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5.
Processor TDP requirements in Intel Dynamic Acceleration Technology mode is lesser than TDP in HFM.
o
6.
At Tj of 100
C
o
7.
At Tj of 50
C
o
8.
At Tj of 35
C
9.
4-M L2 cache
10.
2-M L2 cache
Table 20.
Power Specifications for the Intel Core 2 Duo Processor - Low Voltage
Processor
Symbol
Number
L7700
L7500
TDP
L7300
Symbol
Auto Halt, Stop Grant Power
P
AH,
at HFM V
CC
P
SGNT
at SuperLFM V
Sleep Power
P
at HFM V
SLP
CC
at SuperLFM V
Deep Sleep Power
P
at HFM V
DSLP
CC
at SuperLFM V
P
Deeper Sleep Power
DPRSLP
P
Intel® Enhanced Deeper Sleep Power
DC4
T
Junction Temperature
J
NOTES:
1.
The TDP specification should be used to design the processor thermal solution. The TDP is not the
maximum theoretical power the processor can generate.
2.
Not 100% tested. These power specifications are determined by characterization of the processor currents
at higher temperatures and extrapolating the values for the temperature indicated.
3.
As measured by the activation of the on-die Intel Thermal Monitor. The Intel Thermal Monitor's automatic
mode is used to indicate that the maximum T
4.
The Intel Thermal Monitor automatic mode must be enabled for the processor to operate within
specifications.
5.
Processor TDP requirements in Intel Dynamic Acceleration Technology mode is lesser than TDP in HFM.
o
6.
At Tj of 100
C.
o
7.
At Tj of 50
C.
o
8.
At Tj of 35
C.
9.
4-M L2 cache.
78
Core Frequency & Voltage
1.8 GHz & HFM V
CC
1.6 GHz & HFM V
CC
1.4 GHz & HFM V
CC
1.2 GHZ & LFM V
CC
0.80 GHZ & SuperLFM V
Parameter
CC
CC
CC
has been reached. Refer to
J
Thermal Specifications and Design Considerations
Thermal Design
Power
17
17
17
16.1
10.0
CC
Min
Typ
Max
0
Section 5.1
Unit
Notes
W
1, 4, 5, 6, 9
Unit
5.6
W
2, 5, 7
3.9
5.3
W
2, 5, 7
3.6
2.8
W
2, 5, 8
2.3
1.3
W
2, 8
0.8
W
2, 8
100
°C
3, 4
for more details.
Datasheet
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