Samsung DDR3 SDRAM Product Manual page 9

General Information
78 Ball FBGA for 1Gb E-die (x4/x8)
7.50 ± 0.10
0.80 x 8 = 6.40
(Datum A)
0.80 1.60
9 8 7 6 5 4 3 2 1
A
B
C
(Datum B)
D
E
F
G
H
J
K
L
M
N
78 - ∅0.45 Solder ball
(Post Reflow ∅0.05 ± 0.05)
0.2 M A B
Bottom
96 Ball FBGA for 1Gb E-die (x16)
7.50 ± 0.10
0.80 x 8 = 6.40
0.80 1.60
9 8 7 6 5 4 3 2 1
A
(Datum A)
B
C
D
(Datum B) E
F
G
H
J
K
L
M
N
P
R
T
96 - ∅0.45 Solder ball
(Post Reflow ∅0.05 ± 0.05)
0.2 M A B
Bottom
A
#A1 INDEX MARK
3.20
(0.95)
MOLDING AREA
(1.90)
A
#A1 INDEX MARK
3.20
(0.95)
MOLDING AREA
(1.90)
7.50 ± 0.10
#A1
B
Top
7.50 ± 0.10
#A1
B
Top
DDR3 SDRAM
0.35 ± 0.05
1.10 ± 0.10
0.35 ± 0.05
1.10 ± 0.10
December 2008