Sony MEX-XB100BT Service Manual page 36

MEX-XB100BT
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
For Printed Wiring Boards.
Note:
• X : Parts extracted from the component side.
• Y : Parts extracted from the conductor side.
• : Internal component.
f
• : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen
(Conductor Side) from the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Component Side) the parts face are indicated.
Caution:
Pattern face side: Parts on the pattern face side seen
(SIDE B) from the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(SIDE A) the parts face are indicated.
• Indication of transistor.
C
Q
These are omitted.
B E
Note 1: When the complete MAIN board is replaced, it is
necessary to replace knob (VOL) (SV) assy simul-
taneously. Also, the destination setting, Bluetooth
operation check and Bluetooth information writing
is necessary. Refer to "DESTINATION SETTING
METHOD" on page 4, "BLUETOOTH FUNCTION
CHECKING METHOD USING A CELLULAR
PHONE" on page 8 and "BLUETOOTH INFORMA-
TION WRITING METHOD" on page 9.
Note 2: When the complete AMP board is replaced, re-
fer to "NOTE OF REPLACING THE IC1600 ON
THE AMP BOARD AND THE COMPLETE AMP
BOARD" on page 6.
MEX-XB100BT
For Schematic Diagrams.
Note:
• All capacitors are in μF unless otherwise noted. (p: pF) 50
WV or less are not indicated except for electrolytics and
tantalums.
• All resistors are in Ω and 1/4 W or less unless otherwise
specifi ed.
• : Internal component.
f
• C : Panel designation.
Note: Note:
The components identi- Les composants identifi és
fi ed by mark 0 or dotted par une marque 0 sont
line with mark 0 are criti- critiques pour la sécurité.
cal for safety. Ne les remplacer que par
Replace only with part une pièce portant le nu-
number specifi ed. méro spécifi é.
• A : B+ Line.
• Power voltages is dc 14.4V and fed with regulated dc
power supply from ACC and BATT cords.
• Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
no mark : TUNER
( ) : CD PLAY
* : Impossible to measure
• Voltages are taken with VOM (Input impedance 10 M).
Voltage variations may be noted due to normal production
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F : AUDIO
f : TUNER
: SIRIUSXM
h
J : CD PLAY
d : USB
: AUX
E
a : Bluetooth
N : MIC
Note 1: When the complete MAIN board is replaced, it is
necessary to replace knob (VOL) (SV) assy simul-
taneously. Also, the destination setting, Bluetooth
operation check and Bluetooth information writing
is necessary. Refer to "DESTINATION SETTING
METHOD" on page 4, "BLUETOOTH FUNCTION
CHECKING METHOD USING A CELLULAR
PHONE" on page 8 and "BLUETOOTH INFORMA-
TION WRITING METHOD" on page 9.
Note 2: When the complete AMP board is replaced, re-
fer to "NOTE OF REPLACING THE IC1600 ON
THE AMP BOARD AND THE COMPLETE AMP
BOARD" on page 6.
• Waveforms
– MAIN Board –
IC705 rk (PIO18)
1
3.5 Vp-p
22.7 s
1 V/DIV, 10 s/DIV
IC705 rl (PIO19)
2
3.5 Vp-p
354 ns
1 V/DIV, 200 ns/DIV
3 IC705 yj (XO)
3.5 Vp-p
59.2 ns
1 V/DIV, 20 ns/DIV
IC503 yk (RTC_X2)
4
1.8 Vp-p
30.4 s
500 mV/DIV, 10 s/DIV
IC503 ua (XTAL)
5
3.5 Vp-p
74.8 ns
1 V/DIV, 20 ns/DIV
IC503 <zv/ (USB_X2)
6
1 Vp-p
21.2 ns
500 mV/DIV, 10 ns/DIV
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