Reliability; Thermal Considerations For Components - Intel BLKDG41KR Specification

Table 28 provides maximum case temperatures for the board components that are
sensitive to thermal changes. The operating temperature, current load, or operating
frequency could affect case temperatures. Maximum case temperatures are important
when considering proper airflow to cool the board.
Table 28. Thermal Considerations for Components
Component
Processor
Intel 82G41 GMCH
Intel 82801GB (ICH7)
For information about
Processor datasheets and specification updates
2.7

Reliability

The Mean Time Between Failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The calculation is based on the Bellcore Reliability
Prediction Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF
prediction is used to estimate repair rates and spare parts requirements.
The MTBF data is calculated from predicted data at 55 ºC. The Intel Desktop Board
DG41KR MTBF is 161,465 hours.
Maximum Case Temperature
For processor case temperature, see processor datasheets and
processor specification updates
o
102 C (under bias)
o
108 C (under bias)
Technical Reference
Refer to
Section 1.2, page 14
59