Passive Heatsink Design In A Passive System Environment; Thermal Considerations For Components - Intel D2500CC Specification

Intel Desktop Board D2500CC Technical Product Specification
Table 32. Thermal Considerations for Components
Component
Intel Atom processor
Processor voltage regulator area
Intel NM10 Express Chipset
Memory SO-DIMM
For information about
Processor datasheets and specification updates
2.6.1 Passive Heatsink Design in a Passive System
Environment
This section highlights important guidelines and related thermal boundary conditions
for passive heatsink design in a passive system environment. Passive heatsink
describes a thermal solution without a fan attached. Passive system environment
describes a chassis with either a power supply fan or a built-in system fan.
This information should be used in conjunction with the Thermal and Mechanical
Design Guide (TMDG) published for the Intel Atom processor D2000 series. The TMDG
contains detailed package information and thermal mechanical specifications for the
processors. The TMDG also contains information on how to enable a completely fanless
design provided the right usage scenario and boundary conditions are observed for
optimal thermal design. While the TMSDG has a section on thermal design for passive
system environments (page 32), the information in this section can also be used to
complement the TMDG.
2.6.1.1 Definition of Terms
Term Description
T The measured ambient temperature locally surrounding the processor. The ambient
A
temperature should be measured just upstream of a passive heatsink.
T Processor junction temperature.
J
Ψ
Junction-to-ambient thermal characterization parameter (psi). A measure of thermal solution
JA
performance using total package power. Defined as (T
Note: Heat source must be specified for Ψ measurements.
TIM Thermal Interface Material: the thermally conductive compound between the heatsink and the
processor die surface. This material fills the air gaps and voids, and enhances the transfer of the heat
from the processor die surface to the heatsink.
TDP Thermal Design Power: a power dissipation target based on worst-case applications. Thermal
solutions should be designed to dissipate the thermal design power.
external
T The measured external ambient temperature surrounding the chassis. The external ambient
A
temperature should be measured just upstream of the chassis inlet vent.
60
Maximum Case Temperature
o
100 C
o
85 C
o
113 C
o
85 C
J
Refer to
Section 1.2, page 16
- T )/TDP.
A