Table Of Contents - Sony XR-CA370 Service Manual

XR-CA370/CA370X

TABLE OF CONTENTS

1. GENERAL
Location of Controls ....................................................... 3
Setting the Clock ............................................................. 3
2. DISASSEMBLY
2-1. Disassembly Flow ........................................................... 6
2-2. Sub Panel ......................................................................... 6
2-3. Mechanism Deck (MG-36SZ13-32) ............................... 7
2-4. MAIN Board ................................................................... 7
2-5. Heat Sink ......................................................................... 8
2-6. Bracket (MD) .................................................................. 8
2-7. DC Motor (Capstan/Reel) (M901) ................................. 9
2-8. Main Belt, Sub Belt (C) .................................................. 9
2-9. Magnetic Head (Playback) (HP901) .............................. 10
3. MECHANICAL ADJUSTMENTS
4. ELECTRICAL ADJUSTMENTS
Tape Deck Section .......................................................... 11
Tuner Section .................................................................. 12
5. DIAGRAMS
5-1. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 13
5-2. Printed Wiring Board - MAIN Board - ........................ 15
5-3. Schematic Diagram - MAIN Board (1/2) - .................. 16
5-4. Schematic Diagram - MAIN Board (2/2) - .................. 17
5-5. Printed Wiring Board - CONTROL Board - ................ 18
5-6. Schematic Diagram - CONTROL Board - ................... 19
5-7. IC Pin Function Description ........................................... 20
6. EXPLODED VIEWS
6-1. General Section ............................................................... 22
6-2. Front Panel Section ......................................................... 23
6-3. Main Board Section ........................................................ 24
6-4. Mechanism Deck Section (MG-36SZ13-32) ................. 25
7. ELECTRICAL PARTS LIST
2
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
• Do not touch the soldering iron on the same conductor of the
• Be careful not to apply force on the conductor when soldering
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
....................... 11
......................... 11
............................... 26
ing repairing.
circuit board (within 3 times).
or unsoldering.
aged by heat.