Fan Header Current Capability; Thermal Considerations - Intel DCCP847DYE Specification

Intel Desktop Board DCP847SKE Technical Product Specification
2.5.2

Fan Header Current Capability

Table 18 lists the current capability of the fan headers.
Table 18. Fan Header Current Capability
Fan Header
Processor fan
2.6

Thermal Considerations

CAUTION
A chassis with a maximum internal ambient temperature of 58
inlet is a requirement. Whenever possible, use of a processor heat sink that provides
omni-directional airflow to maintain required airflow across the processor voltage
regulator area is recommended.
CAUTION
Failure to ensure appropriate airflow may result in reduced performance of both the
processor and/or voltage regulator or, in some instances, damage to the board.
All responsibility for determining the adequacy of any thermal or system design
remains solely with the system integrator. Intel makes no warranties or
representations that merely following the instructions presented in this document will
result in a system with adequate thermal performance.
CAUTION
Ensure that the ambient temperature does not exceed the board's maximum operating
temperature. Failure to do so could cause components to exceed their maximum case
temperature and malfunction. For information about the maximum operating
temperature, see the environmental specifications in Section 2.8.
CAUTION
The processor voltage regulator area (shown in Figure 15) can reach a temperature of
o
up to 97.5 C in an open chassis. Ensure that proper airflow is maintained in the
processor voltage regulator circuit. Failure to do so may result in shorter than
expected product lifetime.
50
Maximum Available Current
.1 A
o
C at the processor fan