Thermal Considerations For Components - Intel BLKDH61WWB3 Technical Product Specification

Figure 15 shows the locations of the localized high temperature zones.
Figure 15. Localized High Temperature Zones
Table 28 provides maximum case temperatures for the components that are sensitive
to thermal changes. The operating temperature, current load, or operating frequency
could affect case temperatures. Maximum case temperatures are important when
considering proper airflow to cool the board.
Table 28. Thermal Considerations for Components
Component
Processor
Intel H61 Express Chipset
For information about
Processor datasheets and specification updates
Item Description
A Processor voltage regulator area
B Processor
C Intel H61 Express Chipset
Maximum Case Temperature
For processor case temperature, see processor datasheets and
processor specification updates
o
111 C (under bias)
Technical Reference
Refer to
Section 1.3, page 16
57