Intel VC820 - Desktop Board Motherboard Design Manual page 197

8 7
MCH Decoupling
D
VCC1_8 VCC1_8
0.1UF
0.1UF
0.01UF
0.01UF
0.01UF
Place these caps on solder side
0.01UF
VDDQ
0.1UF
C
0.1UF
For chipset decoupling, use 0.1UF and
0.01UF decoupling capacitor at each
Place these caps on solder side
corner of the device. If there is room,
add 0.01UF capacitors in the middle
of each quad.
VDDQ
0.01UF
0.01UF
B
0.01UF
0.01UF
0.01UF
0.01UF
A
Place VDDQ capacitors within
70 mils of outer balls of MCH.
8 7
6 5
Decoupling
ICH Decoupling
VCC3_3
0.1UF
0.1UF
0.1UF
0.1UF
0.1UF
0.1UF
0.1UF
0.1UF
0.01UF
0.01UF
0.01UF
0.01UF
0.01UF
0.01UF
SN74LVC08A
SN74LVC08A
VCC3_3SBY
U14
VCC
9 8
GND
SN74LVC07A
U14
VCC
11 10
GND
SN74LVC07A
6 5
4
82559 Decoupling.
VCC3_3SBY VCC2_5SBY
0.1UF
0.1UF
0.1UF
0.1UF
4.7UF
4.7UF
Place 100uF caps, 0.1 ohm ESR, among RIMM connectors.
Un-used Gates
VCC3_3SBY VCC3_3SBY
14
U15
U3
14 11 10
9
8
10
7
74LVC14A
7
14
U15
13 12
U3
14
12
11
7
13
74LVC14A
7
VCC3_3SBY
VCC5SBY
U20 14
VCC
9 8
U18
74LS132 GND
14 VCC 7
1
SN74LVC06A
3
2
7 GND
U20 14
VCC
11 10
GND
7
SN74LVC06A
U18
74LS132
14 VCC
12
11
13
U20 14
VCC
7 GND 13 12
GND
7
SN74LVC06A
4
3 2
RIMM Decoupling
VCC2_5SBY VCMOS1_8SBY
100UF 100UF 0.1UF
100UF 100UF 0.1UF
100UF 100UF 0.1UF
100UF 100UF
0.1UF 0.1UF
Place a VCMOS1_8SBY 0.1uF cap at each RIMM.
0.1UF
VCC3_3
U19
VCC
3 4
GND
SN74LVC07A
U19
VCC
11 10
GND
SN74LVC07A
U19
VCC
13 12
GND
SN74LVC07A
TITLE: INTEL(R) 820 CHIPSET CUSTOMER REFERENCE BOARD
DECOUPLING
DRAWN BY:
PCD PLATFORM DESIGN
R
1900 PRAIRIE CITY ROAD
LAST REVISED:
FOLSOM, CALIFORNIA 95630
3 2
1
D
C
B
A
REV:
1.01
PROJECT:
SHEET:
11-30-1999_10:26 34 OF 36
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