Table Of Contents - Sony HCD-GN660 Service Manual

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1. SERVICING NOTES
2. GENERAL
Location of Controls ........................................................ 5
3. DISASSEMBLY
3-1. Disassembly Flow ........................................................... 7
3-2. Case ................................................................................. 8
3-3. Loading Panel Assy ......................................................... 8
3-4. Front Panel Assy .............................................................. 9
3-5. CD Mechanism Deck (CDM74-F1BD81) ...................... 9
3-6. Tape Mechanism Deck, Game Board .............................. 10
3-7. CD Switch Board, Panel Board ....................................... 10
3-8. Switch Board ................................................................... 11
3-9. Tuner Pack ....................................................................... 11
3-10. Primary Board ................................................................. 12
3-11. Rear Panel ........................................................................ 12
3-12. Main Board ...................................................................... 13
3-13. Surround Board, PA Board .............................................. 13
3-14. Power Transformer .......................................................... 14
3-15. Driver Board, SW Board ................................................. 14
3-16. BD Board, Optical Pick-Up (KSM-215DCP/C2NP) ...... 15
3-17. Sensor Board ................................................................... 15
3-18. Motor (TB) Board ........................................................... 16
3-19. Motor (LD) Board ........................................................... 16
4. TEST MODE
5. MECHANICAL ADJUSTMENTS
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L 13942296513
6. ELECTRICAL ADJUSTMENTS
Deck section .................................................................... 21
CD Section ...................................................................... 22
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
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radiation exposure.
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TABLE OF CONTENTS

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This appliance is classified as
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a CLASS 1 LASER product.
This label is located on the rear
exterior.
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7. DIAGRAMS
7-1. Circuit Board Location .................................................... 26
7-2. Block Diagram - CD Section - ...................................... 28
7-3. Block Diagram - Tuner/Tape Deck Section - ................ 29
7-4. Block Diagram - Main Section - ................................... 30
7-5. Block Diagram - Display/Power Section - .................... 31
7-6. Printed Wiring Board - BD Board - .............................. 32
7-7. Schematic Diagram - BD Board - ................................. 33
7-8. Printed Wiring Board - CD Mechanism Board - ........... 34
7-9. Schematic Diagram - CD Mechanism Board - ............. 35
7-10. Printed Wiring Boards - Main Board - .......................... 36
7-11. Schematic Diagram - Main Board (1/3) - ..................... 37
7-12. Schematic Diagram - Main Board (2/3) - ..................... 38
7-13. Schematic Diagram - Main Board (3/3) - ..................... 39
7-14. Printed Wiring Boards
- Game, CD Switch Board - ........................................... 40
7-15. Schematic Diagram
- Game, CD Switch Board - ........................................... 41
7-16. Printed Wiring Board - PA Board - ............................... 42
7-17. Schematic Diagram - PA Board - .................................. 43
7-18. Schematic Diagram -Panel Board (1/2) - ...................... 44
7-19. Schematic Diagram -Panel Board (2/2) - ...................... 45
7-20. Printed Wiring Board - Panel Board - ........................... 46
7-21. Printed Wiring Boards - Primary Board - ..................... 47
7-22. Schematic Diagram - Primary Board - .......................... 48
7-23. Schematic Diagram - Surround Board - ........................ 48
7-24. Printed Wiring Board - Surround Board - ..................... 49
7-25. IC Block Diagram ........................................................... 50
7-26. IC Pin Function Description ............................................ 51
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3 8. 6 7 EXPLODED VIEWS 1 3 1 5
8-1. Case, Rear Panel Section ................................................. 57
8-2. Front Panel Section ......................................................... 58
8-3. Chassis Section ................................................................ 59
8-4. CD Mechanism Deck Section-1
(CDM74-F1BD81) .......................................................... 60
8-5. CD Mechanism Deck Section-2
(CDM74-F1BD81) .......................................................... 61
9. ELECTRICAL PARTS LIST
SAFETY-RELATED COMPONENT WARNING!!
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COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH
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MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
HCD-GN660/GN770/GX9000
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0 5 8 2 9 9 4 2 8
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