HP Compaq Pro 6300 Series Microtower Maintenance And Service Manual page 139

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2.
Secure the locking lever. If reusing the existing heat sink, go to step 3. If using a new heat sink,
go to step 6.
Figure 7-37
3.
If reusing the existing heat sink, clean the bottom of the heat sink with the alcohol pad provided
in the spares kit.
CAUTION:
bottom of the heat sink with an alcohol pad supplied in the spares kit. After the alcohol has
evaporated, apply thermal grease to the top of the processor from the syringe supplied in the
spares kit.
4.
Apply the thermal grease provided in the spares kit to the top of the processor and install the
heat sink atop the processor.
5.
Go to step 7.
6.
If using a new heat sink, remove the protective covering from the bottom of the heat sink and
place it in position atop the processor.
7.
Secure the heat sink to the system board and system board tray.
CAUTION:
an X) to evenly seat the heat sink on the processor. This is especially important as the pins on
the socket are very fragile and any damage to them may require replacing the system board.
NOTE:
After installing a new processor onto the system board, always update the system ROM to
ensure that the latest version of the BIOS is being used on the computer. The latest system BIOS can
be found on the Web at: http://h18000.www1.hp.com/support/files.
130 Chapter 7 Removal and Replacement Procedures Small Form Factor (SFF) Chassis
Removing the processor
Before reinstalling the heat sink you must clean the top of the processor and the
Heat sink retaining screws should be tightened in diagonally opposite pairs (as in

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