Figure 5. Ich 241-Ball Bga* Csp Quadrant Layout (Top View); Figure 6. Firmware Hub (Fwh) Packages - Intel 815 Design Manual

Chipset platform for use with universal socket 370
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Component Quadrant Layouts
Figure 5 illustrates the relative signal quadrant locations on the ICH ballout. It does not represent
the actual ballout. Refer to the Intel
Datasheet for the actual ballout.

Figure 5. ICH 241-Ball BGA* CSP Quadrant Layout (Top View)

Figure 6. Firmware Hub (FWH) Packages

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®
Pin 1 corner
AC'97,
SMBus
FWH interface
(40-lead TSOP)
82801AA (ICH) and 82801AB (ICH0) I/O Controller Hub
PCI
ICH
LPC
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®
Intel
815 Chipset Platform Design Guide
Processor
Hub interface
IDE
quad_ICH
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2
1
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27
FWH interface
26
(32-lead PLCC,
0.450" x 0.550")
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Top view
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pkg_FWH
R

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