Table of Contents
Advertisement
Quick Links
Intel® Desktop Board
DH57JG
Technical Product Specification
March 2010
Order Number: E86202-001US
®
The Intel
Desktop Board DH57JG may contain design defects or errors known as errata that may cause the product to deviate from published specifications.
Current characterized errata are documented in the Intel Desktop Board DH57JG Specification Update.
Advertisement
Table of Contents
Related Manuals for Intel BLKDH57JG
Summary of Contents for Intel BLKDH57JG
- Page 1 Order Number: E86202-001US ® The Intel Desktop Board DH57JG may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board DH57JG Specification Update.
-
Page 2: Revision History
“undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. Intel desktop boards may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available on request. -
Page 3: Intended Audience
® Intended Audience The TPS is intended to provide detailed, technical information about the Intel Desktop Board DH57JG and its components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences. - Page 4 Intel Desktop Board DH57JG Technical Product Specification Other Common Notation Used after a signal name to identify an active-low signal (such as USBP0#) Gigabyte (1,073,741,824 bytes) GB/s Gigabytes per second Gb/s Gigabits per second Kilobyte (1024 bytes) Kbit Kilobit (1024 bits)
-
Page 5: Table Of Contents
1.1.3 Block Diagram ..............13 1.2 Legacy Considerations..............14 1.3 Online Support................14 1.4 Processor ..................14 ® 1.5 Intel H57 Express Chipset ............... 15 1.6 System Memory ................15 1.6.1 Memory Configurations ............16 1.7 Graphics Subsystem ................ 18 1.7.1... - Page 6 Intel Desktop Board DH57JG Technical Product Specification 2.4.1 Form Factor................. 52 2.5 Electrical Considerations ..............53 2.5.1 Power Supply Considerations ..........53 2.5.2 Fan Header Current Capability..........54 2.5.3 Add-in Board Considerations ..........54 2.6 Thermal Considerations ..............55 2.7 Reliability ..................58 2.8 Environmental ................
- Page 7 13. Serial Port Header ................43 14. S/PDIF Header ................43 15. Front Panel Audio Header for Intel HD Audio........43 16. Front Panel Audio Header for Passive AC ’97 Audio ....... 43 17. Front Panel USB Headers ..............44 18.
- Page 8 Intel Desktop Board DH57JG Technical Product Specification 29. Fan Header Current Capability............54 30. Thermal Considerations for Components ..........57 31. Tcontrol Values for Components ............57 32. Environmental Specifications............. 58 33. BIOS Setup Program Menu Bar............60 34. BIOS Setup Program Function Keys............ 60 35.
-
Page 9: Product Description
• 10-channel (7.1+2) Intel High Definition Audio via the Realtek* ALC889 audio Audio codec • 8-channel (7.1) Intel High Definition Audio via the HDMI interface • Twelve USB 2.0 ports: Peripheral Interfaces ― Six ports are implemented with stacked back panel connectors ―... - Page 10 • Suspend to RAM support • Wake on PCI, PCI Express, LAN, front panel, serial, and USB ports ® LAN Support Gigabit (10/100/1000 Mbits/s) LAN subsystem using the Intel 82578DC Gigabit Ethernet Controller • One PCI Express 2.0 x16 add-in card connector...
-
Page 11: Board Layout
Product Description 1.1.2 Board Layout Figure 1 shows the location of the major components on Intel Desktop Board DH57JG. Figure 1. Major Board Components Table 2 lists the components identified in Figure 1. - Page 12 Intel Desktop Board DH57JG Technical Product Specification Table 2. Components Shown in Figure 1 Item/callout from Figure 1 Description Back panel connectors Front panel USB header Front panel header Chassis intrusion header Alternate front panel power LED header BIOS setup configuration jumper block...
-
Page 13: Block Diagram
Product Description 1.1.3 Block Diagram Figure 2 is a block diagram of the major functional areas of the board. Figure 2. Block Diagram... -
Page 14: Legacy Considerations
Pentium processors in an LGA1156 socket. Other processors may be supported in the future. This board is designed to support processors with a maximum TDP of 87 W. See the Intel web site listed below for the most up-to-date list of supported processors. -
Page 15: Intel ® H57 Express Chipset
Intel H57 Express Chipset The Intel H57 Express Chipset consisting of the Intel H57 Platform Controller Hub (PCH) provides interfaces to the processor and the USB, SATA, LPC, audio, network, display, Conventional PCI, and PCI Express x1 interfaces. The PCH is a centralized controller for the board’s I/O paths. -
Page 16: Memory Configurations
025414.htm 1.6.1 Memory Configurations The Intel Core i5-600 series, Intel Core i3, and Intel Pentium processors support the following types of memory organization: • Dual channel (Interleaved) mode. This mode offers the highest throughput for real world applications. Dual channel mode is enabled when the installed memory capacities of both DIMM channels are equal. -
Page 17: Memory Channel And Dimm Configuration
Product Description Figure 3 illustrates the memory channel and DIMM configuration. Figure 3. Memory Channel and DIMM Configuration... -
Page 18: Graphics Subsystem
Intel Desktop Board DH57JG Technical Product Specification Graphics Subsystem The board supports system graphics through either Intel HD Graphics or a PCI Express 2.0 x16 add-in graphics card. 1.7.1 Integrated Graphics ® The board supports integrated graphics through the Intel Flexible Display Interface (FDI) for processors with Intel HD Graphics. -
Page 19: Pci Express X16 Graphics
HDMI and DVI-I connector status. 1.7.2 PCI Express x16 Graphics The Intel Core i5-600 series, Intel Core i3, and Intel Pentium processors in an LGA1156 socket support discrete add in graphics cards via the PCI Express 2.0 x16 graphics connector: •... -
Page 20: Usb
Intel Desktop Board DH57JG Technical Product Specification For information about Refer to PCI Express technology http://www.pcisig.com Mini-ITX chassis compatibility list http://www.intel.com/go/ miniitx The board supports up to twelve USB 2.0 ports through two EHCI host controllers on the PCH that allow the use of EHCI-compatible drivers. -
Page 21: 1.10 Legacy I/O Controller
• S/PDIF header (support for optical or coaxial S/PDIF output) • Front panel audio header with support for Intel High Definition Audio (Intel HD Audio) and AC ‘97 audio NOTE Systems built with an AC ‘97 audio front panel will not be able to obtain the Microsoft... -
Page 22: Audio Subsystem Software
Rear Black Default Rear Orange Default 1.11.1 Audio Subsystem Software Audio software and drivers are available from Intel’s World Wide Web site. For information about Refer to Obtaining audio software and drivers Section 1.3, page 14 1.11.2 Audio Connectors and Headers The board contains audio connectors and headers on both the back panel and the component side of the board. -
Page 23: Back Panel Audio Connectors
Product Description 1.11.2.1 Back Panel Audio Connectivity The available configurable back panel audio connectors are shown in Figure 4. Item Description Rear surround Center channel and LFE (subwoofer) S/PDIF out (optical) Audio line in Mic in/side surround Line out/front speakers Figure 4. -
Page 24: 1.12 Lan Subsystem
TCP, IP, and UDP checksum offload (for IPv4 and IPv6) • Transmit TCP segmentation • Full device driver compatibility • PCI Express power management support LAN software and drivers are available from Intel’s World Wide Web site. For information about Refer to Obtaining LAN software and drivers http://downloadcenter.intel.com... -
Page 25: Rj-45 Lan Connector With Integrated Leds
Product Description 1.12.1 RJ-45 LAN Connector with Integrated LEDs Two LEDs are built into the RJ-45 LAN connector (shown in Figure 5). Item Description Link/Activity LED (green) Link Speed LED (green/yellow) Figure 5. LAN Connector LED Locations Table 7 describes the LED states when the board is powered up and the LAN subsystem is operating. -
Page 26: 1.13 Real-Time Clock Subsystem
Intel Desktop Board DH57JG Technical Product Specification 1.13 Real-Time Clock Subsystem A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer is not plugged into a wall socket, the battery has an estimated life of three years. When the computer is plugged in, the standby current from the power supply extends the life of the battery. -
Page 27: Fan Monitoring
Product Description 1.14.2 Fan Monitoring ® Fan monitoring can be observed through the BIOS setup user interface, Intel Desktop Utilities, or third-party software. For information about Refer to The functions of the fan headers Section 1.15.2.2, page 33 1.14.3 Chassis Intrusion Detection The board supports a chassis security feature that detects if the chassis cover is removed. -
Page 28: Thermal Monitoring
1.14.4 Thermal Monitoring Figure 6 shows the locations of the thermal sensors and fan headers. Item Description Thermal diode, located on the Intel H57 PCH System fan header Processor fan header Remote thermal diode 2 (Voltage Regulator Temperature) Remote thermal diode 1 (Memory Temperature) Thermal diode, located on processor die Figure 6. -
Page 29: 1.15 Power Management
Product Description 1.15 Power Management Power management is implemented at several levels, including: • Software support through Advanced Configuration and Power Interface (ACPI) • Hardware support: ⎯ Power connector ⎯ Fan headers ⎯ LAN wake capabilities ⎯ Instantly Available PC technology ⎯... -
Page 30: Power States And Targeted System Power
Intel Desktop Board DH57JG Technical Product Specification 1.15.1.1 System States and Power States Under ACPI, the operating system directs all system and device power state transitions. The operating system puts devices in and out of low-power states based on user preferences and knowledge of how devices are being used by applications. -
Page 31: Wake-Up Devices And Events
Product Description 1.15.1.2 Wake-up Devices and Events Table 10 lists the devices or specific events that can wake the computer from specific states. Table 10. Wake-up Devices and Events These devices/events can wake up the computer… …from this state Power switch S1, S3, S4, S5 RTC alarm S1, S3, S4, S5... -
Page 32: Hardware Support
Intel Desktop Board DH57JG Technical Product Specification 1.15.2 Hardware Support CAUTION Ensure that the power supply provides adequate +5 V standby current if LAN wake capabilities and Instantly Available PC technology features are used. Failure to do so can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options. -
Page 33: Fan Headers
Product Description 1.15.2.2 Fan Headers The function/operation of the fan headers is as follows: • The fans are on when the board is in the S0 or S1 state • The fans are off when the board is in the S3, S4, or S5 state •... -
Page 34: Instantly Available Pc Technology
Intel Desktop Board DH57JG Technical Product Specification 1.15.2.4 Instantly Available PC Technology CAUTION For Instantly Available PC technology, the +5 V standby line for the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing Instantly Available PC technology can damage the power supply. -
Page 35: Location Of The Standby Power Led
Product Description Figure 7. Location of the Standby Power LED CAUTION If AC power has been switched off and the standby power indicators are still lit, disconnect the power cord before installing or removing any devices connected to the board. Failure to do so could damage the board and any attached devices. -
Page 36: Energy Star* 5.0, E-Standby, And Erp Compliance
Compliance The US Department of Energy and the US Environmental Protection Agency have continually revised the ENERGY STAR requirements. Intel has worked directly with these two governmental agencies in the definition of new requirements. Intel Desktop Board DH57JG meets the following program requirements in an... -
Page 37: Technical Reference
Technical Reference Memory Resources 2.1.1 Addressable Memory The board utilizes 8 GB of addressable system memory. Typically the address space that is allocated for PCI Conventional bus add-in cards, PCI Express configuration space, BIOS (SPI Flash device), and chipset overhead resides above the top of DRAM (total system memory). -
Page 38: Detailed System Memory Address Map
Intel Desktop Board DH57JG Technical Product Specification Figure 8. Detailed System Memory Address Map... -
Page 39: Memory Map
Technical Reference 2.1.2 Memory Map Table 11 lists the system memory map. Table 11. System Memory Map Address Range (decimal) Address Range (hex) Size Description 1024 K - 8388608 K 100000 - 3FFFFFFFF 8191 MB Extended memory 960 K - 1024 K F0000 - FFFFF 64 KB Runtime BIOS... -
Page 40: Back Panel Connectors
Intel Desktop Board DH57JG Technical Product Specification 2.2.1 Back Panel Connectors Figure 9 shows the location of the back panel connectors for the board. Item Description USB ports DVI-I connector HDMI connector USB ports eSATA connector USB ports Rear surround... -
Page 41: Component-Side Connectors And Headers
Technical Reference 2.2.2 Component-side Connectors and Headers Figure 10 shows the locations of the component-side connectors and headers. Figure 10. Component-side Connectors and Headers Table 12 lists the component-side connectors and headers identified in Figure 10. - Page 42 Intel Desktop Board DH57JG Technical Product Specification Table 12. Component-side Connectors and Headers Shown in Figure 10 Item/callout from Figure 10 Description Front panel USB header Front panel header Chassis intrusion header Alternate front panel power LED header SATA connectors...
-
Page 43: Serial Port Header
Table 14. S/PDIF Header Signal Name Ground S/PDIF out Key (no pin) +5V_DC Table 15. Front Panel Audio Header for Intel HD Audio Signal Name Signal Name [Port 1] Left channel Ground [Port 1] Right channel PRESENCE# (HD Audio/AC ’97 detect) -
Page 44: Front Panel Usb Headers
Intel Desktop Board DH57JG Technical Product Specification Table 17. Front Panel USB Headers Signal Name Signal Name +5 VDC +5 VDC Ground Ground KEY (no pin) No Connect Table 18. SATA Connectors Signal Name Ground Ground Ground Table 19. Chassis Intrusion Header... -
Page 45: Processor Core Power Connector
Main power – a 2 x 12 connector. This connector is compatible with 2 x 10 connectors previously used on Intel Desktop boards. The board supports the use of ATX12V power supplies with either 2 x 10 or 2 x 12 main power cables. When using a power supply with a 2 x 10 main power cable, pins 11, 12, 23, and 24 must remain unconnected. -
Page 46: Main Power Connector
Intel Desktop Board DH57JG Technical Product Specification Table 23. Main Power Connector Signal Name Signal Name +3.3 V +3.3 V +3.3 V −12 V Ground Ground +5 V PS-ON# (power supply remote on/off) Ground Ground +5 V Ground Ground Ground PWRGD (Power Good) −5 V (obsolete) -
Page 47: Connection Diagram For Front Panel Header
Technical Reference 2.2.2.4 Front Panel Header This section describes the functions of the front panel header. Table 24 lists the signal names of the front panel header. Figure 11 is a connection diagram for the front panel header. Table 24. Front Panel Header Signal Description Signal... -
Page 48: Auxiliary Front Panel Power Led Header
Intel Desktop Board DH57JG Technical Product Specification 2.2.2.4.2 Reset Switch Header Pins 5 and 7 can be connected to a momentary single pole, single throw (SPST) type switch that is normally open. When the switch is closed, the board resets and runs the POST. -
Page 49: Connection Diagram For Front Panel Usb Headers
Technical Reference 2.2.2.6 Front Panel USB Headers Figure 12 is a connection diagram for the front panel USB headers. NOTE • The +5 V DC power on the USB headers is fused. • Use only a front panel USB connector that conforms to the USB 2.0 specification for high-speed USB devices. -
Page 50: Jumper Block
Intel Desktop Board DH57JG Technical Product Specification Jumper Block CAUTION Do not move the jumper with the power on. Always turn off the power and unplug the power cord from the computer before changing a jumper setting. Otherwise, the board could be damaged. -
Page 51: Bios Setup Configuration Jumper Settings
Technical Reference Table 27. BIOS Setup Configuration Jumper Settings Function/Mode Jumper Setting Configuration Normal The BIOS uses current configuration information and passwords for booting. 3 2 1 Configure After the POST runs, Setup runs automatically. The maintenance menu is displayed. Note that this Configure mode is the only way to clear the BIOS/CMOS settings. -
Page 52: Mechanical Considerations
Intel Desktop Board DH57JG Technical Product Specification Mechanical Considerations 2.4.1 Form Factor The board is designed to fit into a Mini-ITX form-factor chassis. Figure 14 illustrates the mechanical form factor for the board. Dimensions are given in inches [millimeters]. The outer dimensions are 6.7 inches by 6.7 inches [170.18 millimeters by 170.18 millimeters]. -
Page 53: Electrical Considerations
+12 V1 denotes the 12 V rail at the 2 x 12 power connector. +12 V2 denotes the 12 V rail at the 2 x 2 power connector. For information about Refer to Selecting an appropriate power supply http://www.intel.com/support/motherboards/desktop/sb/C S-026472.htm... -
Page 54: Fan Header Current Capability
Intel Desktop Board DH57JG Technical Product Specification 2.5.2 Fan Header Current Capability CAUTION The processor fan must be connected to the processor fan header, not to the system fan header. Connecting the processor fan to the system fan header may result in onboard component damage that will halt fan operation. -
Page 55: Thermal Considerations
Failure to ensure appropriate airflow may result in reduced performance of both the processor and/or voltage regulator or, in some instances, damage to the board. For a list of chassis that have been tested with Intel desktop boards please refer to the following website: http://www.intel.com/go/miniitx... - Page 56 Intel Desktop Board DH57JG Technical Product Specification Figure 15 shows the locations of the localized high temperature zones. Item Description Intel H57 Express Chipset Processor voltage regulator area Processor Figure 15. Localized High Temperature Zones...
-
Page 57: Thermal Considerations For Components
For processor case temperature, see processor datasheets and processor specification updates Intel H57 Express Chipset To ensure functionality and reliability, the component is specified for proper operation when Case Temperature is maintained at or below the maximum temperature listed in Table 30. -
Page 58: Reliability
Intel Desktop Board DH57JG Technical Product Specification Reliability The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Bellcore Reliability Prediction Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estimate repair rates and spare parts requirements. -
Page 59: Overview Of Bios Features
Overview of BIOS Features Introduction The board uses an Intel BIOS that is stored in a 64 Mbit (8,192 KB) Serial Peripheral Interface Flash Memory (SPI Flash) device which can be updated using a set of utilities. The SPI Flash contains the BIOS Setup program, POST, LAN EEPROM information, Plug and Play support, and other firmware. -
Page 60: Bios Setup Program Menu Bar
Intel Desktop Board DH57JG Technical Product Specification Table 33 lists the BIOS Setup program menu features. Table 33. BIOS Setup Program Menu Bar Maintenance Main Advanced Performance Security Power Boot Exit Clears Displays Configures Configures Sets Configures Selects Saves or... -
Page 61: System Management Bios (Smbios)
Overview of BIOS Features System Management BIOS (SMBIOS) SMBIOS is a Desktop Management Interface (DMI) compliant method for managing computers in a managed network. The main component of SMBIOS is the Management Information Format (MIF) database, which contains information about the computing system and its components. -
Page 62: Bios Updates
Intel Desktop Board DH57JG Technical Product Specification BIOS Updates The BIOS can be updated using either of the following utilities, which are available on the Intel World Wide Web site: ® • Intel Express BIOS Update utility, which enables automated updating while in the Windows environment. -
Page 63: Custom Splash Screen
During POST, an Intel splash screen is displayed by default. This splash screen can be augmented with a custom splash screen. The Intel Integrator’s Toolkit that is available from Intel can be used to create a custom splash screen. For information about... -
Page 64: Boot Options
Intel Desktop Board DH57JG Technical Product Specification Boot Options In the BIOS Setup program, the user can choose to boot from a hard drive, optical drive, removable drive, or the network. The default setting is for the optical drive to be the first boot device, the hard drive second, removable drive third, and the network fourth. -
Page 65: Bios Security Features
Overview of BIOS Features BIOS Security Features The BIOS includes security features that restrict access to the BIOS Setup program and who can boot the computer. A supervisor password and a user password can be set for the BIOS Setup program and for booting the computer, with the following restrictions: •... - Page 66 Intel Desktop Board DH57JG Technical Product Specification...
-
Page 67: Error Messages And Beep Codes
Error Messages and Beep Codes Speaker The board-mounted piezo speaker provides audible error code (beep code) information during POST. For information about Refer to The location of the onboard speaker Figure 1, page 11 BIOS Beep Codes Whenever a recoverable error occurs during POST, the BIOS causes the board’s piezo speaker to beep an error message describing the problem (see Table 38). -
Page 68: Front-Panel Power Led Blink Codes
Intel Desktop Board DH57JG Technical Product Specification Front-panel Power LED Blink Codes Whenever a recoverable error occurs during POST, the BIOS causes the board’s front panel power LED to blink an error message describing the problem (see Table 39). Table 39. Front-panel Power LED Blink Codes... -
Page 69: Port 80H Post Codes
Error Messages and Beep Codes Port 80h POST Codes During the POST, the BIOS generates diagnostic progress codes (POST codes) to I/O port 80h. If the POST fails, execution stops and the last POST code generated is left at port 80h. This code is useful for determining the point where an error occurred. The following tables provide information about the POST codes generated by the BIOS: •... -
Page 70: Port 80H Post Codes
Intel Desktop Board DH57JG Technical Product Specification Table 42. Port 80h POST Codes POST Code Description of POST Operation Host Processor Power-on initialization of the host processor (Boot Strap Processor) Host processor cache initialization (including APs) Starting Application processor initialization... - Page 71 Error Messages and Beep Codes Table 42. Port 80h POST Codes (continued) POST Code Description of POST Operation Keyboard (USB) Resetting keyboard Disabling keyboard Detecting presence of keyboard Enabling the keyboard Clearing keyboard input buffer Instructing keyboard controller to run Self Test (PS/2 only) Mouse (USB) Resetting mouse Disabling mouse...
- Page 72 Intel Desktop Board DH57JG Technical Product Specification Table 42. Port 80h POST Codes (continued) POST Code Description of POST Operation DXE Drivers Waiting for user input Checking password Entering BIOS setup Calling Legacy Option ROMs Runtime Phase/EFI OS Boot Entering Sleep state...
- Page 73 Error Messages and Beep Codes Table 43. Typical Port 80h POST Sequence POST Code Description Initializing a chipset component Reading SPD from memory DIMMs Detecting presence of memory DIMMs Configuring memory Testing memory Loading recovery capsule Entered DXE phase Starting application processor initialization SMM initialization Enumerating PCI busses Allocating resourced to PCI bus...
- Page 74 Intel Desktop Board DH57JG Technical Product Specification...
-
Page 75: Regulatory Compliance And Battery Disposal Information
Electromagnetic Compatibility (EMC) standards • Product certification markings 5.1.1 Safety Standards Intel Desktop Board DH57JG complies with the safety standards stated in Table 44 when correctly installed in a compatible host system. Table 44. Safety Standards Standard Title CSA/UL 60950-1, First Edition Information Technology Equipment –... -
Page 76: European Union Declaration Of Conformity Statement
European Union Declaration of Conformity Statement ® We, Intel Corporation, declare under our sole responsibility that the product Intel Desktop Board DH57JG is in conformity with all applicable essential requirements necessary for CE marking, following the provisions of the European Council Directive 2004/108/EC (EMC Directive) and 2006/95/EC (Low Voltage Directive). -
Page 77: Product Ecology Statements
恰当的重复使用处理。 请参考http://www.intel.com/intel/other/ehs/product_ecology 了解此计划的详情，包括涉及产品之范围、回收地点、运送指导、条款和条件等。 Deutsch Als Teil von Intels Engagement für den Umweltschutz hat das Unternehmen das Intel Produkt-Recyclingprogramm implementiert, das Einzelhandelskunden von Intel Markenprodukten ermöglicht, gebrauchte Produkte an ausgewählte Standorte für ordnungsgemäßes Recycling zurückzugeben. Details zu diesem Programm, einschließlich der darin eingeschlossenen Produkte, verfügbaren Standorte, Versandanweisungen, Bedingungen usw., finden Sie auf der... - Page 78 Français Dans le cadre de son engagement pour la protection de l'environnement, Intel a mis en œuvre le programme Intel Product Recycling Program (Programme de recyclage des produits Intel) pour permettre aux consommateurs de produits Intel de recycler les produits usés en les retournant à...
-
Page 79: Lead Free Desktop Board
RoHS Directive 2002/95/EC) compliant product. EU RoHS restricts the use of six materials. One of the six restricted materials is lead. This Intel Desktop Board is lead free although certain discrete components used on the board contain a small amount of lead which is necessary for component performance and/or reliability. -
Page 80: Lead-Free Board Markings
Intel Desktop Board DH57JG Technical Product Specification Table 45. Lead-Free Board Markings Description Mark Lead-Free 2 Level Interconnect: This symbol is used to identify electrical and electronic assemblies and components in which the lead (Pb) concentration level in the desktop board... -
Page 81: Emc Regulations
Regulatory Compliance and Battery Disposal Information 5.1.4 EMC Regulations Intel Desktop Board DH57JG complies with the EMC regulations stated in Table 46 when correctly installed in a compatible host system. Table 46. EMC Regulations Regulation Title FCC 47 CFR Part 15,... -
Page 82: Product Certification Markings (Board Level)
EMC requirements. You may use this equipment in residential environments and other non-residential environments. 5.1.5 Product Certification Markings (Board Level) Intel Desktop Board DH57JG has the product certification markings shown in Table 47: Table 47. Product Certification Markings Description Mark UL joint US/Canada Recognized Component mark. -
Page 83: Battery Disposal Information
Regulatory Compliance and Battery Disposal Information Battery Disposal Information CAUTION Risk of explosion if the battery is replaced with an incorrect type. Batteries should be recycled where possible. Disposal of used batteries must be in accordance with local environmental regulations. PRECAUTION Risque d'explosion si la pile usagée est remplacée par une pile de type incorrect. - Page 84 Intel Desktop Board DH57JG Technical Product Specification PRECAUCIÓN Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del fabricante.
- Page 85 Regulatory Compliance and Battery Disposal Information AWAS Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi peraturan alam sekitar tempatan. OSTRZEŻENIE Istnieje niebezpieczeństwo wybuchu w przypadku zastosowania niewłaściwego typu baterii.
- Page 86 Intel Desktop Board DH57JG Technical Product Specification...