Reliability; Thermal Considerations For Components - Intel D850MVSE Specification

Table 52 provides maximum case temperatures for D850MD/D850MV board components that are
sensitive to thermal changes. The operating temperature, current load, or operating frequency
could affect case temperatures. Maximum case temperatures are important when considering
proper airflow to cool the D850MD and D850MV boards.
Table 52.

Thermal Considerations for Components

Component
Intel Pentium 4 processor
Intel 82850 MCH
Intel 82801BA ICH2
For information about
Intel Pentium 4 processor datasheets and specification updates

2.13 Reliability

The mean time between failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The calculation is based on the Bellcore Reliability Prediction
Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estimate
repair rates and spare parts requirements.
The MTBF data is calculated from predicted data at 55 ºC.
D850MD and D850MV board MTBF: 110595.61 hours
Maximum Case Temperature
For processor case temperature, see processor datasheets and
processor specification updates
o
105 C (under bias)
o
109 C (under bias)
Technical Reference
Refer to
Section 1.3, page 18
83