Alternative Heatsink Thermal Adherence To Quad-Core Intel® Xeon® Processor L5400 Series Thermal Profile; A-3 1U Alternative Heatsink Thermal Adherence To Quad-Core Intel® Xeon Processor L5400 Series Thermal Profile - Intel 5400 Series Design Manuallines

1U Alternative Heatsink Thermal/Mechanical Design
x = Processor power value (W)
Figure A-3
Profile to the Quad-Core Intel® Xeon® Processor E5400 Series Thermal Profile
specification. The 1U alternative solution meets the Thermal Profile with 0.5°C margin
at the upper end (TDP). By designing to Thermal Profile, it is ensured that no
measurable performance loss due to TCC activation is observed under the given
environmental conditions.
Figure A-3. 1U Alternative Heatsink Thermal Adherence to Quad-Core Intel® Xeon®
Processor L5400 Series Thermal Profile
65
60
55
50
45
40
35
0
Quad-Core Intel® Xeon® Processor 5400 Series TMDG
below shows the comparison of this reference thermal solution's Thermal
@ TDP
T
C AS E_M A X
Y = 0.298 * X + 43.2
5 10 20 25
15
Therm al Profile
1U Alternative Heatsink
Y = 0.331 * X + 40
30 35 40 45 50
§
55 60 65 70 75 80
55