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ATX Thermal/Mechanical Design Information
6.3
Environmental Reliability Testing
6.3.1
Structural Reliability Testing
Structural reliability tests consist of unpackaged, board-level vibration and shock tests
of a given thermal solution in the assembled state. The thermal solution should meet
the specified thermal performance targets after these tests are conducted; however,
the test conditions outlined here may differ from your own system requirements.
6.3.1.1
Random Vibration Test Procedure
Duration: 10 min/axis, 3 axes
Frequency Range: 5 Hz to 500 Hz
Power Spectral Density (PSD) Profile: 3.13 G RMS
Figure 6-4. Random Vibration PSD
6.3.1.2
Shock Test Procedure
Recommended performance requirement for a motherboard:
Quantity:
total 18 drops).
Profile:
Setup:
Thermal and Mechanical Design Guidelines
0.1
(20, 0.02)
(5, 0.01)
0.01
5 Hz
0.001
1
10
3 drops for + and - directions in each of 3 perpendicular axes (i.e.,
50 G trapezoidal waveform, 170 in/sec minimum velocity change.
Mount sample board on test fixture.
3.13GRMS (10 minutes per axis)
100
Frequency (Hz)
(500, 0.02)
500 Hz
1000
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