1. Manuals
  2. Brands
  3. Intel Manuals
  4. Motherboard
  5. DG965MQ
  6. Specification

Intel DG965MQ Specification

Dg965mq technical product specification
Hide thumbs Also See for DG965MQ:
Table of Contents

Advertisement

Quick Links

Download this manual
Intel® Desktop Board
DG965MQ
Technical Product Specification
®
The Intel
Desktop Board DG965MQ may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current
characterized errata are documented in the Intel Desktop Board DG965MQ Specification Update.
August 2006
Order Number: D56013-001US

Advertisement

Table of Contents
loading

Related Manuals for Intel DG965MQ

Summary of Contents for Intel DG965MQ

  • Page 1 Order Number: D56013-001US ® The Intel Desktop Board DG965MQ may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board DG965MQ Specification Update.

  • Page 2: Revision History

    Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order.

  • Page 3: Intended Audience

    Intended Audience The TPS is intended to provide detailed, technical information about the Desktop Board DG965MQ and its components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences.
  • Page 4 Intel Desktop Board DG965MQ Technical Product Specification Other Common Notation Used after a signal name to identify an active-low signal (such as USBP0#) Gigabyte (1,073,741,824 bytes) GB/sec Gigabytes per second Gbit Gigabit (1, 073,741,824 bits) Kilobyte (1024 bytes) Kbit Kilobit (1024 bits)

  • Page 5: Table Of Contents

    1.4 System Memory ................16 1.4.1 Memory Configurations ............18 1.5 Intel ® G965 Express Chipset ............. 23 1.5.1 Intel G965 Graphics Subsystem..........23 1.5.2 USB ................... 26 1.5.3 Serial ATA Interfaces ............27 1.5.4 Parallel IDE Interface ............28 1.5.5...
  • Page 6 Intel Desktop Board DG965MQ Technical Product Specification 2.5 Interrupts ..................48 2.6 PCI Interrupt Routing Map ..............49 2.7 Connectors and Headers..............50 2.7.1 Back Panel Connectors ............51 2.7.2 Component-side Connectors and Headers ........ 52 2.8 Jumper Block .................. 61 2.9 Mechanical Considerations ..............
  • Page 7 Contents 5 Regulatory Compliance and Battery Disposal Information 5.1 Regulatory Compliance..............85 5.1.1 Safety Regulations..............85 5.1.2 European Union Declaration of Conformity Statement ....86 5.1.3 Product Ecology Statements........... 88 5.1.4 EMC Regulations ..............92 5.1.5 Product Certification Markings (Board Level)......93 5.2 Battery Disposal Information.............
  • Page 8 34. DC Loading Characteristics ............... 65 35. Fan Header Current Capability............65 36. Thermal Considerations for Components ..........69 37. Desktop Board DG965MQ Environmental Specifications ......70 38. BIOS Setup Program Menu Bar............72 39. BIOS Setup Program Function Keys............ 72 40.
  • Page 9 Product Description What This Chapter Contains Overview....................10 Online Support ...................15 Processor ....................15 System Memory ..................16 ® Intel G965 Express Chipset ...............23 Legacy I/O Controller ..................29 Audio Subsystem..................30 LAN Subsystem ..................32 Hardware Management Subsystem ...............34 1.10 Power Management ..................36...

  • Page 10: Overview

    Intel Desktop Board DG965MQ Technical Product Specification Overview 1.1.1 Feature Summary Table 1 summarizes the major features of the Desktop Board DG965MQ. Table 1. Feature Summary Form Factor microBTX Form Factor (10.40 inches by 10.50 inches [264.16 millimeters by 266.70 millimeters])

  • Page 11: Manufacturing Options

    1.1.2 Manufacturing Options Table 2 describes the manufacturing options. Not every manufacturing option is available in all marketing channels. Please contact your Intel representative to determine which manufacturing options are available to you. Table 2. Manufacturing Options One of the following: Audio subsystem •...

  • Page 12: Board Layout

    Intel Desktop Board DG965MQ Technical Product Specification 1.1.3 Board Layout Figure 1 shows the location of the major components. F G H OM18412 Figure 1. Major Board Components Table 3 lists the components identified in Figure 1.

  • Page 13: Board Components Shown In Figure 1

    High Definition Audio header Remote thermal sensor Serial ATA connectors [6] Front panel USB headers [2] Intel 82801HR/HH I/O Controller Hub (ICH8) Chassis intrusion header PCI Express x16 connector PCI Express x1 connector PCI Conventional bus add-in card connectors [2]...

  • Page 14: Block Diagram

    Intel Desktop Board DG965MQ Technical Product Specification 1.1.4 Block Diagram Figure 2 is a block diagram of the major functional areas. Gigabit Ethernet PCI Express x1 Interface Controller Connector PCI Express x1 Slot 1 Back Panel/Front Panel USB Ports Parallel ATA...

  • Page 15: Online Support

    Processor The board is designed to support the following processors: • Intel Core 2 Duo processor in an LGA775 socket with a 1066 or 800 MHz system bus • Intel Pentium D processor in an LGA775 processor socket with an 800 or 533 MHz system bus •...

  • Page 16: System Memory

    Intel Desktop Board DG965MQ Technical Product Specification System Memory The board has four DIMM sockets and supports the following memory features: • 1.8 V (only) DDR2 SDRAM DIMMs with gold-plated contacts • Unbuffered, single-sided or double-sided DIMMs with the following restriction: Double-sided DIMMS with x16 organization are not supported.

  • Page 17: Memory Operating Frequencies

    Product Description NOTE Regardless of the DIMM type used, the memory frequency will either be equal to or less than the processor system bus frequency. For example, if DDR2 800 memory is used with a 533 MHz system bus frequency processor, the memory will operate at 533 MHz.

  • Page 18: Memory Configurations

    Intel Desktop Board DG965MQ Technical Product Specification 1.4.1 Memory Configurations The Intel 82G965 GMCH supports the following types of memory organization: • Dual channel (Interleaved) mode. This mode offers the highest throughput for real world applications. Dual channel mode is enabled when the installed memory capacities of both DIMM channels are equal.

  • Page 19: Dual Channel (Interleaved) Mode Configuration With Two Dimms

    Product Description INTEGRATOR’S NOTE Regardless of the memory configuration used (dual channel, single channel, or flex mode), DIMM 0 of Channel A must always be populated. This is a requirement of the ICH8 Manageability Engine feature. 1.4.1.1 Dual Channel (Interleaved) Mode Configurations Figure 4 shows a dual channel configuration using two DIMMs.

  • Page 20: Dual Channel (Interleaved) Mode Configuration With Four Dimms

    Intel Desktop Board DG965MQ Technical Product Specification Figure 6 shows a dual channel configuration using four DIMMs. In this example, the combined capacity of the two DIMMs in Channel A equal the combined capacity of the two DIMMs in Channel B. Also, the DIMMs are matched between DIMM0 and DIMM1 of both channels.

  • Page 21: Single Channel (Asymmetric) Mode Configuration With One Dimm

    Product Description 1.4.1.2 Single Channel (Asymmetric) Mode Configurations NOTE Dual channel (Interleaved) mode configurations provide the highest memory throughput. Figure 7 shows a single channel configuration using one DIMM. In this example, only the DIMM0 (blue) socket of Channel A is populated. Channel B is not populated. Channel A, DIMM 0 512 MB Channel A, DIMM 1...

  • Page 22: Flex Mode Configuration With Two Dimms

    Intel Desktop Board DG965MQ Technical Product Specification 1.4.1.3 Flex Mode Configuration NOTE The use of flex mode requires DIMMs to be installed in both channels. Figure 9 shows a flex mode configuration using two DIMMs. The operation is as follows: •...

  • Page 23: Intel ® G965 Express Chipset

    G965 Express Chipset ® The Intel G965 Express chipset consists of the following devices: • Intel 82G965 Graphics and Memory Controller Hub (GMCH) with Direct Media Interface (DMI) interconnect • One of the following: ⎯ Intel 82801HR I/O Controller Hub (ICH8R) with DMI interconnect ⎯...
  • Page 24 Intel Desktop Board DG965MQ Technical Product Specification • 3D Graphics Rendering enhancements ⎯ 1.3 dual texture GigaPixel/sec fill rate ⎯ 16 and 32 bit color ⎯ Maximum 3D supported resolution of 1600 x 1200 x 32 at 85 Hz ⎯ Vertex cache ⎯...

  • Page 25: Dvi Port Status Conditions

    NOTE The use of DVMT requires operating system driver support. 1.5.1.3 Configuration Modes A list of supported modes for the Intel GMA X3000 graphics controller is available as a downloadable document. For information about Refer to Supported video modes for the board Section 1.2, page 15...

  • Page 26: Usb

    400 MHz pixel clock. When an ADD2/MEC card is detected, the Intel GMA X3000 graphics controller is enabled and the PCI Express x16 connector is configured for SDVO mode. SDVO mode enables the SDVO ports to be accessed by the ADD2/MEC card.

  • Page 27: Serial Ata Interfaces

    Product Description 1.5.3 Serial ATA Interfaces The board provides six Serial ATA (SATA) connectors, which support one device per connector. 1.5.3.1 Serial ATA Support The ICH8’s Serial ATA controller offers six independent Serial ATA ports with a theoretical maximum transfer rate of 3 Gbits/sec per port. One device can be installed on each port for a maximum of six Serial ATA devices.

  • Page 28: Parallel Ide Interface

    Intel Desktop Board DG965MQ Technical Product Specification 1.5.4 Parallel IDE Interface The Parallel ATA IDE controller has one bus-mastering Parallel ATA IDE interface. The Parallel ATA IDE interface supports the following modes: • Programmed I/O (PIO): processor controls data transfer.

  • Page 29: Legacy I/O Controller

    Product Description Legacy I/O Controller The I/O controller provides the following features: • One serial port • One parallel port with Extended Capabilities Port (ECP) and Enhanced Parallel Port (EPP) support • Serial IRQ interface compatible with serialized IRQ support for PCI systems •...

  • Page 30: Audio Subsystem

    Back panel – Pink Back panel – Black Back panel - Orange 1.7.1 Audio Subsystem Software Audio software and drivers are available from Intel’s World Wide Web site. For information about Refer to Obtaining audio software and drivers Section 1.2, page 15...

  • Page 31: Audio Connectors And Headers

    Product Description 1.7.2 Audio Connectors and Headers The board contains audio connectors on the back panel and audio headers on the component side of the board. The front panel audio header provides mic in and line out signals for the front panel. Microphone bias is supported for both the front and back panel microphone connectors.

  • Page 32: Lan Subsystem

    • PCI Conventional bus power management ⎯ Supports ACPI technology ⎯ Supports LAN wake capabilities ⎯ LAN Subsystem Software LAN software and drivers are available from Intel’s World Wide Web site. ® 1.8.1 Intel 82566DC Gigabit Ethernet Controller The Intel 82566DC Gigabit Ethernet Controller supports the following features: •...

  • Page 33: Lan Subsystem Software

    Product Description 1.8.2 LAN Subsystem Software LAN software and drivers are available from Intel’s World Wide Web site. For information about Refer to Obtaining LAN software and drivers Section 1.2, page 15 1.8.3 RJ-45 LAN Connector with Integrated LEDs Two LEDs are built into the RJ-45 LAN connector (shown in Figure 11 below).

  • Page 34: Hardware Management Subsystem

    Thermally monitored closed-loop fan control, for all three fans, that can adjust the fan speed or switch the fans on or off as needed 1.9.2 Fan Monitoring Fan monitoring can be implemented using Intel Desktop Utilities or third-party software. For information about Refer to The functions of the fan headers Section 1.10.2.2, page 39...

  • Page 35: Thermal Monitoring

    Product Description 1.9.4 Thermal Monitoring Figure 12 shows the locations of the thermal sensors and fan headers. OM18420 Item Description Thermal diode, located on processor die Thermal diode, located on the GMCH die Thermal diode, located on the ICH8 die Remote thermal sensor Processor fan Front chassis fan...

  • Page 36: 1.10 Power Management

    ⎯ Wake from USB ⎯ Wake from PS/2 devices ⎯ Power Management Event signal (PME#) wake-up support ⎯ Intel Quick Resume Technology Drivers (Intel QRTD) (optional) 1.10.1 ACPI ACPI gives the operating system direct control over the power management and Plug and Play functions of a computer.

  • Page 37: Power States And Targeted System Power

    Product Description 1.10.1.1 System States and Power States Under ACPI, the operating system directs all system and device power state transitions. The operating system puts devices in and out of low-power states based on user preferences and knowledge of how devices are being used by applications. Devices that are not being used can be turned off.

  • Page 38: Hardware Support

    Intel Desktop Board DG965MQ Technical Product Specification 1.10.1.3 Wake-up Devices and Events Table 11 lists the devices or specific events that can wake the computer from specific states. Table 11. Wake-up Devices and Events These devices/events can wake up the computer…...

  • Page 39: Power Connector

    Product Description LAN wake capabilities and Instantly Available PC technology require power from the +5 V standby line. Resume on Ring enables telephony devices to access the computer when it is in a power-managed state. The method used depends on the type of telephony device (external or internal).

  • Page 40: Lan Wake Capabilities

    Intel Desktop Board DG965MQ Technical Product Specification 1.10.2.3 LAN Wake Capabilities CAUTION For LAN wake capabilities, the +5 V standby line from the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing LAN wake capabilities can damage the power supply.

  • Page 41: Resume On Ring

    Target resume time is zero to five seconds (about equal to the time it takes for the display to warm up). CAUTION Do not open the computer chassis when it is in the Intel QRTD off state. Opening the chassis in this state can cause hardware damage. 1.10.2.6...

  • Page 42: Location Of The Standby Power Indicator Led

    Intel Desktop Board DG965MQ Technical Product Specification 1.10.2.10 WAKE# Signal Wake-up Support When the WAKE# signal on the PCI Express bus is asserted, the computer wakes from an ACPI S3, S4, or S5 state. 1.10.2.11 +5 V Standby Power Indicator LED The +5 V standby power indicator LED shows that power is still present even when the computer appears to be off.

  • Page 43: Technical Reference

    Technical Reference What This Chapter Contains Memory Map ....................43 DMA Channels....................45 Fixed I/O Map ....................46 PCI Configuration Space Map ...............47 Interrupts....................48 PCI Interrupt Routing Map ................49 Connectors and Headers................50 Jumper Block .....................61 Mechanical Considerations ................62 2.10 Electrical Considerations ................65 2.11 Thermal Considerations ................67 2.12 Reliability ....................69 2.13 Environmental....................70 Memory Map...

  • Page 44: Detailed System Memory Address Map

    Intel Desktop Board DG965MQ Technical Product Specification The amount of installed memory that can be used will vary based on add-in cards and BIOS settings. Figure 14 shows a schematic of the system memory map. All installed system memory can be used when there is no overlap of system addresses.

  • Page 45: Dma Channels

    Technical Reference Table 12 lists the system memory map. Table 12. System Memory Map Address Range Address Range (decimal) (hex) Size Description 1024 K - 8388608 K 100000 - 1FFFFFFFF 8191 MB Extended memory 960 K - 1024 K F0000 - FFFFF 64 KB Runtime BIOS 896 K - 960 K...

  • Page 46: Fixed I/O Map

    Table 14. I/O Map Address (hex) Size Description 0000 - 00FF 256 bytes Used by the Desktop Board DG965MQ. Refer to the ICH8 data sheet for dynamic addressing information. 01F0 - 01F7 8 bytes Primary Parallel ATE IDE channel command block (Note 1)

  • Page 47: Pci Configuration Space Map

    Table 15. PCI Configuration Space Map Device Function Number (hex) Number (hex) Number (hex) Description Memory controller of Intel 82G965 component (Note 1) PCI Express x16 graphics port Integrated graphics controller Intel High Definition Audio Controller PCI Express port 1...

  • Page 48: Interrupts

    Intel Desktop Board DG965MQ Technical Product Specification Interrupts The interrupts can be routed through either the Programmable Interrupt Controller (PIC) or the Advanced Programmable Interrupt Controller (APIC) portion of the ICH8 component. The PIC is supported in Windows 98 SE and Windows ME and uses the first 16 interrupts.

  • Page 49: Pci Interrupt Routing Map

    Technical Reference PCI Interrupt Routing Map This section describes interrupt sharing and how the interrupt signals are connected between the PCI bus connectors and onboard PCI devices. The PCI specification specifies how interrupts can be shared between devices attached to the PCI bus. In most cases, the small amount of latency added by interrupt sharing does not affect the operation or throughput of the devices.

  • Page 50: Connectors And Headers

    Intel Desktop Board DG965MQ Technical Product Specification Connectors and Headers CAUTION Only the following connectors have overcurrent protection: Back panel and front panel USB, PS/2, and VGA. The other internal connectors/headers are not overcurrent protected and should connect only to devices inside the computer’s chassis, such as fans and internal peripherals.

  • Page 51: Back Panel Connectors

    Technical Reference 2.7.1 Back Panel Connectors Figure 15 shows the locations of the back panel connectors. OM18422 Item Description VGA port DVI-D connector (digital output only) PS/2 mouse port (optional) PS/2 keyboard port (optional) USB ports [2] IEEE-1394a USB ports [2] USB ports [2] Center channel and LFE (subwoofer) audio out/Retasking Jack...

  • Page 52: Component-Side Connectors And Headers

    Intel Desktop Board DG965MQ Technical Product Specification 2.7.2 Component-side Connectors and Headers Figure 16 shows the locations of the component-side connectors and headers. OM18423 Figure 16. Component-side Connectors and Headers...

  • Page 53: Component-Side Connectors And Headers Shown In Figure 16

    Technical Reference Table 18 lists the component-side connectors and headers identified in Figure 16. Table 18. Component-side Connectors and Headers Shown in Figure 16 Item/callout from Figure 16 Description High Definition Audio Link header Serial ATA connectors [6] Front panel USB headers [2] Chassis intrusion header PCI Express x16 add-in card connector PCI Express x1 add-in card connector...

  • Page 54: High Definition Audio Link Header

    Intel Desktop Board DG965MQ Technical Product Specification Table 19. High Definition Audio Link Header Signal Name Signal Name BCLK Ground 3.3 V/1.5 V I/O SYNC Ground 3.3V_CORE +12 V No connect Key (no pin) No connect 3.3 V/1.5V STBY No connect Ground Table 20.

  • Page 55: Parallel Port Header

    Technical Reference Table 23. Parallel Port Header Signal Name Signal Name STROBE# AUTOFD# FAULT# INIT# SLCTIN# Ground Ground Ground Ground Ground ACK# Ground BUSY Ground PERROR Ground SELECT Key (no pin) Table 24. Front and Rear Chassis Fan Headers Signal Name Control +12 V Tach...

  • Page 56: Add-In Card Connectors

    Intel Desktop Board DG965MQ Technical Product Specification 2.7.2.1 Add-in Card Connectors The board has the following add-in card connectors: • PCI Express x16: one connector supporting simultaneous transfer speeds up to 4 GBytes/sec of peak bandwidth per direction and up to 8 GBytes/sec concurrent bandwidth •...

  • Page 57: Processor Core Power Connector

    Main power – a 2 x 12 connector. This connector is compatible with 2 x 10 connectors previously used on Intel Desktop boards. The board supports the use of ATX12V power supplies with either 2 x 10 or 2 x 12 main power cables. When...

  • Page 58: Connection Diagram For Front Panel Header

    Intel Desktop Board DG965MQ Technical Product Specification 2.7.2.3 Front Panel Header This section describes the functions of the front panel header. Table 29 lists the signal names of the front panel header. Figure 17 is a connection diagram for the front panel header.

  • Page 59: States For A One-Color Power Led

    Technical Reference 2.7.2.3.2 Reset Switch Header Pins 5 and 7 can be connected to a momentary single pole, single throw (SPST) type switch that is normally open. When the switch is closed, the board resets and runs the POST. 2.7.2.3.3 Power/Sleep LED Header Pins 2 and 4 can be connected to a one- or two-color LED.

  • Page 60: Connection Diagram For Front Panel Usb Headers

    Intel Desktop Board DG965MQ Technical Product Specification 2.7.2.5 Front Panel USB Headers Figure 18 is a connection diagram for the front panel USB headers. INTEGRATOR’S NOTES • The +5 V DC power on the front panel USB headers is fused.

  • Page 61: Jumper Block

    Technical Reference Jumper Block CAUTION Do not move the jumper with the power on. Always turn off the power and unplug the power cord from the computer before changing a jumper setting. Otherwise, the board could be damaged. Figure 20 shows the location of the jumper block. The jumper determines the BIOS Setup program’s mode.

  • Page 62: Mechanical Considerations

    Intel Desktop Board DG965MQ Technical Product Specification Mechanical Considerations 2.9.1 Form Factor The board is designed to fit into a BTX-form-factor chassis. Figure 21 illustrates the mechanical form factor of the board. Dimensions are given in inches [millimeters]. The outer dimensions are 10.40 inches by 10.50 inches [264.16 millimeters by 266.70 millimeters].

  • Page 63: I/O Shield

    Additional design considerations for I/O shields relative to chassis requirements are described in the BTX specification. NOTE The I/O shield drawing is for reference only. I/O shields compliant with the BTX specification are available from Intel. 172.93 REF [6.808] 13.00 TYP [0.512]...

  • Page 64: I/O Shield Dimensions For Boards Without Ps/2 Connectors

    Intel Desktop Board DG965MQ Technical Product Specification 172.93 REF [6.808] 13.00 TYP [0.512] 169.98 +0.12/- 0.13 [6.692 +0.004/- 0.005] 1.00 [0.039] 6.09 [0.0240] 0.00 [0.000] 9.18 [0.361] 10.728 [0.4224] 11.55 [0.455] 39.89 +0.12/- 0.13 [1.570 +0.004/- 0.005] 42.84 REF [1.687] 13.50...

  • Page 65: 2.10 Electrical Considerations

    Technical Reference 2.10 Electrical Considerations 2.10.1 DC Loading Table 34 lists the DC loading characteristics of the board. This data is based on a DC analysis of all active components within the board that impact its power delivery subsystems. The analysis does not include PCI add-in cards. Minimum values assume a light load placed on the board that is similar to an environment with no applications running and no USB current draw.

  • Page 66: Add-In Board Considerations

    Intel Desktop Board DG965MQ Technical Product Specification 2.10.3 Add-in Board Considerations The board is designed to provide 2 A (average) of +5 V current for each add-in board. The total +5 V current draw for add-in boards for a fully loaded board (all three expansion slots and the PCI Express x16 connector filled) must not exceed 8 A.

  • Page 67: 2.11 Thermal Considerations

    Failure to ensure appropriate airflow may result in reduced performance of both the processor and/or voltage regulator or, in some instances, damage to the board. For a list of chassis that have been tested with Intel desktop boards please refer to the following website: http://developer.intel.com/design/motherbd/cooling.htm...

  • Page 68: Localized High Temperature Zones

    Intel Desktop Board DG965MQ Technical Product Specification Figure 24 shows the locations of the localized high temperature zones. OM18426 Item Description Intel 82G965 GMCH Intel 82801HR/HH ICH8 1.5 V core and front side bus voltage regulator areas Processor Processor voltage regulator area...

  • Page 69: 2.12 Reliability

    The calculation is based on the Bellcore Reliability Prediction Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF data is calculated from predicted data at 55 ºC. The Desktop Board DG965MQ MTBF is 105,367 hours.

  • Page 70: 2.13 Environmental

    Intel Desktop Board DG965MQ Technical Product Specification 2.13 Environmental Table 37 lists the environmental specifications for the board. Table 37. Desktop Board DG965MQ Environmental Specifications Parameter Specification Temperature Non-Operating -40 °C to +70 °C Operating 0 °C to +55 °C...

  • Page 71: Overview Of Bios Features

    3.10 BIOS Security Features ................78 Introduction The board uses an Intel BIOS that is stored in the Serial Peripheral Interface Flash Memory (SPI Flash) and can be updated using a disk-based program. The SPI Flash contains the BIOS Setup program, POST, the PCI auto-configuration utility, and Plug and Play support.

  • Page 72: Bios Flash Memory Organization

    Intel Desktop Board DG965MQ Technical Product Specification Table 38 lists the BIOS Setup program menu features. Table 38. BIOS Setup Program Menu Bar Maintenance Main Advanced Security Power Boot Exit Clears Displays Configures Sets Configures Selects Saves or discards passwords and...

  • Page 73: Pci Ide Support

    Overview of BIOS Features 3.3.2 PCI IDE Support If you select Auto in the BIOS Setup program, the BIOS automatically sets up the PCI IDE connector with independent I/O channel support. The IDE interface supports hard drives up to ATA-66/100/133 and recognizes any ATAPI compliant devices, including CD-ROM drives, tape drives, and Ultra DMA drives.

  • Page 74: Legacy Usb Support

    Intel Desktop Board DG965MQ Technical Product Specification Legacy USB Support Legacy USB support enables USB devices to be used even when the operating system’s USB drivers are not yet available. Legacy USB support is used to access the BIOS Setup program, and to install an operating system that supports USB. By default, Legacy USB support is set to Enabled.

  • Page 75: Language Support

    The Integrator’s Toolkit that is available from Intel can be used to create a custom splash screen. NOTE If you add a custom splash screen, it will share space with the Intel branded logo. Refer to For information about The Intel World Wide Web site Section 1.2, page 15...

  • Page 76: Boot Options

    Intel Desktop Board DG965MQ Technical Product Specification Boot Options In the BIOS Setup program, the user can choose to boot from a diskette drive, hard drives, CD-ROM, or the network. The default setting is for the diskette drive to be the first boot device, the hard drive second, and the ATAPI CD-ROM third.

  • Page 77: Adjusting Boot Speed

    It is possible to optimize the boot process to the point where the system boots so quickly that the Intel logo screen (or a custom logo splash screen) will not be seen. Monitors and hard disk drives with minimum initialization times can also contribute to a boot time that might be so fast that necessary logo screens and POST messages cannot be seen.

  • Page 78: 3.10 Bios Security Features

    Intel Desktop Board DG965MQ Technical Product Specification 3.10 BIOS Security Features The BIOS includes security features that restrict access to the BIOS Setup program and who can boot the computer. A supervisor password and a user password can be set for the BIOS Setup program and for booting the computer, with the following restrictions: •...

  • Page 79: Error Messages And Beep Codes

    Error Messages and Beep Codes What This Chapter Contains Speaker ....................79 BIOS Beep Codes ..................79 BIOS Error Messages ..................79 Port 80h POST Codes ..................80 Speaker The board-mounted speaker provides audible error code (beep code) information during POST. For information about Refer to The location of the onboard speaker Figure 1, page 12...

  • Page 80: 4.4 Port 80H Post Codes

    Intel Desktop Board DG965MQ Technical Product Specification 4.4 Port 80h POST Codes During the POST, the BIOS generates diagnostic progress codes (POST-codes) to I/O port 80h. If the POST fails, execution stops and the last POST code generated is left at port 80h.

  • Page 81: Port 80H Post Codes

    Error Messages and Beep Codes Table 46. Port 80h POST Codes POST Code Description of POST Operation Host Processor Power-on initialization of the host processor (Boot Strap Processor) Host processor Cache initialization (including APs) Starting Application processor initialization SMM initialization Chipset Initializing a chipset component Memory...
  • Page 82 Intel Desktop Board DG965MQ Technical Product Specification Table 46. Port 80h POST Codes (continued) POST Code Description of POST Operation Keyboard (PS2 or USB) Resetting keyboard Disabling keyboard Detecting presence of keyboard Enabling the keyboard Clearing keyboard input buffer Instructing keyboard controller to run Self Test (PS2 only)
  • Page 83 Error Messages and Beep Codes Table 46. Port 80h POST Codes (continued) POST Code Description of POST Operation DXE Drivers Waiting for user input Checking password Entering BIOS setup Calling Legacy Option ROMs Runtime Phase/EFI OS Boot Entering Sleep state Exiting Sleep state EFI boot service ExitBootServices ( ) has been called EFI runtime service SetVirtualAddressMap ( ) has been called...

  • Page 84: Typical Port 80H Post Sequence

    Intel Desktop Board DG965MQ Technical Product Specification Table 47. Typical Port 80h POST Sequence POST Code Description Initializing a chipset component Reading SPD from memory DIMMs Detecting presence of memory DIMMs Configuring memory Testing memory Loading recovery capsule Entered DXE phase...

  • Page 85: Regulatory Compliance And Battery Disposal Information

    • Electromagnetic Compatibility (EMC) regulations • Product certification markings 5.1.1 Safety Regulations Desktop Board DG965MQ complies with the safety regulations stated in Table 48 when correctly installed in a compatible host system. Table 48. Safety Regulations Regulation Title UL 60950-1:2003/ Information Technology Equipment –...

  • Page 86: European Union Declaration Of Conformity Statement

    European Union Declaration of Conformity Statement ® We, Intel Corporation, declare under our sole responsibility that the product Intel Desktop Board DG965MQ is in conformity with all applicable essential requirements necessary for CE marking, following the provisions of the European Council Directive 89/336/EEC (EMC Directive) and Council Directive 73/23/EEC (Safety/Low Voltage Directive).
  • Page 87 Regulatory Compliance and Battery Disposal Information Malti Dan il-prodott hu konformi mal-provvedimenti tad-Direttivi Ewropej 89/336/EEC u 73/23/EEC. Norsk Dette produktet er i henhold til bestemmelsene i det europeiske direktivet 89/336/ EEC & 73/23/EEC. Polski Niniejszy produkt jest zgodny z postanowieniami Dyrektyw Unii Europejskiej 89/336/EWG i 73/23/EWG.

  • Page 88: Product Ecology Statements

    请参考 了解此计划的详情，包括涉及产品之范围、回收地点、运送指导、条款和条件等。 Deutsch Als Teil von Intels Engagement für den Umweltschutz hat das Unternehmen das Intel Produkt-Recyclingprogramm implementiert, das Einzelhandelskunden von Intel Markenprodukten ermöglicht, gebrauchte Produkte an ausgewählte Standorte für ordnungsgemäßes Recycling zurückzugeben. Details zu diesem Programm, einschließlich der darin eingeschlossenen Produkte, verfügbaren Standorte, Versandanweisungen, Bedingungen usw., finden Sie auf der...
  • Page 89 Regulatory Compliance and Battery Disposal Information Français Dans le cadre de son engagement pour la protection de l'environnement, Intel a mis en œuvre le programme Intel Product Recycling Program (Programme de recyclage des produits Intel) pour permettre aux consommateurs de produits Intel de recycler les produits usés en les retournant à...
  • Page 90 Intel Desktop Board DG965MQ Technical Product Specification Russian В качестве части своих обязательств к окружающей среде, в Intel создана программа утилизации продукции Intel (Product Recycling Program) для предоставления конечным пользователям марок продукции Intel возможности возврата используемой продукции в специализированные пункты для должной...

  • Page 91: Lead-Free Board Markings

    Regulatory Compliance and Battery Disposal Information 5.1.3.3 Lead Free Desktop Board This desktop board is lead free although certain discrete components used on the board contain a small amount of lead which is necessary for component performance and/or reliability. This desktop board is referred to as “Lead-free second level interconnect.”...

  • Page 92: Emc Regulations

    Intel Desktop Board DG965MQ Technical Product Specification 5.1.4 EMC Regulations Desktop Board DG965MQ complies with the EMC regulations stated in Table 50 when correctly installed in a compatible host system. Table 50. EMC Regulations Regulation Title FCC Class B Title 47 of the Code of Federal Regulations, Parts 2 and 15, Subpart B, Radio Frequency Devices.

  • Page 93: Product Certification Markings (Board Level)

    EMC requirements. You may use this equipment in residential environments and other non-residential environments. 5.1.5 Product Certification Markings (Board Level) Desktop Board DG965MQ has the product certification markings shown in Table 51: Table 51. Product Certification Markings Description Mark UL joint US/Canada Recognized Component mark.

  • Page 94: Battery Disposal Information

    Intel Desktop Board DG965MQ Technical Product Specification Battery Disposal Information CAUTION Risk of explosion if the battery is replaced with an incorrect type. Batteries should be recycled where possible. Disposal of used batteries must be in accordance with local environmental regulations.
  • Page 95 Regulatory Compliance and Battery Disposal Information PRECAUCIÓN Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del fabricante.
  • Page 96 Intel Desktop Board DG965MQ Technical Product Specification AWAS Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi peraturan alam sekitar tempatan. OSTRZEŻENIE Istnieje niebezpieczeństwo wybuchu w przypadku zastosowania niewłaściwego typu baterii.
  • Page 97 Regulatory Compliance and Battery Disposal Information...
  • Page 98 Intel Desktop Board DG965MQ Technical Product Specification...

Table of Contents