1. Manuals
  2. Brands
  3. Intel Manuals
  4. Motherboard
  5. Desktop Board D2700DC
  6. Specification

Intel D2700DC Specification

Technical product specification for intel desktop board d2700dc
Hide thumbs Also See for D2700DC:
Table of Contents

Advertisement

Quick Links

Intel® Desktop Board
D2700DC
Technical Product Specification
June 2012
Part Number: G34959-002
®
The Intel
Desktop Board D2700DC may contain design defects or errors known as errata that may cause the product to deviate from published
specifications. Current characterized errata are documented in the Intel Desktop Board D2700DC Specification Update.

Advertisement

Table of Contents
loading

Related Manuals for Intel D2700DC

Summary of Contents for Intel D2700DC

  • Page 1 Part Number: G34959-002 ® The Intel Desktop Board D2700DC may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board D2700DC Specification Update.

  • Page 2: Revision History

    Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order. Intel, the Intel logo, and Intel Atom are trademarks of Intel Corporation in the U.S. and/or other countries. * Other names and brands may be claimed as the property of others.
  • Page 3 Board Identification Information Basic Desktop Board D2700DC Identification Information AA Revision BIOS Revision Notes G32420-503 MUCDT10N.86A.0047 G32420-504 MUCDT10N.86A.0067 G32420-600 MUCDT10N.86A.0067 G32420-601 MUCDT10N.86A.0067 G32420-602 MUCDT10N.86A.0069 Notes: The AA number is found on a small label on the component side of the board.
  • Page 4 Intel Desktop Board D2700DC Technical Product Specification...

  • Page 5: Intended Audience

    Intended Audience The TPS is intended to provide detailed, technical information about the Intel Desktop Board D2700DC and its components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences.
  • Page 6 Intel Desktop Board D2700DC Technical Product Specification Other Common Notation Used after a signal name to identify an active-low signal (such as USBP0#) Gigabyte (1,073,741,824 bytes) GB/s Gigabytes per second Gb/s Gigabits per second Kilobyte (1024 bytes) Kilobit (1024 bits)

  • Page 7: Table Of Contents

    1.3 Processor ..................16 ® 1.3.1 Intel D2700 Graphics Subsystem ........... 17 1.4 System Memory ................18 ® 1.5 Intel NM10 Express Chipset .............. 20 1.5.2 USB ..................21 1.5.3 SATA Support ............... 21 1.6 Real-Time Clock Subsystem ............... 22 1.7 Legacy I/O Controller ................
  • Page 8 Intel Desktop Board D2700DC Technical Product Specification 2.7 Power Consumption ................58 2.7.1 Minimum Load Configuration ........... 58 2.7.2 Maximum Load Configuration ..........58 2.8 Reliability..................59 2.9 Environmental .................. 59 3 Overview of BIOS Features 3.1 Introduction ..................61 3.2 BIOS Flash Memory Organization ............
  • Page 9 16. Front Panel Audio Header for AC ’97 Audio ........... 43 17. Front Panel USB Header ..............44 18. Front Panel USB Header with Intel Z-U130 USB Solid-State Drive or Compatible Device Support ..............44 19. Power Connector ................46...
  • Page 10 25. Minimum Load Configuration Current and Power Results ......58 26. Maximum Load Configuration Current and Power Results ....... 59 27. Intel Desktop Board D2700DC Environmental Specifications ....59 28. BIOS Setup Program Menu Bar ............62 29. BIOS Setup Program Function Keys ............ 62 30.

  • Page 11: Product Description

    Product Description Overview 1.1.1 Feature Summary Table 2 summarizes the major features of Intel Desktop Board D2700DC. Table 2. Feature Summary Form Factor Mini-ITX, (6.7 inches by 6.7 inches [170 millimeters by 170 millimeters]) compatible with microATX ® Processor Passively-cooled, soldered-down Dual-Core Intel Atom™...
  • Page 12 Intel Desktop Board D2700DC Technical Product Specification Table 2. Feature Summary (continued) ® • Intel BIOS (resident in the SPI Flash device) BIOS • Support for Advanced Configuration and Power Interface (ACPI), Plug and Play, and SMBIOS • Suspend to RAM support...

  • Page 13: Board Layout

    Product Description 1.1.2 Board Layout Figure 1 shows the location of the major components. Figure 1. Major Board Components Table 3 lists the components identified in Figure 1.

  • Page 14: Board Components Shown In Figure 1

    Front panel USB 2.0 header Front Panel Wireless Activity LED header Piezo/monotonic speaker header PCI Express Full-/Half-Mini Card slot Conventional PCI bus add-in card connector Front panel audio header Front panel USB header (supports Intel Z-U130 USB Solid- State Drive or compatible device (brown-colored)

  • Page 15: Block Diagram

    Product Description 1.1.3 Block Diagram Figure 2 is a block diagram of the major functional areas. Figure 2. Block Diagram...

  • Page 16: Online Support

    025414.htm Integration information http://www.intel.com/support/go/buildit Processor The board has a passively-cooled, soldered-down Dual-Core Intel Atom processor with integrated graphics and integrated memory controller. NOTE The board is designed to be passively cooled in a properly ventilated chassis. Chassis venting locations are recommended above the processor heatsink area for maximum heat dissipation effectiveness.

  • Page 17: Intel ® D2700 Graphics Subsystem

    ® 1.3.1 Intel D2700 Graphics Subsystem ® 1.3.1.1 Intel Graphics Media Accelerator 3650 Graphics ® Controller (Intel GMA) ® The Intel GMA 3650 graphics controller features the following: 640 MHz core frequency • • High quality texture engine  DX9.3* and OpenGL* 3.0 compliant ...

  • Page 18: System Memory

    Intel Desktop Board D2700DC Technical Product Specification System Memory The board has two 204-pin DDR3 SO-DIMM sockets and supports the following memory features: DDR3 SDRAM SO-DIMMs with gold-plated contacts • Unbuffered, single-sided or double-sided DIMMs • 4 GB maximum total system memory •...

  • Page 19: Memory Channel And So-Dimm Configuration

    Product Description Figure 3 illustrates the memory channel and SO-DIMM configuration. Figure 3. Memory Channel and SO-DIMM Configuration...

  • Page 20: Intel ® Nm10 Express Chipset

    Intel NM10 Express Chipset The Intel NM10 Express Chipset provides interfaces to the processor and the USB, SATA, LPC, LAN, PCI, and PCI Express interfaces. The Intel NM10 Express Chipset is a centralized controller for the board’s I/O paths. NOTE The board is designed to be passively cooled in a properly ventilated chassis.

  • Page 21: Usb

    UHCI- and EHCI-compatible drivers (four ports routed to the back panel and three ports routed to two front panel USB 2.0 headers). One of the front panel USB headers (brown-colored) supports an Intel Z-U130 USB Solid-State Drive or compatible device. NOTE Computer systems that have an unshielded cable attached to a USB port may not meet FCC Class B requirements, even if no device is attached to the cable.

  • Page 22: Real-Time Clock Subsystem

    Intel Desktop Board D2700DC Technical Product Specification Real-Time Clock Subsystem A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer is not plugged into a wall socket, the battery has an estimated life of three years. When the computer is plugged in, the standby current from the power supply extends the life of the battery.

  • Page 23: Lan Subsystem

    Conventional PCI bus power management •  Supports ACPI technology  Supports LAN wake capabilities 1.8.1 LAN Subsystem Drivers LAN drivers are available from Intel’s World Wide Web site. For information about Refer to Obtaining LAN drivers Section 1.2, page 16...

  • Page 24: Rj-45 Lan Connector With Integrated Leds

    Intel Desktop Board D2700DC Technical Product Specification 1.8.2 RJ-45 LAN Connector with Integrated LEDs Two LEDs are built into the RJ-45 LAN connector (shown in Figure 4). Figure 4. LAN Connector LED Locations Table 5 describes the LED states when the board is powered up and the Ethernet LAN subsystem is operating.

  • Page 25: Audio Subsystem

    The back panel audio jacks are capable of retasking according to the user’s definition, or can be automatically switched depending on the recognized device type. Front panel Intel HD Audio and AC ’97 audio support. • 3-port analog audio out stack.

  • Page 26: Audio Subsystem Software

    Intel Desktop Board D2700DC Technical Product Specification 1.9.1 Audio Subsystem Software Audio software and drivers are available from Intel’s World Wide Web site. For information about Refer to Obtaining audio software and drivers Section 1.2, page 16 1.9.2 Audio Connectors and Headers The board contains audio connectors and headers on both the back panel and the component side of the board.

  • Page 27: 1.10 Hardware Management Subsystem

    Product Description 1.10 Hardware Management Subsystem The hardware management features enable the board to be compatible with the Wired for Management (WfM) specification. The board has several hardware management features, including the following: Thermal monitoring • Voltage monitoring • 1.10.1 Hardware Monitoring The hardware monitoring and fan control subsystem is based on the Winbond W83627DHG-P device, which supports the following:...

  • Page 28: Thermal Monitoring

    Intel Desktop Board D2700DC Technical Product Specification 1.10.2 Thermal Monitoring Figure 6 shows the locations of the thermal sensors and fan header. Item Description Remote thermal sensor DTS, located on the processor die System fan header Figure 6. Thermal Sensors and Fan Header...

  • Page 29: 1.11 Power Management

    Product Description 1.11 Power Management Power management is implemented at several levels, including: Software support through Advanced Configuration and Power Interface • (ACPI) Hardware support: •  Power connector  Fan header  LAN wake capabilities  Instantly Available PC technology ...

  • Page 30: Power States And Targeted System Power

    Intel Desktop Board D2700DC Technical Product Specification 1.11.1.1 System States and Power States Under ACPI, the operating system directs all system and device power state transitions. The operating system puts devices in and out of low-power states based on user preferences and knowledge of how devices are being used by applications.

  • Page 31: Wake-Up Devices And Events

    Product Description 1.11.1.2 Wake-up Devices and Events Table 9 lists the devices or specific events that can wake the computer from specific states. Table 9. Wake-up Devices and Events Devices/events that wake up the system… …from this sleep state Note 1) Power switch S3, S4, S5 (Note 1)

  • Page 32: Hardware Support

    Intel Desktop Board D2700DC Technical Product Specification 1.11.2 Hardware Support The board provides several power management hardware features, including: Power connector • Fan header • • LAN wake capabilities • Instantly Available PC technology • Wake from USB • Power Management Event signal (PME#) wake-up support •...

  • Page 33: Instantly Available Pc Technology

    Product Description 1.11.2.3 Instantly Available PC Technology Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-to- RAM) sleep-state. While in the S3 sleep-state, the computer will appear to be off (the hard drive(s) and fan will power off, the front panel LED will blink). When signaled by a wake-up device or event, the system quickly returns to its last known state.

  • Page 34: Location Of The Standby Power Indicator Led

    Intel Desktop Board D2700DC Technical Product Specification 1.11.2.7 +5 V Standby Power Indicator LED The +5 V standby power indicator LED shows that power is still present even when the computer appears to be off. Figure 7 shows the location of the standby power indicator LED.

  • Page 35: Technical Reference

    Technical Reference Memory Map 2.1.1 Addressable Memory The board utilizes 4 GB of addressable system memory. Typically the address space that is allocated for Conventional PCI bus add-in cards, PCI Express configuration space, BIOS (SPI Flash), and chipset overhead resides above the top of DRAM (total system memory).

  • Page 36: Detailed System Memory Address Map

    Intel Desktop Board D2700DC Technical Product Specification The amount of installed memory that can be used will vary based on add-in cards and BIOS settings. Figure 8 shows a schematic of the system memory map. All installed system memory can be used when there is no overlap of system addresses.

  • Page 37: System Memory Map

    Technical Reference Table 10 lists the system memory map. Table 10. System Memory Map Address Range Address Range (decimal) (hex) Size Description 1024 K - 4194304 K 100000 - FFFFFFFF 4095 MB Extended memory 960 K - 1024 K F0000 - FFFFF 64 KB Runtime BIOS 896 K - 960 K...

  • Page 38: Connectors And Headers

    Intel Desktop Board D2700DC Technical Product Specification Connectors and Headers CAUTION Only the following connectors/headers have overcurrent protection: Back panel and front panel USB. The other internal connectors/headers are not overcurrent protected and should connect only to devices inside the computer’s chassis, such as fans and internal peripherals.

  • Page 39: Back Panel

    Technical Reference 2.2.1 Back Panel 2.2.1.1 Back Panel Connectors Figure 9 shows the location of the back panel connectors. Item Description S/PDIF digital audio out (optical) HDMI port DVI-D port USB ports LAN port USB ports Line in Line out Mic in Figure 9.

  • Page 40: I/O Shield Reference Diagram

    Intel Desktop Board D2700DC Technical Product Specification 2.2.1.2 I/O Shield The I/O shield provided with the board allows access to all back panel connectors and is compatible with standard mini-ITX and microATX chassis. As an added benefit for system configurations with wireless PCI Express Mini Card solutions, the I/O shield also provides pre-cut holes for user installation of up to three external wireless antennas.

  • Page 41: Component-Side Connectors And Headers

    Technical Reference 2.2.2 Component-side Connectors and Headers Figure 11 shows the locations of the component-side connectors and headers. Figure 11. Component-side Connectors and Headers...

  • Page 42: Component-Side Connectors And Headers Shown In Figure 11

    Front panel USB 2.0 header Front panel wireless activity LED header Piezo/monotonic speaker header PCI Express Full-/Half-Mini Card slot Conventional PCI bus add-in card connector Front panel audio header Front panel USB header supports Intel Z-U130 USB Solid-State Drive or compatible device (brown-colored)

  • Page 43: System Fan Header

    Ground Ground Table 14. Front Panel Wireless Activity LED Header Signal Name Ground MINICARD_WLAN# Table 15. Front Panel Audio Header for Intel HD Audio Signal Name Signal Name [Port 1] Left channel Ground [Port 1] Right channel PRESENCE# (Dongle present)

  • Page 44: Front Panel Usb Header

    Signal Name +5 VDC +5 VDC Ground Ground KEY (no pin) No Connect Table 18. Front Panel USB Header with Intel Z-U130 USB Solid-State Drive or Compatible Device Support Signal Name Signal Name +5 VDC Ground KEY (no pin) LED#...

  • Page 45: Add-In Card Connectors

    Technical Reference 2.2.2.2 Add-in Card Connectors The board has the following add-in card connectors: • PCI Express Full-/Half-Mini Card slot Conventional PCI bus connector (with riser card support for up to two PCI • cards) Note the following considerations for the Conventional PCI bus connector: •...

  • Page 46: Power Connector

    Intel Desktop Board D2700DC Technical Product Specification 2.2.2.3 Power Supply Connector The board has a 2 x 12 power connector (see Table 19). This board requires a TFX12V or SFX12V power supply. Table 19. Power Connector Signal Name Signal Name +3.3 V...

  • Page 47: Connection Diagram For Front Panel Header

    Technical Reference 2.2.2.4 Front Panel Header This section describes the functions of the front panel header. Table 20 lists the signal names of the front panel header. Figure 12 is a connection diagram for the front panel header. Table 20. Front Panel Header Signal Description Signal...

  • Page 48: States For A One-Color Power Led

    Intel Desktop Board D2700DC Technical Product Specification 2.2.2.4.1 Hard Drive Activity LED Header Pins 1 and 3 can be connected to an LED to provide a visual indicator that data is being read from or written to a hard drive.

  • Page 49: Connection Diagram For Front Panel Usb Header

    Use only a front panel USB connector that conforms to the USB 2.0 • specification for high-speed USB devices. Figure 13. Connection Diagram for Front Panel USB Header Figure 14. Connection Diagram for Front Panel USB Header with Intel Z-USB Solid-State Drive or Compatible Device Support...

  • Page 50: Bios Configuration Jumper Block

    Intel Desktop Board D2700DC Technical Product Specification BIOS Configuration Jumper Block CAUTION Do not move the jumper with the power on. Always turn off the power and unplug the power cord from the computer before changing a jumper setting. Otherwise, the board could be damaged.

  • Page 51: Bios Configuration Jumper Settings

    Technical Reference Table 22. BIOS Configuration Jumper Settings Jumper Function/Mode Setting Configuration Normal The BIOS uses current configuration information and passwords for booting. Configure After the POST runs, Setup runs automatically. The maintenance menu is displayed. Recovery None The BIOS attempts to recover the BIOS configuration. See Section 3.7 for more information on BIOS recovery.

  • Page 52: Mechanical Considerations

    Intel Desktop Board D2700DC Technical Product Specification Mechanical Considerations 2.4.1 Form Factor The board is designed to fit into a mini-ITX or microATX form-factor chassis. Figure 16 illustrates the mechanical form factor for the board. Dimensions are given in inches [millimeters].

  • Page 53: Electrical Considerations

    Failure to ensure appropriate airflow may result in reduced performance of both the processor and/or voltage regulator or, in some instances, damage to the board. For a list of chassis that have been tested with Intel Desktop Boards please refer to the following website: http://www3.intel.com/cd/channel/reseller/asmo-na/eng/tech_reference/53211.htm...

  • Page 54: Localized High Temperature Zones

    Intel Desktop Board D2700DC Technical Product Specification CAUTION Ensure that proper airflow is maintained in the processor voltage regulator circuit. Failure to do so may result in damage to the voltage regulator circuit. The processor voltage regulator area (shown in Figure 17) can reach a temperature of up to 85 C in an open chassis.

  • Page 55: Passive Heatsink Design In A Passive System Environment

    This information should be used in conjunction with the Thermal and Mechanical Design Guide (TMDG) published for the Intel Atom processor D2000 series. The TMDG contains detailed package information and thermal mechanical specifications for the processors.

  • Page 56: Chassis Design Guideline

    Intel Desktop Board D2700DC Technical Product Specification 2.6.1.2 Thermal Specifications Guideline Terms Requirements ≤ 50 °C ≤ 100 °C Ψ ≤ 3.85 °C/W Honeywell PCM45F 10 W external ≤ 35 °C 2.6.1.3 Heatsink Design Guideline (Note) Maximum heatsink size 87 x 52 x 29 mm Heatsink mass ≤...

  • Page 57: Fan Location Guide For Chassis Selection (Chassis Orientation Is Not Restricted)

    Technical Reference Figure 18. Fan Location Guide for Chassis Selection (Chassis Orientation is Not Restricted) For all chassis configurations, the heatsink performance parameter, Ψ should be less than 3.85 °C/W. The detail thermal measurement metrology is described in the TMSDG. For chassis that fail to meet the thermal specifications guideline highlighted above, an actively cooled heatsink solution should be used.

  • Page 58: Power Consumption

     Load: DVD playback 3.5-inch SATA hard disk drive, running Microsoft Windows Vista Home Basic •  Load: continuous read/write benchmark Intel Z-U130 USB Solid-State Drive or compatible device on the USB flash • drive header  Load: continuous read/write benchmark Wireless card on PCI Express Full-/Half-Mini Card slot, connected via •...

  • Page 59: Reliability

    Method I Case 1 50% electrical stress, 55 ºC ambient. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF data was calculated from predicted data at 55 ºC. The Intel Desktop Board D2700DC has an MTBF of at least 394,528 hours.
  • Page 60 Intel Desktop Board D2700DC Technical Product Specification...

  • Page 61: Overview Of Bios Features

    Overview of BIOS Features Introduction The board uses an Intel BIOS that is stored in the Serial Peripheral Interface Flash Memory (SPI Flash) and can be updated using a disk-based program. The SPI Flash contains the BIOS Setup program, POST, the PCI auto-configuration utility, LAN EEPROM information, and Plug and Play support.

  • Page 62: Bios Flash Memory Organization

    Intel Desktop Board D2700DC Technical Product Specification Table 28 lists the BIOS Setup program menu features. Table 28. BIOS Setup Program Menu Bar Maintenance Main Advanced Security Power Boot Exit Clears Displays Configures Sets Configures Selects boot Saves or passwords and...

  • Page 63: System Management Bios (Smbios)

    Overview of BIOS Features System Management BIOS (SMBIOS) SMBIOS is a Desktop Management Interface (DMI) compliant method for managing computers in a managed network. The main component of SMBIOS is the Management Information Format (MIF) database, which contains information about the computing system and its components.

  • Page 64: Legacy Usb Support

    Legacy USB support from the BIOS is no longer used. 7. Additional USB legacy feature options can be accessed by using Intel Integrator Toolkit. To install an operating system that supports USB, verify that Legacy USB support in the BIOS Setup program is set to Enabled and follow the operating system’s...

  • Page 65: Bios Updates

    Overview of BIOS Features BIOS Updates The BIOS can be updated using either of the following utilities, which are available on the Intel World Wide Web site: ® Intel Express BIOS Update utility, which enables automated updating while • in the Windows environment. Using this utility, the BIOS can be updated from a file on a hard disk, a USB drive (a flash drive or a USB drive), or an optical drive.

  • Page 66: Custom Splash Screen

    Integrator’s Toolkit that is available from Intel can be used to create a custom splash screen. NOTE If you add a custom splash screen, it will share space with the Intel branded logo. Refer to For information about Intel Integrator Toolkit http://developer.intel.com/design/motherbd/software/itk/...

  • Page 67: Booting Without Attached Devices

    Overview of BIOS Features 3.7.3 Booting Without Attached Devices For use in embedded applications, the BIOS has been designed so that after passing the POST, the operating system loader is invoked even if the following devices are not present: Video adapter •...

  • Page 68: Bios Security Features

    Intel Desktop Board D2700DC Technical Product Specification BIOS Security Features The BIOS includes security features that restrict access to the BIOS Setup program and who can boot the computer. A supervisor password and a user password can be set for the BIOS Setup program and for booting the computer, with the following...

  • Page 69: Board Status And Error Messages

    Board Status and Error Messages BIOS Beep Codes The BIOS uses audible beep codes to signal status messages and error messages indicating recoverable errors that occur during the POST. The beep codes are listed in Table 33. These beep codes can be heard through a speaker attached to the board’s line out audio jack (see Figure 5, B on page 26).

  • Page 70: Front-Panel Power Led Blink Codes

    Intel Desktop Board D2700DC Technical Product Specification Front-panel Power LED Blink Codes Whenever a recoverable error occurs during POST, the BIOS causes the board’s front panel power LED to blink an error message describing the problem (see Table 34). Table 34. Front-panel Power LED Blink Codes...

  • Page 71: Port 80H Post Codes

    Board Status and Error Messages Port 80h POST Codes During the POST, the BIOS generates diagnostic progress codes (POST codes) to I/O port 80h. If the POST fails, execution stops and the last POST code generated is left at port 80h. This code is useful for determining the point where an error occurred. Displaying the POST codes requires a PCI bus add-in card, often called a POST card.

  • Page 72: Port 80H Post Codes

    Intel Desktop Board D2700DC Technical Product Specification Table 37. Port 80h POST Codes Port 80 Code Progress Code Enumeration ACPI S States 0x00,0x01,0x02,0x03,0x04,0x05 Entering S0, S2, S3, S4, or S5 state 0x10,0x20,0x30 Resuming from S2, S3, S4, or S5 state...
  • Page 73 Board Status and Error Messages Table 37. Port 80h POST Codes (continued) Port 80 Code Progress Code Enumeration CPU DXE Phase 0x47 CPU DXE Phase begin 0x48 Refresh memory space attributes according to MTRRs 0x49 Load the microcode if needed 0x4A Initialize strings to HII database 0x4B...
  • Page 74 Intel Desktop Board D2700DC Technical Product Specification Table 37. Port 80h POST Codes (continued) Port 80 Code Progress Code Enumeration Keyboard (PS/2 or USB) 0x90 Resetting keyboard 0x91 Disabling the keyboard 0x92 Detecting the presence of the keyboard 0x93 Enabling the keyboard...

  • Page 75: Typical Port 80H Post Sequence

    Board Status and Error Messages Table 38. Typical Port 80h POST Sequence POST Code Description Detecting presence of memory DIMMs Configuring memory Testing memory Loading recovery capsule Entered DXE phase Enumerating PCI buses Allocating resourced to PCI bus Detecting the presence of the keyboard Resetting keyboard Clearing keyboard input buffer Keyboard Self Test...
  • Page 76 Intel Desktop Board D2700DC Technical Product Specification...

  • Page 77: Regulatory Compliance And Battery Disposal Information

    Electromagnetic Compatibility (EMC) standards • Product certification markings • 5.1.1 Safety Standards Intel Desktop Board D2700DC complies with the safety standards stated in Table 39 when correctly installed in a compatible host system. Table 39. Safety Standards Standard Title CSA/UL 60950-1 Information Technology Equipment –...

  • Page 78: European Union Declaration Of Conformity Statement

    European Union Declaration of Conformity Statement ® We, Intel Corporation, declare under our sole responsibility that the product Intel Desktop Board D2700DC is in conformity with all applicable essential requirements necessary for CE marking, following the provisions of the European Council Directive 2004/108/EC (EMC Directive), 2006/95/EC (Low Voltage Directive), and 2002/95/EC (ROHS Directive).

  • Page 79: Product Ecology Statements

    当的重复使用处理。 请参考http://www.intel.com/intel/other/ehs/product_ecology 了解此计划的详情，包括涉及产品之范围、回收地点、运送指导、条款和条件等。 Deutsch Als Teil von Intels Engagement für den Umweltschutz hat das Unternehmen das Intel Produkt-Recyclingprogramm implementiert, das Einzelhandelskunden von Intel Markenprodukten ermöglicht, gebrauchte Produkte an ausgewählte Standorte für ordnungsgemäßes Recycling zurückzugeben. Details zu diesem Programm, einschließlich der darin eingeschlossenen Produkte, verfügbaren Standorte, Versandanweisungen, Bedingungen usw., finden Sie auf der...
  • Page 80 Français Dans le cadre de son engagement pour la protection de l'environnement, Intel a mis en œuvre le programme Intel Product Recycling Program (Programme de recyclage des produits Intel) pour permettre aux consommateurs de produits Intel de recycler les produits usés en les retournant à...

  • Page 81: Emc Regulations

    şartlar v.s dahil bütün ayrıntılarını ögrenmek için lütfen http://www.intel.com/intel/other/ehs/product_ecology Web sayfasına gidin. 5.1.4 EMC Regulations Intel Desktop Board D2700DC complies with the EMC regulations stated in Table 40 when correctly installed in a compatible host system. Table 40. EMC Regulations Regulation Title...
  • Page 82 Consult the dealer or an experienced radio/TV technician for help. • Any changes or modifications to the equipment not expressly approved by Intel Corporation could void the user’s authority to operate the equipment. Tested to comply with FCC standards for home or office use.
  • Page 83 Regulatory Compliance and Battery Disposal Information Japan VCCI Statement Japan VCCI Statement translation: This is a Class B product based on the standard of the Voluntary Control Council for Interference from Information Technology Equipment (VCCI). If this is used near a radio or television receiver in a domestic environment, it may cause radio interference.

  • Page 84: Energy Star* 5.0, E-Standby, And Erp Compliance

    Intel Desktop Board D2700DC Technical Product Specification 5.1.5 ENERGY STAR* 5.0, e-Standby, and ErP Compliance Intel Desktop Board D2700DC meets the ENERGY STAR requirements listed in Table 41 when used in corresponding system configurations. Table 41. ENERGY STAR Requirements Typical...

  • Page 85: Regulatory Compliance Marks (Board Level)

    Regulatory Compliance and Battery Disposal Information 5.1.6 Regulatory Compliance Marks (Board Level) Intel Desktop Board D2700DC has the regulatory compliance marks shown in Table 42. Table 42. Regulatory Compliance Marks Description Mark UL joint US/Canada Recognized Component mark. Includes adjacent UL file number for Intel Desktop Boards: E210882.

  • Page 86: Battery Disposal Information

    Intel Desktop Board D2700DC Technical Product Specification Battery Disposal Information CAUTION Risk of explosion if the battery is replaced with an incorrect type. Batteries should be recycled where possible. Disposal of used batteries must be in accordance with local environmental regulations.
  • Page 87 Regulatory Compliance and Battery Disposal Information PRECAUCIÓN Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del fabricante.
  • Page 88 Intel Desktop Board D2700DC Technical Product Specification AWAS Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi peraturan alam sekitar tempatan. OSTRZEŻENIE Istnieje niebezpieczeństwo wybuchu w przypadku zastosowania niewłaściwego typu baterii.
  • Page 89 Regulatory Compliance and Battery Disposal Information...
  • Page 90 Intel Desktop Board D2700DC Technical Product Specification...

Table of Contents