Table Of Contents - LG L1150 Service Manual

1. Introduction ..................................... 5
1.1 Purpose................................................... 5
1.2 Regulatory Information............................ 5
1.2.1. Security........................................ 5
1.2.2. Incidence of Harm........................ 5
1.2.3. Changes in Service...................... 5
1.2.4. Maintenance Limitations .............. 5
1.2.5. Notice of Radiated Emissions...... 6
1.2.6. Pictures........................................ 6
1.2.7. Interference and Attenuation ....... 6
1.2.8. Electrostatic Sensitive Devices.... 6
1.3 Abbreviation ............................................ 6
2. General Performance...................... 8
2.1 H/W Feature............................................ 8
2.2 Technical Specification ......................... 10
3. H/W Circuit Description................ 15
3.1. RF Circuit ............................................. 15
3.1.1. Front End Part ........................... 15
3.1.2. Receiver Part ............................. 16
3.1.3. Synthesizer Part ........................ 18
3.1.4. Transmitter Part ......................... 19
3.1.5. Power Amplifier.......................... 20
3.1.6. 26 MHz Clock ............................ 20
3.1.7. Power Supplies and
Control Signals .......................... 21
3.2. Digital Baseband(DBB) Processor....... 22
3.2.1. General Description ................... 22
3.2.2. Block Description ....................... 23
3.2.3. External Devices connected to
memory interface ....................... 24
3.2.4. RF Interface
(TPU, TSP block)....................... 24
3.2.5. SIM interface.............................. 24
3.2.6. UART Interface .......................... 25
3.2.7. GPIO map.................................. 26

Table of Contents

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3.3. Analog Baseband(ABB) Processor...... 27
3.3.1. General Description ................... 27
3.3.2. Audio Signal Processing &
Interface..................................... 28
3.3.3. Audio uplink processing............. 28
3.3.4. Audio downlink processing ........ 29
3.3.5. Baseband Codec (BBC) ............ 30
3.3.6. Voltage Regulation (VREG)....... 31
3.3.7. ADC Channels ........................... 32
3.3.8. Charging .................................... 33
3.3.9. Switch ON/OFF.......................... 33
3.3.10. Memory.................................... 34
3.3.11. Display & FPC Interface .......... 34
3.3.12. Keypad Switching &
Scanning.................................. 36
3.3.13. Keypad back-light
Illumination............................... 37
3.3.14. LCD Illumination ...................... 37
3.4. Camera Circuit ..................................... 38
A. BaseBand Components
(Component Side) ........................... 41
B. BaseBand Components
(Keypad Side).................................. 42
C. Digital Baseband (DBB)
Processor ........................................ 42
D. Analog Main Processor (ABB) ........ 43
E. Memory ........................................... 44
F. Voltage Regulation (LDO) ............... 45
G. MIDI ................................................ 46
H. Charging.......................................... 46
I. KEY Back-light Illumination............... 47
J. SIM................................................... 47
K. Keypad ............................................ 48
L. Infrared ............................................ 48
M. CAMERA ........................................ 49
N. Charge Indicating LED .................... 49