C241 the C241 is OK?

  • Page 76: Camera Trouble

    4. TROUBLE SHOOTING 4.15 Camera Trouble SETTING : Connect PIF, and remote switch ON at PIF START Does the LCD Go to the LCD trouble itself has no trouble Set the camera button ON Check Check the voltage of Pin1 the voltage of Pin3 of Q401 Change the main board of Q401 is...
  • Page 77 4. TROUBLE SHOOTING U601 U602 FPCB CN2 - 76 -...
  • Page 78 4. TROUBLE SHOOTING RF Part Troubleshooting RF Components SW601 U608 FL601 U604 U607 U605 X601 Figure 8. RF Components Table 8. RF Components Reference Description Reference Description SW601 Mobile S/W U605 LDO (Voltage Regulator) X601 VCTCXO (26MHz) FL601 U608 Triple Buffer U604 U607 RF Main Chip...
  • Page 79 4. TROUBLE SHOOTING Trouble Shooting of Receiver Part Setup Test Equipment GSM850 : 190ch, Rx Level : - 60dBm PCS1900 : 660ch, Rx Level : - 60dBm Check Point Check Point VCTCXO Check Point RF Chipset Control Signal Check Point Mobile SW &...
  • Page 80 4. TROUBLE SHOOTING Checking LDO Circuit Check Pin 1 Check Battery 3.4 ~ 4.2V? Pin 3 High? Check DBB[U102] Replace Regulator PIN1 Pin 5 2.85V? U605 [U605] (VBAT) PIN6 PIN3 (RF2.85V) (RF_EN) Regulator Circuit is OK. See next page to check VCTCXO Circuit.
  • Page 81 4. TROUBLE SHOOTING Checking VCTCXO Circuit Check Pin 1 Check 2.85V? Regulato Circuit Pin 1 0.9V? Check ABB[U101] Replace VCTCXO Pin 3 13MHz? [X601] X601 PIN3 VCTCXO Circuit is OK. PIN1 (TCXO) (AFC) PIN4 (RF_2.85V) RF2.85V C654 X601 R617 1000p 26MHz TCXO OUT VCONT...
  • Page 82 4. TROUBLE SHOOTING Checking PLL Circuit Check PLL Data STROBE Check DBB CLK is Normal? [U102] DATA Check DBB DATA / STROBE [U102] Is Normal? U607 Control Signal is OK. - 81 -...
  • Page 83 4. TROUBLE SHOOTING Checking Mobile SW & FEM Circuit Pin2 Pin1 SW60 (VC3) (VC2) (VC1) FL601 - 82 -...
  • Page 84 4. TROUBLE SHOOTING Check Pin 1, 2 of sw601 with Replace SW601 RF Cable : Open? For This RF level test case, Rx Stand alone mode is needed GSM850? VC1 : Low Redownload VC2 : Low The Phone S/W VC3 : Low Check RF Level of FEM Output For GSM850 : FL601.1...
  • Page 85 4. TROUBLE SHOOTING Checking Rx IQ Circuit U607 Replace RF Transceiver [U607] RX Part is OK. RXIN RXIP RXQP RXQN Check Base Band Circuit or Redownload the software and Calibrate again. - 84 -...
  • Page 86 4. TROUBLE SHOOTING Trouble Shooting Transmitter Part Setup Test Equipment GSM850 : 190ch, 5 Level PCS1900 : 660ch, 0 Level Check Point Check Point VCTCXO Check Point RF Chipset Control Sihnal Check Point Tx IQ Check Point Check Point Mobile SW & FEM Redownload Phone SW - 85 -...
  • Page 87 4. TROUBLE SHOOTING Checking LDO Circuit - See RX Part “Check LDO Circuit” Checking VCTCXO circuits - See RX Part “Check VCTCXO Circuit” Checking RF Chipset Control Signals - See RX Part “Check RF chipset control signal” - 86 -...
  • Page 88 4. TROUBLE SHOOTING Checking Tx IQ signals U607 Check ABB Signals are Normal? [U101] Base Band signal is OK. See next page to check Transceiver Output Signal. TXIN TXIP TXQP TXQN CALL STATE CALL STATE - 87 -...
  • Page 89 4. TROUBLE SHOOTING Checking PAM Circuits U604 Check Output Signal Replace RF Signals are Normal? Transceiver [U607] Transceiver is OK. See next pae to check PAM Control Circuit GSM850 Out PCS1900 Out - 88 -...
  • Page 90 4. TROUBLE SHOOTING - 89 -...
  • Page 91 4. TROUBLE SHOOTING Checking Mobils S/W & FEM circuits - See RX Part "Check Mobile S/W & FEM circuit" Check Pin 1, 2 of SW601 with Replace SW601 RF Cable : Open? PCS? GSM850? VC1 : Low VC1 : High VC2 : High VC2 : Low VC3 : High...

  • Page 92: Download

    5. DOWNLOAD 5. DOWNLOAD 5.1 Download Setup 5.1.1 In case of using the Data kit Figure 5-1 Describes Download Setup Preparation • Target Handset • Data kit • Battery • IBM compatible PC supporting RS-232 with Windows 98 or newer If y ou use data kit, y ou should hav e a battery with the voltage above 3.7V.

  • Page 93: Download Procedure

    5. DOWNLOAD Preparation • Target Handset • PIF • RS-232 Cable and PIF-to-Phone interface Cable • TA/Power Supply or Battery • BM compatible PC supporting RS-232 with Windows 98 or newer If y ou use battery , y ou should hav e a battery with the voltage above 3.7V. 5.2 Download Procedure 1.
  • Page 94 5. DOWNLOAD 2. Click the “Add” button. Then, choose m0 file which is going to download. - 93 -...
  • Page 95 5. DOWNLOAD 3. You must choose three programming options in programming options box. One is to decide whether you erase entire flash. If m0 file which is going to download have the change of pcm structure for current target’s m0 file, you must erase entire flash memory. The second programming option is to decide whether you erase bootloader.
  • Page 96 5. DOWNLOAD 4. Press “Global Settings” menu. Choose a correct serial port and set the configuration as below. - 95 -...
  • Page 97 5. DOWNLOAD 5. After checking programming options, Click “Erase/Program” button. If you click “Erase/Program” button, you will be able to see that “(reset target)” is displayed in the “Output” window. And then if you push shortly the “Power key” of the mobile, downloading will be started. - 96 -...
  • Page 98 5. DOWNLOAD 6. Wait for downloading to be finished. - 97 -...
  • Page 99 5. DOWNLOAD 7. If downloading is finished, we can switch on the mobile. When you switch on the mobile first time after downloading, you must not remove the battery until switch-on procedure is completed. If you remove the battery before switch-on procedure is completed, we will not be able to save user data in the flash memory of the mobile.

  • Page 100: Service And Calibration

    6. SERVICE AND CALIBRATION 6. SERVICE AND CALIBRATION 6.1 Service S/W 6.1.1 Overview This service S/W is used for Calibration and Standalone test. 6.1.2 Hardware and Software Environment • More than 486 computer • 16Mbyte RAM • Remained more than 10Mbyte in Hard Disk Memory •...
  • Page 101 6. SERVICE AND CALIBRATION A. Target System Frame This is for initializing the target phone. When you use this program to test L1100 phone, you have to initialize target at first. To initialize target phone, select target (L1100 is default) and COM port used at your computer and then click the Initialize button.
  • Page 102 6. SERVICE AND CALIBRATION Power Level Setting First, you have to choose operating mode (GSM, DCS, PCS) according to TCH and BCH frequency that you selected before. Then select the Level and adjust the DAC value. Level means GSM/DCS/PCS output power level. Usable range is 5 to 19 for GSM, 0 to 15 for DCS/PCS.

  • Page 103: Calibration

    6. SERVICE AND CALIBRATION 6.2 Calibration 6.2.1 Overview The calibration values of the phone reside on the Flash. The contents of the Flash can be read by the service software and saved as a file. This is advisable when there is need to retain that information, e.g.
  • Page 104 6. SERVICE AND CALIBRATION 6.2.3 Equipment Setup GSM Test Set(8960) GPIB Cable Mobile Switch Cable GPIB Power Supply Cable Battery SIMulator Figure 7-1. Calibration Equipment List 6.2.4 Calibration steps A. RX Calibration In order for the RSSI measurements to be within the GSM specifications, some calibration is necessary.
  • Page 105 6. SERVICE AND CALIBRATION Procedure a) Initialize phone by clicking Initialize button. b) Set the GSM test equipment CW mode and BCH and TCH of GSM test equipment ‘0’, same with phone. c) Set the power of GSM test equipment ‘74dBm’. d) Click the PM Start button, then the value, received power by phone, is displayed in PM measurement window at service software.
  • Page 106 6. SERVICE AND CALIBRATION Table 6-2. Tx Target Powers DCS [dBM] PCS [dBM] Power Level GSM [dBM] Procedure a) Initialize phone by clicking Initialize button. b) Set the BCH and TCH of the phone 190 for GSM850 and 661 for PCS1900. Of cause you have to match test equipment’s BCH and TCH ARFCN with this value.
  • Page 107 6. SERVICE AND CALIBRATION 6.2.5 Test JIG Operation JIG Power Equipment Description Power Supply Usually 4.0V DC Adaptor 9.5V, 500mA JIG DIP Switch Switch Number Name Description Switch 1 ADI_REMOTE In On state phone is awaked. Not used - OFF state Switch 2 TI_REMOTE In On state phone is awaked.

  • Page 108: Circuit Daigram

    7. CIRCUIT DIAGRAM o i t & MG200 i t o - 107 -...

  • Page 109: Audio/Midi

    7. CIRCUIT DIAGRAM o i t & MG200 i t o - 108 -...

  • Page 110: Mmi

    7. CIRCUIT DIAGRAM o i t & MG200 i t o - 109 -...

  • Page 111: Camera/Sim/Vib

    7. CIRCUIT DIAGRAM o i t & MG200 i t o - 110 -...

  • Page 112: Lcd I/F

    7. CIRCUIT DIAGRAM c t i o i t & MG200 i t o - 111 -...

  • Page 113: Re Rita

    7. CIRCUIT DIAGRAM : n i t s i o i t & MG200 i t o - 112 -...

  • Page 114: Pcb Layout

    8. PCB LAYOUT - 113 -...
  • Page 115 8. PCB LAYOUT - 114 -...

  • Page 116: Engineering Mode

    9. ENGINEERING MODE 9. ENGINEERING MODE Engineering mode is designed to allow a service man/engineer to view and test the basic functions provided by a handset. The key sequence for switching the engineering mode on is “2945#*#” Select. Pressing END will switch back to non-engineering mode operation.

  • Page 117: Standalone Test

    10. STAND ALONE TEST 10. STANDALONE TEST 10.1 Setting Method 10.1.1 COM Port In the “Dialog Menu”, select the values as explained below. • Port : select a correct COM port • Baudrate : 115200 • Leave the rest as default values 10.1.2 Tx Test 1.

  • Page 118: Exploded View & Replacement Part List

    11. EXPLODED VIEW & REPLACEMENT PART LIST 11. EXPLODED VIEW & REPLACEMENT PART LIST 11.1 Exploded View - 117 -...

  • Page 120: Replacement Parts

    This Chapter is used for reference, Part order <Mechanic component> is ordered by SBOM standard on GCSC. Location Level Description Part Number Specification Color Remark GSM(FOLDER) TGFF0053001 MG200 TCLSV Silver AAAY00 ADDITION AAAY0070601 MG200 Telcel Silver ACGA00 COVER ASSY,BATTERY ACGA0009201 C2000 USASV Silver...
  • Page 121 MWAE00 WINDOW,CAMERA MWAE0006101 C2000 USASV ACGM00 COVER ASSY,REAR ACGM0044401 C2000 USASV Silver MCCC00 CAP,EARPHONE JACK MCCC0020401 C2000 USASV Silver MCIA00 CONTACT,ANTENNA MCIA0010902 MG200 Golde MCJN00 COVER,REAR MCJN0030301 C2000 USASV Silver MDAN00 DECO,SPEAKER MDAN0003701 C2000 USASV Blue Silver MFBC00 FILTER,SPEAKER MFBC0012401...
  • Page 122 11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark MPBZ00 MPBZ0070701 C2000 USASV Black AKAZ00 KEYPAD ASSY AKAZ0007701 C2000 USASV Silver GMZZ00 SCREW MACHINE GMZZ0015101 1.4 mm,3.0 mm,MSWR3(FN) ,N ,+ ,- , Silver MCCF00 CAP,MOBILE SWITCH MCCF0021101 C2000 USASV...

  • Page 123: Replacement Parts

    ERHY0000208 22 ohm,1/16W,J,1005,R/TP RES,CHIP ERHY0000254 4.7K ohm,1/16W,J,1005,R/TP RES,CHIP ERHY0000254 4.7K ohm,1/16W,J,1005,R/TP SPCY00 PCB,FLEXIBLE SPCY0042201 POLYI ,0.5 mm, MULTI-5 ,MG200 SJMY00 VIBRATOR,MOTOR SJMY0002602 3.0 V,80 mA,12*3.4 , ASSY ,111 dB,32 ohm,13*2.7T ,porpn 1.5mm , Wire SURY00 RECEIVER SURY0005403 10mm SVCY00 CAMERA SVCY0004001 MAIN ,128*160 (1.8 inch)+96*64 (MONO) ,35.8*47*4.8(t)
  • Page 124 Location Level Description Part Number Specification Color Remark SAKY00 PCB ASSY,SIDEKEY SAKY0004801 C2000 Sidekey Dome Button Silver SAFF00 PCB ASSY,MAIN,SMT SAFF0051101 MG200 TCLSV Silver PCB ASSY,MAIN,SMT SAFC00 SAFC0046901 MG200 TCLSV Silver BOTTOM C101 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP C102 CAP,CERAMIC,CHIP ECCH0000112...
  • Page 125 11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C204 CAP,CERAMIC,CHIP ECCH0000159 22 nF,16V,K,X7R,HD,1005,R/TP C205 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C206 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C209 CAP,CERAMIC,CHIP ECCH0000129...
  • Page 126 11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C411 CAP,CERAMIC,CHIP ECCH0005801 2.2 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP C412 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C413 CAP,CERAMIC,CHIP ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP C414 CAP,CERAMIC,CHIP ECCH0004903 1 uF,6.3V ,Z ,Y5V ,TC ,1005 ,R/TP C415 CAP,CERAMIC,CHIP ECCH0000167...
  • Page 127 11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C634 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C635 CAP,CERAMIC,CHIP ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP C636 CAP,CERAMIC,CHIP ECCH0000142 820 pF,50V,K,X7R,HD,1005,R/TP C637 CAP,CERAMIC,CHIP ECCH0000175 2.7 pF,50V ,B ,NP0 ,TC ,1005 ,R/TP C638 CAP,CERAMIC,CHIP ECCH0000128...
  • Page 128 11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark FB302 FILTER,BEAD,CHIP SFBH0007102 10 ohm,1005 ,Ferrite Bead FL501 FILTER,EMI/POWER SFEY0007201 SMD ,Coated type , CSP Package , 6ch ESD/EMI Filter FL502 FILTER,EMI/POWER SFEY0007201 SMD ,Coated type , CSP Package , 6ch ESD/EMI Filter FL503 FILTER,EMI/POWER SFEY0007201...
  • Page 129 11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R118 RES,CHIP ERHY0000236 620 ohm,1/16W,J,1005,R/TP R119 RES,CHIP ERHY0000236 620 ohm,1/16W,J,1005,R/TP R120 RES,CHIP ERHY0000236 620 ohm,1/16W,J,1005,R/TP R121 RES,CHIP ERHY0000236 620 ohm,1/16W,J,1005,R/TP R122 RES,CHIP ERHY0000236 620 ohm,1/16W,J,1005,R/TP R123 RES,CHIP ERHY0000236...
  • Page 130 11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R322 RES,CHIP ERHY0001102 0.2 ohm,1/4W ,F ,2012 ,R/TP R323 RES,CHIP ERHY0000287 220K ohm,1/16W,J,1005,R/TP R324 RES,CHIP ERHY0000287 220K ohm,1/16W,J,1005,R/TP R330 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP R331 RES,CHIP ERHY0000273 47K ohm,1/16W,J,1005,R/TP R401...
  • Page 131 X101 X-TAL EXXY0015601 X601 VCTCXO EXSK0005601 26 MHz,2 PPM,10 pF,SMD ,3.2*2.5*1.0 , SAFD00 PCB ASSY,MAIN,SMT TOP SAFD0045601 MG200 TCLSV Silver C203 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP C207 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP...
  • Page 132 11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C210 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP C211 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP C212 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C215 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP C216 CAP,CERAMIC,CHIP ECCH0000117...
  • Page 133 11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R300 RES,CHIP ERHY0000225 200 ohm,1/16W,J,1005,R/TP R301 RES,CHIP ERHY0000225 200 ohm,1/16W,J,1005,R/TP R302 RES,CHIP ERHY0000225 200 ohm,1/16W,J,1005,R/TP R303 RES,CHIP ERHY0000225 200 ohm,1/16W,J,1005,R/TP R304 RES,CHIP ERHY0000225 200 ohm,1/16W,J,1005,R/TP R305 RES,CHIP ERHY0000225...

  • Page 134: Accessory

    11. EXPLODED VIEW & REPLACEMENT PART LIST 11.3 Accessory Note : This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC. Location Level Description Part Number Specification Color Remark 3.7 V,1000 mAh,1 CELL,PRISMATIC,GC200(K-PJT) SBPL00 BATTERY PACK,LI-ION SBPL0076308 Silver BATTERY, 523450 INNERPACK...

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