Sony MEX-XB100BT Service Manual page 57

Bluetooth
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Ref. No.
Part No.
Description
R1602
1-248-357-11
RES-CHIP
R1603
1-218-937-11
METAL CHIP
R1604
1-248-357-11
RES-CHIP
* R1605
1-250-526-11
METAL CHIP
R1606
1-248-357-11
RES-CHIP
R1607
1-218-937-11
METAL CHIP
R1608
1-248-357-11
RES-CHIP
R1612
1-248-357-11
RES-CHIP
R1613
1-218-937-11
METAL CHIP
R1614
1-248-357-11
RES-CHIP
R1615
1-248-357-11
RES-CHIP
R1616
1-218-937-11
METAL CHIP
R1620
1-218-937-11
METAL CHIP
R1622
1-218-937-11
METAL CHIP
R1623
1-218-937-11
METAL CHIP
R1624
1-218-937-11
METAL CHIP
R1625
1-218-937-11
METAL CHIP
R1626
1-218-937-11
METAL CHIP
R1627
1-216-864-11
SHORT CHIP
*************************************************************
KEY BOARD
**********
When the KEY board is defective, replace the FRONT PANEL (SV) ASSY (Ref. No.
FP1).
*************************************************************
A-2066-255-A
MAIN BOARD, COMPLETE (US, CND) (See Note)
A-2066-256-A
MAIN BOARD, COMPLETE (Except US, CND)
********************
4-558-661-01
SHEET, HEAT TRANSFER IC
7-685-134-19
SCREW +P 2.6X8 TYPE2 NON-SLIT
7-685-785-09
SCREW +PTT 2X10 (S)
7-685-792-09
SCREW +PTT 2.6X6 (S)
< CAPACITOR >
* C03
1-116-738-11
CERAMIC CHIP 1uF
C05
1-118-386-11
CERAMIC CHIP 0.1uF
C010
1-116-734-11
CERAMIC CHIP 1uF
C102
1-116-716-11
CERAMIC CHIP 10uF
* C103
1-116-738-11
CERAMIC CHIP 1uF
C104
1-118-290-11
CERAMIC CHIP 0.001uF
C105
1-118-477-11
CERAMIC CHIP 2.2uF
C106
1-118-290-11
CERAMIC CHIP 0.001uF
* C107
1-116-738-11
CERAMIC CHIP 1uF
C108
1-118-373-11
CERAMIC CHIP 0.01uF
C109
1-118-347-11
CERAMIC CHIP 0.1uF
C304
1-100-382-11
ELECT CHIP
C305
1-100-382-11
ELECT CHIP
C306
1-100-382-11
ELECT CHIP
C307
1-100-382-11
ELECT CHIP
C401
1-128-992-21
ELECT CHIP
C402
1-118-361-11
CERAMIC CHIP 0.1uF
C404
1-162-923-11
CERAMIC CHIP 47PF
C405
1-162-923-11
CERAMIC CHIP 47PF
C406
1-162-923-11
CERAMIC CHIP 47PF
C407
1-162-923-11
CERAMIC CHIP 47PF
C408
1-100-381-11
ELECT CHIP
Note: When the complete MAIN board is replaced, it is necessary to replace knob (VOL) (SV) assy simultaneously.
Also, the destination setting, Bluetooth operation check and Bluetooth information writing is necessary. Refer to
"DESTINATION SETTING METHOD" on page 4, "BLUETOOTH FUNCTION CHECKING METHOD USING
A CELLULAR PHONE" on page 8 and "BLUETOOTH INFORMATION WRITING METHOD" on page 9.
Remark
5.6
1%
1/3W
47
5%
1/16W
5.6
1%
1/3W
20K
1%
1/16W
5.6
1%
1/3W
47
5%
1/16W
5.6
1%
1/3W
5.6
1%
1/3W
47
5%
1/16W
* C420
5.6
1%
1/3W
5.6
1%
1/3W
* C421
47
5%
1/16W
47
5%
1/16W
* C422
47
5%
1/16W
47
5%
1/16W
47
5%
1/16W
47
5%
1/16W
47
5%
1/16W
0
(See Note)
(Including AMP board)
10%
6.3V
10%
16V
20%
16V
10%
16V
10%
6.3V
10%
50V
10%
6.3V
10%
50V
10%
6.3V
10%
50V
10%
25V
4.7uF
20%
35V
4.7uF
20%
35V
4.7uF
20%
35V
4.7uF
20%
35V
47uF
20%
25V
10%
50V
5%
50V
5%
50V
5%
50V
5%
50V
10uF
20%
16V
Ref. No.
Part No.
Description
C409
1-100-381-11
ELECT CHIP
C410
1-100-381-11
ELECT CHIP
C411
1-100-381-11
ELECT CHIP
C412
1-116-716-11
CERAMIC CHIP 10uF
C413
1-118-386-11
CERAMIC CHIP 0.1uF
C417
1-116-728-11
CERAMIC CHIP 2.2uF
C418
1-162-923-11
CERAMIC CHIP 47PF
C419
1-162-923-11
CERAMIC CHIP 47PF
1-116-738-11
CERAMIC CHIP 1uF
1-116-738-11
CERAMIC CHIP 1uF
1-116-738-11
CERAMIC CHIP 1uF
C423
1-118-389-11
CERAMIC CHIP 0.022uF
C424
1-118-389-11
CERAMIC CHIP 0.022uF
C425
1-116-728-11
CERAMIC CHIP 2.2uF
C426
1-116-734-11
CERAMIC CHIP 1uF
C427
1-118-386-11
CERAMIC CHIP 0.1uF
C428
1-114-599-21
ELECT CHIP
C429
1-118-361-11
CERAMIC CHIP 0.1uF
C441
1-164-866-11
CERAMIC CHIP 47PF
C442
1-164-866-11
CERAMIC CHIP 47PF
C443
1-164-866-11
CERAMIC CHIP 47PF
C444
1-164-866-11
CERAMIC CHIP 47PF
C445
1-164-866-11
CERAMIC CHIP 47PF
C446
1-114-599-21
ELECT CHIP
C501
1-165-492-21
ELECT CHIP
C502
1-165-492-21
ELECT CHIP
C503
1-118-345-11
CERAMIC CHIP 0.01uF
C504
1-118-391-11
CERAMIC CHIP 0.01uF
C505
1-118-386-11
CERAMIC CHIP 0.1uF
C506
1-118-386-11
CERAMIC CHIP 0.1uF
C507
1-118-386-11
CERAMIC CHIP 0.1uF
C508
1-118-290-11
CERAMIC CHIP 0.001uF
C509
1-118-386-11
CERAMIC CHIP 0.1uF
C510
1-118-386-11
CERAMIC CHIP 0.1uF
C511
1-118-386-11
CERAMIC CHIP 0.1uF
C512
1-118-386-11
CERAMIC CHIP 0.1uF
C515
1-118-386-11
CERAMIC CHIP 0.1uF
C516
1-116-734-11
CERAMIC CHIP 1uF
C517
1-118-386-11
CERAMIC CHIP 0.1uF
C518
1-164-848-11
CERAMIC CHIP 8PF
C519
1-118-386-11
CERAMIC CHIP 0.1uF
C520
1-118-386-11
CERAMIC CHIP 0.1uF
C521
1-118-386-11
CERAMIC CHIP 0.1uF
C522
1-164-848-11
CERAMIC CHIP 8PF
C523
1-118-386-11
CERAMIC CHIP 0.1uF
C524
1-164-850-11
CERAMIC CHIP 10PF
C525
1-118-386-11
CERAMIC CHIP 0.1uF
C526
1-116-711-11
CERAMIC CHIP 22uF
C527
1-118-386-11
CERAMIC CHIP 0.1uF
C528
1-164-850-11
CERAMIC CHIP 10PF
C529
1-118-386-11
CERAMIC CHIP 0.1uF
C530
1-116-711-11
CERAMIC CHIP 22uF
C531
1-164-854-11
CERAMIC CHIP 15PF
C532
1-118-386-11
CERAMIC CHIP 0.1uF
C533
1-164-854-11
CERAMIC CHIP 15PF
C534
1-116-711-11
CERAMIC CHIP 22uF
C535
1-118-386-11
CERAMIC CHIP 0.1uF
MEX-XB100BT
AMP
KEY
MAIN
Remark
10uF
20%
16V
10uF
20%
16V
10uF
20%
16V
10%
16V
10%
16V
10%
10V
5%
50V
5%
50V
10%
6.3V
(US, CND)
10%
6.3V
(US, CND)
10%
6.3V
(US, CND)
10%
25V
10%
25V
10%
10V
20%
16V
10%
16V
10uF
20%
35V
10%
50V
5%
50V
5%
50V
5%
50V
5%
50V
5%
50V
10uF
20%
35V
100uF
20%
10V
100uF
20%
10V
10%
25V
10%
50V
10%
16V
10%
16V
10%
16V
10%
50V
10%
16V
10%
16V
10%
16V
10%
16V
10%
16V
20%
16V
10%
16V
0.5PF
50V
10%
16V
10%
16V
10%
16V
0.5PF
50V
10%
16V
0.5PF
50V
10%
16V
20%
16V
10%
16V
0.5PF
50V
10%
16V
20%
16V
5%
50V
10%
16V
5%
50V
20%
16V
10%
16V
57

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